多孔介质法在流形微通道换热器中单相流动和传热模拟中的应用

Fabio Battaglia, R. Mandel, A. Shooshtari, M. Ohadi
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引用次数: 0

摘要

在电子冷却、干式冷却和高温热交换器等不同领域,多种微通道已被证明可以加强热管理。歧管-微通道使用歧管系统将微沟槽表面划分为一个歧管系统,从而减少压降,并通过利用发展的流动模式增加传热。因此,设计多管汇-微通道换热器需要对多管汇和微通道进行设计。在某些情况下,顺序设计方法(首先设计微通道,然后设计歧管)足以满足问题陈述的要求。当代应用的要求越来越高,要求多种微通道设计不断发展并变得更加复杂。特别是,必须减小歧管的体积和螺距。减少流形的体积会导致更高的流动不均匀分布,而预测不均匀分布如何影响传热速率的能力至关重要。同样地,减少歧管的节距增加了固体中轴向传导的效果,并且理解对传热的影响是重要的。为了达到这些目的,本研究展示了多孔介质在流形微通道中单相流动的方法,与完整的3D模拟相比,该方法可以用更小的计算需求来预测压降、不均匀分布、轴向传导和传热率,同时保证了非常相似的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers
Manifold Microchannels have been proven to enhance thermal management in different fields, such as electronic cooling, dry cooling, and high temperature heat exchangers. Manifold-microchannels use a system of manifolds to divide a microgrooved surface into a system of manifolds, thereby reducing pressure drop and increasing heat transfer by utilizing the developing flow regime. Because of this, design of a manifold-microchannel heat exchanger requires the design of the manifold and microchannel. In some situations, a sequential design approach, where one first designs the microchannel and then the manifold — is sufficient to meet the requirements of the problem statements. The more demanding requirements of contemporary applications require manifold microchannel design to evolve and become more complex. In particular, reducing the volume and pitch of the manifold has become necessary. Reducing the volume of the manifold results in a higher flow maldistribution, and the ability to predict how maldistribution affects heat transfer rate is critical. Similarly, reducing the pitch of the manifold increases the effect of axial conduction in the solid, and understanding the effect on heat transfer is important. To those ends, this work shows a porous medium approach for single-phase flow in manifold microchannel, which allows to predict pressure drop, maldistribution, axial conduction, and heat transfer rate with a much smaller computational demand when compared to a full 3D simulation, while guaranteeing very similar results.
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