2018 7th Electronic System-Integration Technology Conference (ESTC)最新文献_第2页

Chip/Package/Board Co-Simulation Methodology for Crosstalk between DC/DC Converter and ADC Input Channels DC/DC变换器和ADC输入通道串扰的芯片/封装/板联合仿真方法

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546338

Francesco Settino, T. Brandtner, V. Subotskaya, Antonio Levanto, M. Faricelli, F. Praemassing, Luca Della Ricca, Harald Koffler, P. Palestri, F. Crupi

引用次数: 2

Interfacial reaction of Sn-Ag-Cu-Ni solder/Cu joints by laser process 激光加工Sn-Ag-Cu-Ni焊料/Cu接头的界面反应

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546406

H. Nishikawa, Ryo Matsunobu

{"title":"Interfacial reaction of Sn-Ag-Cu-Ni solder/Cu joints by laser process","authors":"H. Nishikawa, Ryo Matsunobu","doi":"10.1109/ESTC.2018.8546406","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546406","url":null,"abstract":"With the miniaturization of electronic productions and the use of heat sensitive electronic components,the traditional reflow soldering often has difficulties. As an alternativesoldering process, a laser reflow process has been recently proposed and a laser process has been introduced into the industry for practical use because of its unique properties such as localized and noncontact heating, rapid rise and fall in temperature, and ease of automation and robotization. However, there has been limited discussion for the basic phenomena and performance of the joints heated by this laser process. In this study, Sn-3.0 mass%Ag-0.5 mass% Cu solder and Sn-3.0 mass%Ag-0.5 Cu-0.1Ni solder balls with a diameter of 0.76 mm were used. Cu pads that had a thickness of 35 $mu$m and a diameter of 0.6 mm and were used as the substrate. The interfacial reaction between a Ni added solder and a Cu pad heated by laser process and the microstructure of soldered joint after heating and after isothermal aging was investigated. In the as-heated condition, a quite thin IMC layer was formed at the interface and Ni element was included in the IMC in the case of the laser process. It was found that the growth of Cu3 Sn layer between the Cu pad and Cu6 Sn5 layer during isothermal aging was suppressed in the case of Sn-Ag-Cu-Ni solder.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116202793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions 在封装解决方案中实现新系统最快上市时间的自动化虚拟样机

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546352

G. Gadhiya, Birgit Brämer, S. Rzepka

引用次数: 2

Printed Flexible FE Memory Array Testing System 印刷柔性FE存储器阵列测试系统

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546339

Shoude Chang, Yanguang Zhang, Badrou-Réda Aich, Ye Tao

引用次数: 0

Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling 热循环下微凹凸互连中β-Sn晶粒择优生长与热力学响应的相互作用

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546386

S. Liang, Xin-Ping Zhang, C. Wei, C. Ke, Changqing Liu

{"title":"Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling","authors":"S. Liang, Xin-Ping Zhang, C. Wei, C. Ke, Changqing Liu","doi":"10.1109/ESTC.2018.8546386","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546386","url":null,"abstract":"orientations of β-Sn grains have a big influence on the thermo-mechanical behavior of the microbump interconnect due to the obvious anisotropic features of thermal expansion coefficient (CTE) and elastic stiffness of β-Sn, especially with the dramatic decrease in the feature size of 3D ICs in electronics. Simultaneously, the elastic energy, induced by the deformation of grains with different orientations, can affect the grain morphology evolution during thermal cycling. Thus, some new concerns of reliability of the microbump interconnect are emerging due to the anisotropic behavior. In this study, dynamic evolution of grain morphology of the Cu/Sn/Cu microbump interconnect during thermal cycling is simulated using the phase field model, which incorporates the effects of temperature and elastic deformation energy in the grains induced by the thermal stress. The influence of the elastic and CTE anisotropy of β-Sn on the thermo-mechanical behavior of microbump interconnects with different grain morphologies is investigated, and the interaction effects of grain morphology evolution and thermo-mechanical behavior in the microbump interconnect are studied, with focus on the variations of the average diameter and average von Mises stress of β-Sn grains with different orientations in the solder of the microbump interconnect.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132059851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Defect-Free Dicing for Higher Device Reliability 无缺陷切割，提高设备可靠性

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546448

C. Johnston, F. Piallat

引用次数: 2

Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics 电力电子用银烧结接头的热-机械测量方法

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546403

R. Metasch, K. Meier, M. Roellig

引用次数: 3

Reliability Considerations in Discrete Optics External Cavity Tunable Laser Assemblies 离散光学外腔可调谐激光器组件的可靠性考虑

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546434

M. C. Ubaldi

引用次数: 0

Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems 基于柔性传感器系统自适应布局的低应力聚合物箔多芯片贴片

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/estc.2018.8546380

B. Albrecht, G. Alavi, Mourad Elsobky, S. Ferwana, U. Passlack, C. Harendt, J. Burghartz

引用次数: 9

Investigating the Fine Microstructure of Mn-doped SnAgCu Solder Alloys by Selective Electrochemical Etching 选择性电化学蚀刻法研究mn掺杂SnAgCu钎料合金的微观结构

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI: 10.1109/ESTC.2018.8546411

O. Krammer, T. Hurtony

{"title":"Investigating the Fine Microstructure of Mn-doped SnAgCu Solder Alloys by Selective Electrochemical Etching","authors":"O. Krammer, T. Hurtony","doi":"10.1109/ESTC.2018.8546411","DOIUrl":"https://doi.org/10.1109/ESTC.2018.8546411","url":null,"abstract":"In our research the fine microstructure was compared between manganese-doped SnAgCuand traditional SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys. The composition of the manganese-doped alloys was (Sn/Ag0.3/Cu0.7/Mn-x), where x is 0.1, 0.4, 0.7% wt%Solder bumps were prepared on FR4 testboards with reflow soldering technology. After the soldering, cross-sections of the samples were prepared and were investigated by Scanning Electron Microscopy. Backscattered Electrons detector was utilised and EDX (energy-dispersive Xray spectroscopy) analysis were performed. Samples were etched with selective electrochemical etching in order to reveal the fine microstructure of the samples prepared from the conventional and from manganese-doped SAC alloys. It was found that precipitates with relatively high Mn formed in the solder joint, which can influence the mechanical properties of the solder bulk. The manganese altered the formation of Cu-Sn intermetallic compounds, which were formed in very sharp, needle-like structures Additionally, particle-type Ag3 Sn intermetallic compounds readily formed next to the Mn precipitates; they are not distributed uniformly in the solder bulk at all.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115744417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2