Status and review of advanced mixed-mode bending fracture test (AMB)

Abstract

In this paper a review of the latest research on interfacial fracture mechanical properties is given, while using the Advanced Mixed-mode Bending fracture test (AMB). The reviewed studies confirm that the AMB is a fast and accurate test method, which uses the least amount of samples and generates a wide bandwidth of mode-mix-dependent critical energy release rates. The maximum reported mode-mix bandwidth is 115° while testing only three samples. The so-far tested interfaces are built by materials commonly used in products of the microelectronic and automotive electronics industries. These material combinations are epoxy based molding compound on copper lead frame, molding compound on printed circuit boards and thermoset-based adhesive attached to a low temperature co-fired ceramic (LTCC). Further, the latest status of the current used crack length determination method is given. Combining two approaches into a new method enables the usage of images for the crack tip detection in the experimental post processing. This method is predestined for a future automatization, but is also restricted to a certain quality of the specimen surface, like the contrast and focus of the recorded parts. Nevertheless, an exemplification is given and the results are discussed.