ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems最新文献

{"title":"Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters","authors":"R. L. Amalfi, T. Salamon, Filippo Cataldo, J. Marcinichen, J. Thome","doi":"10.1115/ipack2020-2542","DOIUrl":"https://doi.org/10.1115/ipack2020-2542","url":null,"abstract":"\u0000 The present study is focused on the experimental characterization of two-phase heat transfer performance and pressure drops within an ultra-compact heat exchanger (UCHE) suitable for electronics cooling applications. In this specific work, the UCHE prototype is anticipated to be a critical component for realizing a new passive two-phase cooling technology for high-power server racks, as it is more compact and lighter weight than conventional heat exchangers. This technology makes use of a novel combination of thermosyphon loops, at the server-level and rack-level, to passively cool an entire rack. In the proposed two-phase cooling technology, a smaller form factor UCHE is used to transfer heat from the server-level thermosyphon cooling loop to the rack-level thermosyphon cooling loop, while a larger form factor UCHE is used to reject the total heat from the server rack into the facility-level cooling loop. The UCHE is composed of a double-side-copper finned plate enclosed in a stainless steel enclosure. The geometry of the fins and channels on both sides are optimized to enhance the heat transfer performance and flow stability, while minimizing the pressure drops. These features make the UCHE the ideal component for thermosyphon cooling systems, where low pressure drops are required to achieve high passive flow circulation rates and thus achieve high critical heat flux values. The UCHE’s thermal-hydraulic performance is first evaluated in a pump-driven system at the Laboratory of Heat and Mass Transfer (LTCM-EPFL), where experiments include many configurations and operating conditions. Then, the UCHE is installed and tested as the condenser of a thermosyphon loop that rejects heat to a pumped refrigerant system at Nokia Bell Labs, in which both sides operate with refrigerants in phase change (condensation-to-boiling). Experimental results demonstrate high thermal performance with a maximum heat dissipation density of 5455 (kW/m3/K), which is significantly larger than conventional air-cooled heat exchangers and liquid-cooled small pressing depth brazed plate heat exchangers. Finally, a thermal performance analysis is presented that provides guidelines in terms of heat density dissipations at the server- and rack-level when using passive two-phase cooling.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129875754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging","authors":"P. Lall, M. Saha, J. Suhling, K. Blecker","doi":"10.1115/ipack2020-2659","DOIUrl":"https://doi.org/10.1115/ipack2020-2659","url":null,"abstract":"\u0000 Electronic parts in military, automotive, avionics and space applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. Parts may be stored in non-climate-controlled enclosures prior to deployment. Earlier studies on undoped SAC alloys have shown that the material properties evolve after prolonged period of storage at even modest temperatures. In order to mitigate the aging effects, a number of alloy formulation have been proposed. Data of the mechanical properties of lead-free solder alloys which is used for interconnection in the electronic packaging at high strain rates and at high storage temperature is very essential for design optimization of electronic package sustainability at extreme temperature environment because the SAC solders have shown to have degradation in mechanical properties at prolonged exposure to storage temperature. Industries have come up with a solution to reduce the degradation using dopants in SAC solder. In this study, a doped SAC solder called SAC-R has been subjected to high strain rate testing after extended storage at temperature of 50°C for 1 month, 2 months and 3 months. Samples with no aging and aged samples for up to 3-months have been subjected to uniaxial tensile tests to measure the mechanical properties of SAC-R for High and Low operating temperature ranging from −65°C to +200°C. The material data has been used to compute the constants for the Anand Visco-Plasticity model. The ability of the model to represent the material constitutive behavior has been quantified by comparing the model predictions of the uniaxial tensile test with the experimental data.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126843120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Comparative Study of Effective Cooling in Microchannel Heat Sinks (MCHS) With Nanofluid and Hydrophobic Nanostructures Using Computational Fluid Dynamics","authors":"D. Jennings, Sonya T. Smith","doi":"10.1115/ipack2020-2527","DOIUrl":"https://doi.org/10.1115/ipack2020-2527","url":null,"abstract":"\u0000 The goal of this research is to present an analytical model of nanostructures and study the effects of their geometry on the performance of micro channels. The pressure drop experienced by micro channels is of interest as it presents a limit on forced convection heat transfer. This work will demonstrate how the presence of nanostructures primarily affects pressure drop as well as other cooling flow characteristics. Additional work in the impact of microchannel cross-sectional geometry and friction factor formulation is provided as well. Multiple transient analyses were performed in ANSYS FLUENT to ascertain performance characteristics of microchannels without the presence of hydrophobic nanostructures. The results were compared to the analytical model developed in this study.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131038965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications","authors":"Qianyi Wu, Chi Zhang, M. Asheghi, K. Goodson","doi":"10.1115/ipack2020-2603","DOIUrl":"https://doi.org/10.1115/ipack2020-2603","url":null,"abstract":"\u0000 Capillary-fed boiling in microporous copper inverse opals (CIOs) is capable of removing an excess of 1 kW/cm2 at 10–15 °C superheat over small wicking distances ∼ 200 μm. In order to remove heat from large area chips (> 1 cm2), longer capillary wicking distance is desired to reduce the manufacturing complexity of the 3D manifold for liquid delivery and vapor extraction. In this study, we propose graded copper inverse opals (g-CIOs) where smaller pores at the bottom provide high capillary pressure for liquid delivery, while larger pores at the top reduce viscous pressure drop for vapor extraction. This nonhomogeneous wicking material decouples the permeability and capillary pressure in the vertical and lateral directions, resulting in greater CHFs and capillary wicking distances. In this study, we demonstrate the feasibility of fabricating g-CIOs material with up to three different pore diameters (2 μm, 5 μm, and 10 μm) using a multi-step template sintering and copper electrodeposition process. We then leverage and expand upon a well-calibrated experimental model for the prediction of CHF in monoporous CIOs to map the performance metrics for g-CIOs. The model combines a hydraulic resistance network with Darcy’s law and accounts for the nonhomogeneous permeabilities in lateral and vertical directions. Using this model, we study the impact of total wick thickness and graded pore-size combinations on the critical heat fluxes and wicking distances. Our modeling results conclude that a two-layer g-CIOs can potentially reach ∼70% enhancement in the critical heat flux or ∼30% enhancement in the wicking length compared to monoporous CIOs of the same thickness. Our fabrication capability and preliminary modeling results offer the opportunity to design boiling tests with optimized g-CIOs and exploring the potential of dissipating high heat flux for large area cooling applications.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128384955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition","authors":"P. Lall, Hye-Yoen Jang, C. Hill, Libby Creel","doi":"10.1115/ipack2020-2644","DOIUrl":"https://doi.org/10.1115/ipack2020-2644","url":null,"abstract":"\u0000 Wearable electronics need a number of desirable attributes, such as being compact, flexible, and lightweight. Prior studies on reliability testing have examined the relationship between a flexible electronic and repetitive human body motions (i.e., stretching, bending, twisting, and folding). Such mechanical loads can cause fatigue failure in a wearable electronic. In regard to a wearable band, fatigue failure can be influenced by folding stress. This research study involved the assessment of wearable biometric bands that were calibrated and examined by a test device for folding reliability. The wearable band combines a biometric sensor unit, a micro-controller unit with a wireless connection, and a printed thermistor unit. The sensors have been calibrated by actual temperature and biometric signals. Furthermore, the folding test was conducted utilizing multiple boards. Due to multiple components and printed lines of the PCB, optical images were taken in order to confirm which parts failed and the reasons for the failures. An FEM analysis was conducted in order to understand how stress impacts the PCB and which parts are stressed during the folding process. Throughout the process, an equation was developed to predict the number of cycles necessary for reaching fatigue failure. Throughout this study, the fatigue failure analysis on folding reliability of the wearable biometric band was conducted using experimental analysis, microscopy analysis, and simulating analysis. The study provided further knowledge about the fatigue failure mechanism, which resulted from the prediction of fatigue life developed from the PCB.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133091757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging","authors":"Jing Wu, M. Alam, KM Rafidh Hassan, J. Suhling, P. Lall","doi":"10.1115/ipack2020-2695","DOIUrl":"https://doi.org/10.1115/ipack2020-2695","url":null,"abstract":"\u0000 Microstructural evolution occurs in lead free Sn-Ag-Cu (SAC) solder joints exposed to isothermal aging. Such changes lead to degradations in the mechanical properties and creep behavior of the solder, and can result in dramatic reductions in the board level reliability of lead-free electronic assemblies subjected to aging. In our recent research, Scanning Electron Microscopy (SEM) has been used to: (1) monitor aging induced microstructural changes occurring within fixed regions in selected lead-free solder joints, (2) create time-lapse imagery of the microstructure evolution, and (3) analyze the microstructural changes quantitatively and correlate to the observed mechanical behavior evolution. This approach has removed the limitations of many prior studies where aged and non-aged microstructures were taken from two different samples and could only be qualitatively compared.\u0000 In our current study, the microstructural evolutions were observed in SAC305 (96.5Sn-3.0Ag-0.5Cu) and SAC_Q (SAC+Bi) exposed to isothermal conditions at T = 100 °C and 125 °C for several different regions from several different joints. The microstructures in several fixed regions of interest were recorded after predetermined time intervals of aging, which were 1 hour (up to 270 hours) and 250 hours (up to 7000 hours) for the long-term aging samples. The aging induced changes in microstructure have been correlated with the changes in mechanical behavior measured using uniaxial tensile testing.\u0000 The area and diameter of each IMC particle were tracked during the aging process using the recorded images and imaging processing software. As expected, the analysis of the evolving SAC305 and SAC+X microstructures showed a significant amount of diffusion of silver and bismuth in the beta-tin matrix during aging. In particular, Ag3Sn particles coalesced during aging leading to a decrease in the number of particles. Any bismuth in the SAC+X microstructure was observed to quickly go into solution, resulting in solid solution strengthening. This primary occurred within the beta-Sn dendrites, but also in the Ag3Sn intermetallic rich regions between dendrites. The presence of bismuth in was also found to slow the diffusion process that coarsens the Ag3Sn IMC particles. The combination solid solution strengthening and a lower diffusion rate for Ag lead to reduced aging effects in the SAC+Bi alloy relative to the SAC305 solder alloy.\u0000 The SAC_Q alloy was found to have significantly better high temperature mechanical properties relative to SAC305 at all prior aging conditions. In particular, the initial modulus and ultimate tensile strength of SAC305 experienced large degradations during high temperature aging, whereas the same properties of SAC_Q changed only slightly. These changes in mechanical behavior correlated well with the observed increases in the average IMC particle diameter and decreases in the number of IMC particles. The microstructural and material property degradations were es","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127949809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model","authors":"Mitsuaki Kato, T. Omori, A. Goryu, T. Fumikura, K. Hirohata","doi":"10.1115/ipack2020-2556","DOIUrl":"https://doi.org/10.1115/ipack2020-2556","url":null,"abstract":"\u0000 Power modules are being developed with the aim of increasing power output. Achieving this aim requires increased current density in power modules. However, at high current densities, power modules can degrade as a result of electromigration, which is a phenomenon where atoms move due to momentum transfer between conducting electrons and metal atoms. In addition, atoms are also moved by mechanical stress gradients and temperature gradients, so it is necessary to consider the combined effects of electrical, thermal, and mechanical stress.\u0000 This report describes an electromigration analysis of solder joints for power modules. First, we validated our numerical implementation and showed that it could reproduce the distributions of vacancy concentrations and hydrostatic stress that were almost the same as those in previous studies. We then describe the effects of electromigration in a single solder joint. Due to the appearance of plastic and creep strains, the rate of increase in vacancy concentration was very slow and inelastic strain grew at an increasing rate. This result indicates that inelastic properties may strongly affect electromigration-induced degradation. Next, we present results for the solder joint with a SiC device and substrate. A current crowding appeared at the edge of the solder joint, and a vacancy concentration gradient was generated in not only the thickness direction but also the longitudinal direction. The absolute value of vacancy concentration increased significantly at the edge and did not reach a steady state even after a long time. These results indicate that peripheral components may strongly affect the electromigration-induced degradation. In addition, we modeled the behavior of metal atoms passing through the interface of the solder joint and simulated the growth of the intermetallic layer by electromigration.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126079048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading","authors":"Abdullah Fahim, Kamrul Hasan, J. Suhling, P. Lall","doi":"10.1115/ipack2020-2655","DOIUrl":"https://doi.org/10.1115/ipack2020-2655","url":null,"abstract":"\u0000 Electronic packages are frequently exposed to a thermal cycling environment in real life applications. Particularly, the plastic ball grid array (PBGA) is one of the most widely used electronic package, and consists of various component materials, e.g. solder joint, silicon die, die attachment adhesive, mold compound, solder mask, etc. All of these materials play a significant role on the reliability of the overall package. Failure under creep deformation is one of the significant failure mode for electronic packages. Hence, it is important to study their creep behavior and evolution under the thermal cycling environment. These changes must be evaluated in order to understand and predict their failure behavior due to creep damage in operation.\u0000 In our previous study, evolution of mechanical properties of SAC305 solder joints in a PBGA package up to 250 thermal cycles was evaluated using the nanoindentation technique. In this work, nanoindentation technique was utilized to understand the evolution of creep behavior of the SAC305 solder joint, die attachment adhesive, silicon die, and solder mask material for various durations of thermal cycling. Test specimens were first prepared by cross sectioning a PBGA package to reveal the different materials, followed by surface polishing to facilitate SEM imaging and nanoindentation testing. After preparation, the package samples were thermally cycled from T = −40 to 125 °C in an environmental chamber. At various points in the cycling (e.g. after 0, 50, 100, 250 and 500 cycles), the package was taken out from the chamber, and nanoindentation was performed on above mentioned materials to obtain creep behavior at room temperature (25 °C). From the nanoindentation test data, it was found that creep deformation of SAC305 increased upto 500 cycles. Die attachment and solder mask materials showed initial decrease in creep deformation up to 250 cycles and then increased value at 500 cycles. As expected, the silicon die material does not show any significant change in creep deformation behavior upto 500 cycles.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121515415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"CFD Modeling of the Distribution of Airborne Particulate Contaminants Inside Data Center Hardware","authors":"S. Saini, Kaustubh Adsul, Pardeep Shahi, Amirreza Niazmand, Pratik V. Bansode, D. Agonafer","doi":"10.1115/ipack2020-2590","DOIUrl":"https://doi.org/10.1115/ipack2020-2590","url":null,"abstract":"\u0000 Modern-day data center administrators are finding it increasingly difficult to lower the costs incurred in mechanical cooling of their IT equipment. This is especially true for high-performance computing facilities like Artificial Intelligence, Bitcoin Mining, and Deep Learning, etc. Airside Economization or free air cooling has been out there as a technology for a long time now to reduce the mechanical cooling costs. In free air cooling, under favorable ambient conditions of temperature and humidity, outside air can be used for cooling the IT equipment. In doing so, the IT equipment is exposed to sub-micron particulate/gaseous contaminants that might enter the data center facility with the cooling airflow.\u0000 The present investigation uses a computational approach to model the airflow paths of particulate contaminants entering inside the IT equipment using a commercially available CFD code. A Discrete Phase Particle modeling approach is chosen to calculate trajectories of the dispersed contaminants. Standard RANS approach is used to model the airflow in the airflow and the particles are superimposed on the flow field by the CFD solver using Lagrangian particle tracking. The server geometry was modeled in 2-D with a combination of rectangular and cylindrical obstructions. This was done to comprehend the effect of change in the obstruction type and aspect ratio on particle distribution. Identifying such discrete areas of contaminant proliferation based on concentration fields due to changing geometries will help with the mitigation of particulate contamination related failures in data centers.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122127220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor","authors":"Sebastien Sequeira, K. Bennion, J. Cousineau, S. Narumanchi, G. Moreno, Satish Kumar, Y. Joshi","doi":"10.1115/ipack2020-2550","DOIUrl":"https://doi.org/10.1115/ipack2020-2550","url":null,"abstract":"\u0000 One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal management, a multi-physics modeling framework that is able to accurately predict the behavior of the motor, while being computationally efficient, is essential. This paper first presents a detailed validation of a Lumped Parameter Thermal Network (LPTN) model of an Internal Permanent Magnet (IPM) synchronous motor within the commercially available Motor-CAD® modeling environment. The IPM motor’s stator is studied at steady state, and winding losses are generated by a constant DC current. The validation is based on temperature comparison with experimental data and with more detailed Finite Element Analysis (FEA). All critical input parameters of the LPTN are considered in detail for each layer of the stator, especially the contact resistances between the impregnation, liner, laminations and housing. Finally, a sensitivity analysis for each of the critical input parameters is provided. A maximum difference of 4% — for the highest temperature in the slot windings and the end windings — was found between the LPTN and the experimental data. Comparing the results from the LPTN and the FEA model, the maximum difference was 2% for the highest temperature in the slot windings and end windings. As for the LTPN sensitivity analysis, the thermal parameter with the highest sensitivity was found to be the liner-to-lamination contact resistance. The latter is often ignored in the literature, whereas its impact on temperature rise was found to be more significant than any other contact resistance within the stator.","PeriodicalId":199024,"journal":{"name":"ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134634683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}