Francesco Settino, T. Brandtner, V. Subotskaya, Antonio Levanto, M. Faricelli, F. Praemassing, Luca Della Ricca, Harald Koffler, P. Palestri, F. Crupi
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Chip/Package/Board Co-Simulation Methodology for Crosstalk between DC/DC Converter and ADC Input Channels
In this paper a co-design methodology is proposed to investigate the crosstalk at package-level between the DC/DC converter and the sensitive analog-to-digital converter (ADC) analog input channels of a micro-controller for automotive applications. System-level simulations validated against measurement data confirm that the loop mutual inductance can be used to identify potential crosstalk issue via package nets coupling. Furthermore, a simulation approach at different levels of abstraction is proposed to estimate the rms-noise performance of the ADC when the DC/DC converter is enabled.
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