{"title":"在封装解决方案中实现新系统最快上市时间的自动化虚拟样机","authors":"G. Gadhiya, Birgit Brämer, S. Rzepka","doi":"10.1109/ESTC.2018.8546352","DOIUrl":null,"url":null,"abstract":"A modular system of parametric FE models is created using ANSYS parametric design language (APDL) for automated virtual prototyping of current and future System-inPackage (SiP) solutions based on fan-out-wafer-level-packaging (FOWLP) technologies. The principles of the hierarchical architecture are described and instructive examples are given for all levels, i.e., from the part models to the four demonstrator packages. Further, the results of first simulations addressing the typical load case of temperature cycling between - 40 °C and 125 °C clearly demonstrate the validity of the approach as they agree to the experimental finding. The system of models is now applicable to a large variety of future SiP products based on FOWLP. It will allow virtual prototyping, i.e., replace time consuming experimental tests during the product definition phase.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":"519 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions\",\"authors\":\"G. Gadhiya, Birgit Brämer, S. Rzepka\",\"doi\":\"10.1109/ESTC.2018.8546352\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A modular system of parametric FE models is created using ANSYS parametric design language (APDL) for automated virtual prototyping of current and future System-inPackage (SiP) solutions based on fan-out-wafer-level-packaging (FOWLP) technologies. The principles of the hierarchical architecture are described and instructive examples are given for all levels, i.e., from the part models to the four demonstrator packages. Further, the results of first simulations addressing the typical load case of temperature cycling between - 40 °C and 125 °C clearly demonstrate the validity of the approach as they agree to the experimental finding. The system of models is now applicable to a large variety of future SiP products based on FOWLP. It will allow virtual prototyping, i.e., replace time consuming experimental tests during the product definition phase.\",\"PeriodicalId\":198238,\"journal\":{\"name\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"volume\":\"519 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2018.8546352\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions
A modular system of parametric FE models is created using ANSYS parametric design language (APDL) for automated virtual prototyping of current and future System-inPackage (SiP) solutions based on fan-out-wafer-level-packaging (FOWLP) technologies. The principles of the hierarchical architecture are described and instructive examples are given for all levels, i.e., from the part models to the four demonstrator packages. Further, the results of first simulations addressing the typical load case of temperature cycling between - 40 °C and 125 °C clearly demonstrate the validity of the approach as they agree to the experimental finding. The system of models is now applicable to a large variety of future SiP products based on FOWLP. It will allow virtual prototyping, i.e., replace time consuming experimental tests during the product definition phase.
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