Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Q. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-seong Park, Y. Won
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Abstract

Atomic layer deposition (ALD) is effective in depositing conformal thin films, which is highly favorable for coating various patterned surfaces. These coatings serve as barrier layers in addition to surface modifications to improve wettability of porous structures, such as meshes and membrane channels. However, it has been challenging to conformally deposit hydrophilic thin films on three-dimensionally (3D) designed, more complicated architectures. To understand the effect of surface modifications on 3D structures’ surface properties, we deposit thin silica films via ALD on hydrophobic porous media, which is nickel inverse opal structures in this case. The silica thin film is used to improve hydrophilicity without modifying the geometries of the microporous structure such as porosity, pore size, and metal type. We study the consequences of applying silica coatings to the 3D structure in comparison to flat surface counterpart. The hydrophilicity effects of ALD coating on porous structures and flat nickel surfaces are approximately the same with a result of decreasing apparent static contact angle of approximately 30°. In relation, the Fowkes method reveals the surface energy of the ALD silica samples increases by a factor of 1.3. Thermal stability of the coating is tested, revealing a relative degradation with increasing thermal cycling, most likely associated with the adsorption species on the thin film surface. The droplet spreading rate is analyzed in addition to droplet volume loss to estimate the liquid penetration rate into the structure, if any. Condensation rate and condensate growth show that despite having lower droplet nucleation in comparison to a flat surface, the droplet area growth on inverse opal regions is larger. These findings showcase potential improvements to 3D microporous structures by employing ALD coating for fluid transport through the porous media.
三维结构材料的原子层沉积表面工程
原子层沉积(ALD)是一种有效的共形薄膜沉积方法,它非常有利于各种图案表面的涂覆。除了表面修饰外,这些涂层还可以作为屏障层来改善多孔结构(如网状结构和膜通道)的润湿性。然而,在三维(3D)设计的更复杂的结构上保形沉积亲水薄膜一直是一个挑战。为了了解表面修饰对3D结构表面性能的影响,我们通过ALD在疏水多孔介质上沉积了薄的二氧化硅薄膜,在这种情况下是镍反蛋白石结构。二氧化硅薄膜用于改善亲水性,而不改变微孔结构的几何形状,如孔隙率、孔径和金属类型。我们研究了将二氧化硅涂层应用于3D结构的后果,与平面对应。ALD涂层对多孔结构和平坦镍表面的亲水性基本相同,其表观静态接触角减小约30°。相比之下,Fowkes方法显示ALD二氧化硅样品的表面能增加了1.3倍。对涂层的热稳定性进行了测试,揭示了随着热循环的增加,涂层的相对降解,这很可能与薄膜表面的吸附物质有关。除了液滴体积损失外,还分析了液滴的扩散速率,以估计液体对结构的渗透速率(如果有的话)。凝结速率和凝结物生长表明,尽管液滴成核率低于平面,但反蛋白石区域的液滴面积增长更大。这些发现表明,利用ALD涂层在多孔介质中进行流体输送,有可能改善3D微孔结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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