2018 7th Electronic System-Integration Technology Conference (ESTC)最新文献_第4页

Anisotropic Conductive Film (ACF) bonding: effect of interfaces on contact resistance 各向异性导电膜(ACF)键合:界面对接触电阻的影响

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546414

Giang M. Nghiem, K. Aasmundtveit, H. Kristiansen, M. Bazilchuk

引用次数: 2

Modified CNTs for NO2 detection 用于检测NO2的改性CNTs

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546501

J. Štulík, T. Blecha

引用次数: 0

High throughput R2R printing, testing and assembly processing of flexible RGB LED displays 柔性RGB LED显示屏的高通量R2R打印，测试和组装加工

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546465

K. Keränen, P. Korhonen, T. Happonen, Mikko Paakkolanvaara, Jouni Kangas, K. Rönkä

{"title":"High throughput R2R printing, testing and assembly processing of flexible RGB LED displays","authors":"K. Keränen, P. Korhonen, T. Happonen, Mikko Paakkolanvaara, Jouni Kangas, K. Rönkä","doi":"10.1109/ESTC.2018.8546465","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546465","url":null,"abstract":"This paper introduces high throughput processing of hybrid flexible RGB LED displays. Processing consists of conductive tracks printing on PET substrate, verification of printed substrate quality by specific characterization equipment and assembly of individually addressable RGB LEDs on substrate using adhesive bonding process. High throughput in manufacturing of flexible displays is achieved utilizing roll-to-roll processes in all steps of the manufacturing process. Utilization of seamless printing tool doubled printing process throughput compared to traditional printing process requiring two printing tools and steps. Implemented roll-to-roll automated electrical test equipment enabled high throughput testing and verification of printed substrate web functionality. Testing was a very important step to verify that printed wiring on the web fulfilled quality requirements for the assembly process. Required SMD components electrically bonded on substrate with R2R assembly machine by utilizing Isotropic Conductive Adhesive (ICA). In addition, Non-Conductive Adhesive (NCA) utilized to provide mechanical support of component, when flexible system bended to smaller than 20 mm radius. Dispensing process noticed to be the most time consuming process in flexible LED display manufacturing, when numerous adhesive dots applied on the substrate. In order to increase throughput in manufacturing, decrease of time used in dispensing process needed. Throughput increase by a factor of ten was possible to achieve by utilizing high speed dispensing process. Increase of more dispenser units in the dispensing process furthermore increase achievable throughput in the manufacturing process. Two meter long flexible display system demonstrator was designed, manufactured and tested based on processed flexible display element.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133273679","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Packaging of Ultrathin Flexible Magnetic Field Sensors with thin Silicon and Polyimide Interposer 用薄硅和聚酰亚胺中间体封装超薄柔性磁场传感器

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546463

D. Ernst, M. Wild, T. Zerna

{"title":"Packaging of Ultrathin Flexible Magnetic Field Sensors with thin Silicon and Polyimide Interposer","authors":"D. Ernst, M. Wild, T. Zerna","doi":"10.1109/ESTC.2018.8546463","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546463","url":null,"abstract":"Ultrathin sensors are used in a wide range of applications. In the current work an ultrathin sensor for Active Magnetic Bearings (AMB) has to be realized. Previous studies show very good results by the use of thin silicon interposer with a thickness of $50 mu mathrm{m}[1][4]$. With this technology sensor packages thinner than $150 mu mathrm{m}$ have been already realized. First results with thin polyimide interposer are shown in [3]. With this approach the thickness can be reduced down to less than $100 mu mathrm{m}$ in total.With a focus on improving the long-term reliability the process was optimized within the present work. Therefore the metallization of the sensor and the substrate were investigated. On sensor side the chosen material for interconnecting is gold with different thicknesses of 100 nm and 200 nm. On substrate side bare copper is compared with deposited NiAu on that copper. To evaluate the reliability of the sensor packages several test specimen were manufactured. These test specimen were aged afterwards in a temperature shock test (-20 °C, +85 °C; 15 minutes dwell time). As expected, the test specimen with an additional NiAu layer show lower failure rate after aging until 3400 cycles compared to the bare copper. But, there are still early failures before 100 cycles for any substrate-sensor-combination of some 5 %.As an alternative interconnecting technology soldering with SnAgBi solder paste was investigated as well. Therefore sensor dies with a bismuth layer were prepared and soldered onto test specimen. First results promise that this technology is able to be a proper alternative to Flip Chip interconnecting.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"51 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132934143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Integration with Light 与光集成

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546477

G. Arutinov, M. Giesbers, S. V. W. V. Doorn, F. Chiappini, R. Kusters, J. V. D. Brand

引用次数: 18

Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading 热、机械循环载荷下电子封装中铜线键的寿命研究

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546466

A. Mazloum-Nejadari, M. Lederer, G. Khatibi, B. Czerny, L. Weiss, J. Nicolics

引用次数: 2

Thermographic inspection method for quality assessment of power semiconductors in the manufacture of power electronics modules 电力电子模块制造中功率半导体质量评定的热成像检验方法

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546435

M. Schaulin, M. Oppermann, T. Zerna

引用次数: 5

Status and review of advanced mixed-mode bending fracture test (AMB) 先进混合模弯曲断裂试验(AMB)的现状与展望

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546410

M. Schulz, J. Keller, C. Vernier, M. Dressler, B. Wunderle

{"title":"Status and review of advanced mixed-mode bending fracture test (AMB)","authors":"M. Schulz, J. Keller, C. Vernier, M. Dressler, B. Wunderle","doi":"10.1109/ESTC.2018.8546410","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546410","url":null,"abstract":"In this paper a review of the latest research on interfacial fracture mechanical properties is given, while using the Advanced Mixed-mode Bending fracture test (AMB). The reviewed studies confirm that the AMB is a fast and accurate test method, which uses the least amount of samples and generates a wide bandwidth of mode-mix-dependent critical energy release rates. The maximum reported mode-mix bandwidth is 115° while testing only three samples. The so-far tested interfaces are built by materials commonly used in products of the microelectronic and automotive electronics industries. These material combinations are epoxy based molding compound on copper lead frame, molding compound on printed circuit boards and thermoset-based adhesive attached to a low temperature co-fired ceramic (LTCC). Further, the latest status of the current used crack length determination method is given. Combining two approaches into a new method enables the usage of images for the crack tip detection in the experimental post processing. This method is predestined for a future automatization, but is also restricted to a certain quality of the specimen surface, like the contrast and focus of the recorded parts. Nevertheless, an exemplification is given and the results are discussed.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129592371","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

ESTC 2018 Ad Page ESTC 2018广告页

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/estc.2018.8546348

引用次数: 0

Non-destructive Characterisation of Flexible Type Material using a White Light Interferometer 用白光干涉仪对柔性材料进行无损表征

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546381

Chiu Soon Wong, Sze Yee Tan, Changlong Tan

{"title":"Non-destructive Characterisation of Flexible Type Material using a White Light Interferometer","authors":"Chiu Soon Wong, Sze Yee Tan, Changlong Tan","doi":"10.1109/ESTC.2018.8546381","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546381","url":null,"abstract":"One of the key factors which can cause to a halt of a surface-mount-technology (SMT) assembly process is due to the broken cover tape. Under such circumstances, the quality of the cover tape will need to be re-evaluated and confirmed by failure analysis, in particularly, the thickness of the cover tape. For the characterisation of flexible type material like cover tape, caliper, physical cross-section and optical techniques are some of the commonly used conventional techniques. However, destructive sample preparations are usually needed for these techniques, and the characterisation of the sample is confined to a very small region per sample preparation, therefore make them non-ideal. Profilometer is a more advanced technique that has been used widely in various applications but it has found to be not compatible for studying cover tape. In this work, we study the feasibility of using an interferometer in characterising the flexible type material through the investigation of various types of cover tapes from semiconductor industry. Results have demonstrated and verified that interferometer is a very promising technique in characterising flexible type material. This technique has enabled the characterisation of the material in 3-dimensional to an accuracy of <0.5 um non-destructively in a short amount of time as compared to the conventional techniques.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128666405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0