2018 7th Electronic System-Integration Technology Conference (ESTC)最新文献_第3页

Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology 基于TSV技术的白光用荧光粉陶瓷转换器LED模组的晶圆级密封封装

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546361

K. Zoschke, Y. Eichhammer, H. Oppermann, C. Manier, M. Dijk, C. Weber, M. Hutter

{"title":"Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology","authors":"K. Zoschke, Y. Eichhammer, H. Oppermann, C. Manier, M. Dijk, C. Weber, M. Hutter","doi":"10.1109/ESTC.2018.8546361","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546361","url":null,"abstract":"In this work we present the development of a new hermetic wafer level packaging approach for fabrication of white light LEDs with suspended phosphor ceramic converter. In this new architecture, the ceramic converter is not directly attached to the LED chip but part of the package and is arranged with a defined distance to the LED. This enables the heat generated by the light conversion to be dissipated directly via the ceramic converter into the package instead of through the LED itself. The packaging approach relies on through silicon via (TSV) based silicon interposer wafers which are wafer to wafer bonded to silicon frame wafers using AuSn seal rings to form cavity wafers. The frame wafers have through cavities with sloped mirroring side walls to enable an optimal reflection of light out of the cavities and thus a high light efficiency of the mounted LEDs.The LEDs are bonded into the cavities onto the silicon interposer which feeds the electrical contacts to its back side. The cavities with the mounted LEDs are subsequently sealed with the phosphor converter ceramics. The created LED modules are assembled to test boards were the thermal resistance of the package was determined and compared with simulation results.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124211496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Thermal Characterization of Endogenously Heated Printed Circuit Boards with Embedded Resistive Layers 嵌入式电阻层内热印刷电路板的热特性研究

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546404

D. Seehase, Arne Neiser, Fred Lange, A. Novikov, M. Nowottnick

引用次数: 1

Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties 铜模压烧结浆料:烧结和粘合性能

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546455

D. Ishikawa, H. Nakako, Yuki Kawana, Chie Sugama, Motohiro Negishi, Y. Ejiri, Suguru Ueda, B. An, H. Wurst, B. Leyrer, T. Blank, Marc Weber

{"title":"Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties","authors":"D. Ishikawa, H. Nakako, Yuki Kawana, Chie Sugama, Motohiro Negishi, Y. Ejiri, Suguru Ueda, B. An, H. Wurst, B. Leyrer, T. Blank, Marc Weber","doi":"10.1109/ESTC.2018.8546455","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546455","url":null,"abstract":"this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressure less in 100% H2 or under pressure in 100% N2 atmospheres. The as-sintered density, thermal conductivity and resistivity of pressure less-sintered Cu (in 100% H2, 300 °C, 1 h) is found to be 7S%, 180 Wm^-1K^-1 and 4.3 $muOmegacdot cm$, respectively. The pressurelesssintered Cu has higher 0.2% proof stress than the pressure-sintered Ag (sintered density =87%, in air, 300 °C 10 MPa, 10min) as a comparison material in a three-point bending test. The die-shear strength of appropriate pressurelesssintered Cu on four different metal adherends (Cu, Ni, Ag and Au) was 30 MPa or higher. The die-shear strength of pressure- sintered Cu in 100% N2 was 36 MPa or higher. A thermal cycle tolerance of 1000 cycles or greater was shown in a power device test package which was bonded using the pressurelesssintered Cu and encapsulated with an epoxy molding compound. The Cu sinter paste can be used as a reliable die-bonding material for power modules operating at high temperatures.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125877692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Electrical modeling approach and manufacturing of a new adjustable capacitor for medical applications 一种新型医用可调电容器的电气建模方法及制造

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546508

Zaineb Jebri, I. B. Majek, C. Delafosse, Y. Ousten

{"title":"Electrical modeling approach and manufacturing of a new adjustable capacitor for medical applications","authors":"Zaineb Jebri, I. B. Majek, C. Delafosse, Y. Ousten","doi":"10.1109/ESTC.2018.8546508","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546508","url":null,"abstract":"An adjustable capacitor generally consists in a stator and a rotor. The stator is made of the dielectric tube and the fixed electrode which is affixed in the outer. The rotor is the conductive body that acts as the variable electrode, and it moves axially in the housing. Furthermore, this entire structure is held together with a combination of screws, clips, soldering and other connection mechanisms. As a composed component, manufacturing time and cost increase. These capacitors are made for sharp domains that require their own conditions. These constraints need additional steps in the manufacturing process and increase the percentage of device failures, so this also drives down the profitability of the process.In order to create a new range of non-magnetic trimmers (adjustable capacitors) more performant to meet the Nuclear magnetic resonance (NMR) requirements, as MRI (Magnetic Resonance Imaging) applications, electrical modeling is an important step to improve empirical research results so to provide a high level of quality and to reduce manufacturing time and cost while.In this context ANSYS is used to design innovative electromechanical devices, simulate electrostatic performance of the component and then estimate a large number of trimmer parameters (material properties, capacitance value, breakdown voltage) and anticipate critical electrical effects (corona, point and edge effects).","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125939386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Accelerated Vibrational Fatigue Testing of Thin Aluminum and Copper Films at Different Temperatures 不同温度下铝和铜薄膜的加速振动疲劳试验

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546488

V. Osipova, B. Wunderle, J. Arnold, J. Heilmann, T. Mahanta

引用次数: 5

Novel Pre-applied Under-fill Material Specialized for Multiple Die Bonding Process 专门用于多模粘合工艺的新型预应用下填充材料

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546397

Masashi Okaniwa, Takenori Takiguchi, Kohei Higashiguchi, Takahito Sekido, K. Ihara, Tsuyoshi Kida, Shuuji Yoshida, T. Oshima

{"title":"Novel Pre-applied Under-fill Material Specialized for Multiple Die Bonding Process","authors":"Masashi Okaniwa, Takenori Takiguchi, Kohei Higashiguchi, Takahito Sekido, K. Ihara, Tsuyoshi Kida, Shuuji Yoshida, T. Oshima","doi":"10.1109/ESTC.2018.8546397","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546397","url":null,"abstract":"TCB (Thermal Compression Bonding) process with NCF (Non Conductive Film) is expected as an effective solution for fine pitch applications brought by the progress of IoT (Internet of Things), however the production volume is limited to small level because of its expensive assembly cost. To mitigate the cost impact, some multiple die bonding methods are being introduced by many players. So far, several NCFs were evaluated for these bonding processes, unfortunately, it is becoming clear that approaches coupled with conventional thermosetting resin compositions are very difficult to achieve required process-ability of the bonding processes due to miss-match between reactivity of the resins and process conditions. That is why the new type of pre-applied under-fill material specialized for multiple die bonding process was desired in the market and has been developed in this study. The developed NCF was designed to survive long time thermal exposure on a bonding stage of TCB bonder so that multiple die bonding such as collective bonding could be successfully performed with enough process margin. To achieve the target specifications, this study has started with the design of new resin composition applied to the developed NCF. Finally, TCB was demonstrated with the developed NCF and it was confirmed that reliable solder joints were formed and no abnormality was observed even after 180mins thermal exposure at 130degC on the bonding stage. Moreover, the developed NCF showed good insulation reliability in HAST. The final reliability tests on package level are ongoing and the results will be visible in no time.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132463246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Ultrafast miniaturized pulsed electron gun for timeresolved surface measurements 用于时间分辨表面测量的超快小型化脉冲电子枪

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546393

D. Epp, G. Storeck, S. Vogelgesang, M. Sivis, S. Schafer, C. Ropers

引用次数: 0

Textile-Integrated Stretchable Structures for Wearable Wireless Platforms 可穿戴无线平台的纺织集成可拉伸结构

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546490

Han He, Xiaochen Chen, O. Mokhtari, H. Nishikawa, L. Ukkonen, J. Virkki

引用次数: 1

Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality 铜-银细间距互连:加工条件对互连质量的影响

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546413

Steffen Bickel, Shawon Sen, Jörg Meyer, I. Panchenko, M. Wolf

引用次数: 5

3D Multilayered Ceramics – harsh environment interposer technologies expand into 3rd dimension 三维多层陶瓷-恶劣环境中间层技术扩展到三维空间

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/estc.2018.8546387

S. Ziesche, C. Lenz, Axel Mueller-Koehn, U. Scheithauer, U. Partsch

引用次数: 0