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TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)最新文献

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Hardness detection using a micromachined active tactile sensor 使用微机械主动触觉传感器进行硬度检测
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215627
Y. Hasegawa, T. Shimizu, T. Miyaji, M. Shikida, H. Sasaki, K. Sato, K. Itoigawa
{"title":"Hardness detection using a micromachined active tactile sensor","authors":"Y. Hasegawa, T. Shimizu, T. Miyaji, M. Shikida, H. Sasaki, K. Sato, K. Itoigawa","doi":"10.1109/SENSOR.2003.1215627","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215627","url":null,"abstract":"We developed a new type of micromachined tactile sensor that detects both the contact force and hardness of an object. It consists of a diaphragm with a mesa structure, a piezo-resistive strain sensor on the diaphragm, and a chamber for pneumatic actuation. We theoretically designed the device specifications to detect humanfinger touch. We developed the fabrication process of the device using micromachining technology. The sensor element measures 6.0 mm /spl times/ 6.0 mm /spl times/ 0.4 mm. We experimentally evaluated the device characteristics by using silicone rubbers with different hardnesses as the model materials, and we verified the hardness detection performance. The fabricated tactile sensor detected differences in hardness in the range of 10/sup 3/ to 10/sup 5/ N/m.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"642 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132892496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Sensing mechanisms of high temperature silicon carbide field-effect devices 高温碳化硅场效应器件的传感机制
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215342
P. Tobias, B. Golding, R. Ghosh
{"title":"Sensing mechanisms of high temperature silicon carbide field-effect devices","authors":"P. Tobias, B. Golding, R. Ghosh","doi":"10.1109/SENSOR.2003.1215342","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215342","url":null,"abstract":"Metal-insulator-silicon carbide devices have been used for gas sensing in automotive exhausts, because the large band gap of SiC allows high temperature operation up to 1200 K in chemically reactive environments. The sensor response to hydrogen containing species is due to two mechanisms whose effects are difficult to distinguish: the chemical modification of the barrier height at the metal-insulator interface and the creation/passivation of charged states at the insulator-silicon carbide interface. We describe an experimental technique combining in-situ photoemission and in-situ capacitance-voltage spectroscopy to separate the contribution of each phenomenon. Our experiment elucidates the sensing mechanism of high temperature SiC based gas sensors.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133387999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A 5-volt operated MEMS variable optical attenuator 一个5伏操作的MEMS可变光衰减器
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217128
H. Toshiyoshi, K. Isamoto, A. Morosawa, M. Tei, H. Fujita
{"title":"A 5-volt operated MEMS variable optical attenuator","authors":"H. Toshiyoshi, K. Isamoto, A. Morosawa, M. Tei, H. Fujita","doi":"10.1109/SENSOR.2003.1217128","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217128","url":null,"abstract":"We report a micro mechanical variable optical attenuator (VOA) using an electrostatic micro torsion mirror combined with a fiber-optic collimator. The VOA operates at low voltages (DC 5 V or less) for large optical attenuation (40 dB) and fast response time (5 ms or faster). The mirror has been designed to be shock-resistive up to 100 G without causing operation error and up to 500G without any mechanical failure. We also have suppressed temperature dependence of VOA's optical performance by mechanically decoupling the parasitic bimorph effect from the electrostatic operation.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133338717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
A modular high density multi-channel dispenser for micro-array printing 用于微阵列打印的模块化高密度多通道点胶机
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215331
A. Kuoni, M. Boillat, N. D. de Rooij
{"title":"A modular high density multi-channel dispenser for micro-array printing","authors":"A. Kuoni, M. Boillat, N. D. de Rooij","doi":"10.1109/SENSOR.2003.1215331","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215331","url":null,"abstract":"A multi-channel dispenser for micro-array printing has been developed and characterized. We report the fabrication of the dispenser using flexible Polyimide substrate. Polyimide sheets have been dry etched to form /spl mu/-channels. These sheets are sealed with virgin Polyimide sheets by a thermal bonding process. Piezoelectric actuators have been glued onto the channels. 1-dimensional dispenser array has been stacked together to form a 2-dimensional printing array at a nozzle spacing of 500 /spl mu/m. The actuator displacement has been investigated by finite element analysis and by measurements during dispensing for different electrical pulse shapes. The drop formation is recorded with a standard video camera with stroboscope illumination. Droplets of 65 pL have been ejected in parallel at a speed of 2-3 m/s and up to a frequency of 5 KHz.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132166056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A single cell multi-analysis system for electrophysiological studies 用于电生理研究的单细胞多分析系统
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215563
A. Han, E. Moss, R. Rabbitt, K. Engisch, A. B. Frazier
{"title":"A single cell multi-analysis system for electrophysiological studies","authors":"A. Han, E. Moss, R. Rabbitt, K. Engisch, A. B. Frazier","doi":"10.1109/SENSOR.2003.1215563","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215563","url":null,"abstract":"A micro analysis system for multi-purpose electrophysiological studies of single cells has been designed, fabricated, and characterized. The micro electrophysiological analysis system (/spl mu/-EPAS) contains multiple extracellular opposing electrode pairs that interface with a single cell inside an analysis cavity. These electrodes can be used for general single electrode extracellular stimulation/recording studies, dual electrode applications such as impedance spectroscopy, and for applications requiring a greater number of electrodes such as impedance tomography. Additionally, the analysis system contains a sealing/clamping mechanism and a backside extracellular reference electrode for patch clamping studies. The analysis cavities were designed in an array format for parallel analyses. Bovine chromaffin cells were used as a target to demonstrate and characterize the system. Using the integrated glass sealing ring, giga-seals were obtained on a population of chromaffin cells. The micro system generated maximum giga-seal resistances of 1.2G/spl Omega/ with non-sealed average cavity-to-backside resistances of 0.5M/spl Omega/. Furthermore, the cellular analysis system was demonstrated for electrical impedance spectroscopy on chromaffin cells over a range from 40.0 Hz to 1.0 MHz.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133253348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
A switchable cantilever for a novel time-of-flight scanning force microscope 一种新型飞行时间扫描力显微镜的可切换悬臂
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1216973
Dongweon Lee, M. Despont, U. Drechsler, C. Gerber, P. Vettiger, A. Wetzel, R. Bennewitz, E. Meyer
{"title":"A switchable cantilever for a novel time-of-flight scanning force microscope","authors":"Dongweon Lee, M. Despont, U. Drechsler, C. Gerber, P. Vettiger, A. Wetzel, R. Bennewitz, E. Meyer","doi":"10.1109/SENSOR.2003.1216973","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1216973","url":null,"abstract":"This paper describes the design, fabrication and demonstration of a cantilever-based device used in a novel instrument called time-of-flight scanning force microscope (TOF-SFM). The TOF-SFM consists of a switchable cantilever (SC) with integrated piezoresistive strain sensor for topographic imaging, an integrated extraction electrode (EE), and a commercial TOF mass spectrometer (TOF-MS). It allows quasi-simultaneous topographical and chemical analyses of a sample surfaces to be performed in the same way as with conventional scanning probe technique. Significant results are included: (1) the interlocking-type assembling concept for precise tip-EE alignment, (2) the switching properties of the SC, and (3) first demonstrations of field emission and TOF analysis using the TOF-SFM.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128839501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A high-performance dipole surface drive for large travel and force 一个高性能的偶极表面驱动大行程和力
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1395506
S. Hoen, Q. Bai, J. Harley, D. Horsley, F. Matta, T. Verhoeven, J. Williams, K. R. Williams
{"title":"A high-performance dipole surface drive for large travel and force","authors":"S. Hoen, Q. Bai, J. Harley, D. Horsley, F. Matta, T. Verhoeven, J. Williams, K. R. Williams","doi":"10.1109/SENSOR.2003.1395506","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1395506","url":null,"abstract":"We report unparalleled travel, force, precision and repeatability with an electrostatically actuated dipole surface drive. We have successfully demonstrated motors that generate several hundred micronewtons while traveling 50 microns at 60 V. Without external feedback control, the motors can be positioned with nanometer resolution and repeatability. The manufacture of these motors uses a two-level polysilicon deposition, a wafer bond and two anisotropic deep silicon etches.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"60 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133792172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Anodic bonding for monolithically integrated MEMS 单片集成MEMS的阳极键合
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217017
K. Schjlberg-Henriksen, G. U. Jensen, A. Hanneborg, H. Jakobsen
{"title":"Anodic bonding for monolithically integrated MEMS","authors":"K. Schjlberg-Henriksen, G. U. Jensen, A. Hanneborg, H. Jakobsen","doi":"10.1109/SENSOR.2003.1217017","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217017","url":null,"abstract":"This paper presents a study on the feasibility of packaging monolithically integrated MEMS by anodic bonding. We measured the concentration of mobile ions (N/sub m/), the effective oxide charge (N/sub eff/), and the density of interface traps (D/sub it/) before and after bonding, using MOS capacitors as test structures. The capacitors were situated outside the glass and within glass cavities. In the cavities, the vertical distance d between the gate electrode and the glass ceiling was either d=2 /spl mu/m, d=10 /spl mu/m, or d=200 /spl mu/m. All parameters N/sub m/, N/sub eff/, and D/sub it/ were found to increase due to the anodic bonding. The highest increases were observed on the capacitors situated outside the glass, and the lowest increases were observed on the capacitors with d=10 /spl mu/m and d=200 /spl mu/m. A protective nitride layer reduced the increase in N/sub m/. The results suggest that the increase in N/sub m/ also caused the increase in N/sub eff/ and D/sub it/ in the capacitors outside the glass. Within the glass cavities, the increases in N/sub eff/ and D/sub it/ are thought to be due to Negative Bias-Temperature Instability (NBTI).","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115449739","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Compact, modular assembly and packaging of multi-substrate microsystems 多基板微系统的紧凑、模块化组装和封装
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217156
A. B. Ucok, J. Giachino, K. Najafi
{"title":"Compact, modular assembly and packaging of multi-substrate microsystems","authors":"A. B. Ucok, J. Giachino, K. Najafi","doi":"10.1109/SENSOR.2003.1217156","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217156","url":null,"abstract":"This paper presents a new approach for the assembly of microsystems consisting of multiple substrates containing circuits, sensors, and actuators in a re-workable and modular fashion. The microsystem dice are placed inside a cube, and therefore self-aligned and stacked on top of one another, and are separated using non-conducting elastomer sheets. Signal transfer (electrical and fluidic) between these dice is achieved using flexible Parylene cables that are formed on the inside walls of the cube. Conductors and contact pads formed on the Parylene cables are pressed onto matching contact pads on the individual substrates thus forming a mechanical connect/disconnect system for both electrical and fluidic signals. A process for forming the cables and for assembling the entire microsystem has been developed and demonstration prototypes have been constructed to illustrate the feasibility of this approach.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115947736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Networked wireless microsystem for remote gastrointestinal monitoring 用于远程胃肠监测的网络化无线微系统
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1216983
Lei Wang, E. Johannessen, Li Cui, C. Ramsay, T. Tang, M. Ahmadian, A. Astaras, P. Dickman, J. Cooper, A. Murray, B. Flynn, S. Beaumont, D. Cumming
{"title":"Networked wireless microsystem for remote gastrointestinal monitoring","authors":"Lei Wang, E. Johannessen, Li Cui, C. Ramsay, T. Tang, M. Ahmadian, A. Astaras, P. Dickman, J. Cooper, A. Murray, B. Flynn, S. Beaumont, D. Cumming","doi":"10.1109/SENSOR.2003.1216983","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1216983","url":null,"abstract":"The introduction of microsystem and Laboratory-in-a-Pill technologies into medical diagnostics has been a growing field over several decades, where low form factor can significantly improve device access and patient comfort. Similarly, remote medicine and monitoring networks have become more important and popular. In this paper, we present our results on research towards a wireless microsystem network that can deliver analytical data from microsystems distributed in one or more patients' gastrointestinal tracts to a remote monitoring network. We believe that the combination of microsystem and network technologies will greatly benefit future medical research.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124303588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
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