G. Arutinov, M. Giesbers, S. V. W. V. Doorn, F. Chiappini, R. Kusters, J. V. D. Brand
{"title":"与光集成","authors":"G. Arutinov, M. Giesbers, S. V. W. V. Doorn, F. Chiappini, R. Kusters, J. V. D. Brand","doi":"10.1109/ESTC.2018.8546477","DOIUrl":null,"url":null,"abstract":"This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on microbumps formed with conventional Sn–Ag–Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Integration with Light\",\"authors\":\"G. Arutinov, M. Giesbers, S. V. W. V. Doorn, F. Chiappini, R. Kusters, J. V. D. Brand\",\"doi\":\"10.1109/ESTC.2018.8546477\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on microbumps formed with conventional Sn–Ag–Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials.\",\"PeriodicalId\":198238,\"journal\":{\"name\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2018.8546477\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546477","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on microbumps formed with conventional Sn–Ag–Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials.
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