Defect-Free Dicing for Higher Device Reliability

Abstract

As new technology application devices are relied upon for our safety, security, ease of life and wellbeing, the reliability of such devices is imperative. Devices with unfailing performance are critical to create trustworthy and smarter solutions. The adoption of these devices to “out-of-the-box” applications brings new packaging challenges as devices must withstand and perform in a wide range of physical and environmental conditions. By a virtuous circle, dependence on these solutions will grow as they are increasingly trusted upon for our health, safety, security and to improve our way of life.