发布求助
文献互助 智能选刊 最新文献

TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)最新文献

筛选
英文 中文
Nanopower betavoltaic microbatteries 它是
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215247
Hang Guo, A. Lal
{"title":"Nanopower betavoltaic microbatteries","authors":"Hang Guo, A. Lal","doi":"10.1109/SENSOR.2003.1215247","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215247","url":null,"abstract":"This paper presents theoretical and experimental studies on betavoltaic microbatteries using low-level radiation from 1/spl sim/100 milliCurie /sup 63/Ni thin films. The model indicates that powers of hundred nanowatts are possible with 50-100 milliCurie radioisotope sources. Two types of betavoltaic microbatteries are developed and tested. One is the planar silicon pn-diode with electroplating of /sup 63/Ni thin film, and the other is the bulk micromachined pn-junction structure with the inverted pyramid array. The obtained power is on the scale of one-nanowatt with an open circuit voltage of 128 millivolts, and a short circuit current of 2.86 nA. The output power can be increased using greater activity and efficient collector designs.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114177136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 78
Pull-in suppression and torque magnification in parallel plate electrostatic actuators with side electrodes 带侧电极的平行板静电致动器的拉入抑制和扭矩放大
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215328
T. D. Kudrle, G. Shedd, C.C. Wang, J. Hsiao, M. Bancu, G. Kirkos, N. Yazdi, M. Waelti, H. Sane, C. Mastrangelo
{"title":"Pull-in suppression and torque magnification in parallel plate electrostatic actuators with side electrodes","authors":"T. D. Kudrle, G. Shedd, C.C. Wang, J. Hsiao, M. Bancu, G. Kirkos, N. Yazdi, M. Waelti, H. Sane, C. Mastrangelo","doi":"10.1109/SENSOR.2003.1215328","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215328","url":null,"abstract":"In this paper we introduce a new electrostatic actuator that provides a large increase in neutral position (no rotation) torque and suppression of pull-in compared to a conventional parallel-plate structure. The actuator geometry incorporates raised electrodes on the side of the rotating element that generate torque versus angle behavior much different than convention parallel plate actuators. Using this electrode configuration we have demonstrated 17-degree stable mechanical rotation on large (950 /spl mu/m diameter) mirrors with 100 V single ended drive-a rotation of 60% of the gap. Driving the mirrors with a differential drive scheme we have demonstrated stable 8-degree rotation with as little as /spl plusmn/18 V.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114473653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
Experimental and numerical studies on micro-droplet movement driven by Marangoni effect 马兰戈尼效应驱动微液滴运动的实验与数值研究
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217157
Y. Tseng, F. Tseng, C. Chieng
{"title":"Experimental and numerical studies on micro-droplet movement driven by Marangoni effect","authors":"Y. Tseng, F. Tseng, C. Chieng","doi":"10.1109/SENSOR.2003.1217157","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217157","url":null,"abstract":"This work is a fundamental study on the movement of various sized micro-liter droplets on a surface subjected to temperature gradients by high speed CCD camera and numerical predictions based on first principle equations. The study indicates that the differences and the change of dynamic receding/advancing contact angles and temperature gradients across the droplets are the key parameters determining the moving behavior.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122075899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Optimization of 0-level packaging for RF-MEMS devices RF-MEMS器件零级封装的优化
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217166
Anne Jourdain, Xavier Rottenberg, Geert Carchon, H. Tilmans
{"title":"Optimization of 0-level packaging for RF-MEMS devices","authors":"Anne Jourdain, Xavier Rottenberg, Geert Carchon, H. Tilmans","doi":"10.1109/SENSOR.2003.1217166","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217166","url":null,"abstract":"This paper reports on the optimization of the 0-level package for RF-MEMS devices like switches and tunable capacitors. The 0-level package consists of an on-chip cavity obtained by flip-chip mounting a capping chip over the RF-MEMS device, using BCB as the bonding and sealing material. A process for realizing low-profile packages, with caps less than 100 /spl mu/m thick, is described. Coplanar RF feedthroughs are implemented using BCB as the dielectric. It is experimentally shown that a 0-level package using capping chips made of low-loss high-resistivity materials and having a cavity height larger than about 45 /spl mu/m, has a negligible impact on the microwave characteristics of an RF-MEMS device, built on a 50 /spl Omega/ CPW line with ground-to-ground spacing of 150 /spl mu/m.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116604635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 49
On a micromachined fluidic inclinometer 在微机械流体倾斜仪上
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217006
R. Yotter, R. R. Baxter, S. Ohno, S. D. Hawley, Denise Wilson
{"title":"On a micromachined fluidic inclinometer","authors":"R. Yotter, R. R. Baxter, S. Ohno, S. D. Hawley, Denise Wilson","doi":"10.1109/SENSOR.2003.1217006","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217006","url":null,"abstract":"We have demonstrated the fabrication of a micromachined fluidic inclinometer for the first time. The micromachined fluidic inclinometer uses capacitance to detect the angle of inclination, and it is capable of measuring inclination with greater than 1/spl deg/ resolution. Several fluidic systems and geometries are tested to optimize speed of response and linearity. The most successful realization of the device uses amphiphilic molecules that self-assemble at the air-fluid interface to reduce surface tension, while maintaining a large dielectric constant difference. In order to increase the capacitance change due to tilt, the electrodes are interdigitated. Initial tests of the prototype devices indicated more than 1/spl deg/ of resolution with 1.38/spl deg/ repeatability, and approximately 21.9 ms response time per one degree of inclination angle change.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128795563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 38
Nanomechanical structures with an integrated carbon nanotube 集成碳纳米管的纳米力学结构
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215283
H. Miyashita, T. Ono, M. Esashi
{"title":"Nanomechanical structures with an integrated carbon nanotube","authors":"H. Miyashita, T. Ono, M. Esashi","doi":"10.1109/SENSOR.2003.1215283","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215283","url":null,"abstract":"In this paper, we report the fabrication method of a freestanding carbon nanotube (CNT) bridged between opposed silicon electrodes with a narrow gap (0.5/spl sim/5 /spl mu/m), which was fabricated by a silicon micromachining technique. After the metallization of nickel (Ni) or iron (Fe) as a catalyst for CNT growth, the CNT was grown between these electrodes with an application of the voltage of 30V during the growth by hot-filament chemical vapor deposition (HF-CVD) using acetylene diluted by hydrogen, as a source gas. The CNT was grown from the negative electrode to another one. From the measurement of current-voltage (I-V) characteristics the contact between the CNT and the silicon electrode shows ohmic behavior and the resistivity of the CNT was estimated to be about 4/spl times/10/sup -5/ /spl Omega//spl middot/cm. This nanofabrication technique will be applicable to the nanomechanical elements integrated an individual CNT.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128350987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Controlled modification of micromachined silicon surfaces using colloidal micro-and nanoparticles 利用胶体微和纳米颗粒对微机械硅表面进行可控改性
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1215576
V. T. Srikar, Y. Peles, L. R. Arana, S. Spearing
{"title":"Controlled modification of micromachined silicon surfaces using colloidal micro-and nanoparticles","authors":"V. T. Srikar, Y. Peles, L. R. Arana, S. Spearing","doi":"10.1109/SENSOR.2003.1215576","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1215576","url":null,"abstract":"We report a processing technique, based on convective self-assembly, to form densely packed, ordered, arrays of colloidal micro-and nanoparticles on the internal surfaces of geometrically complex, bulk-micromachined, silicon structures. The self-assembled layers exhibit excellent surface coverage and a low density of crystallographic defects. This method can access a wide range of chemistries, particle sizes, and layer thickness. Potential applications include the formation of porous thin film platforms for biomolecules and catalysts; incorporation of catalytic particles inside microreactors; and colloidal lithography. The principal results are summarized in the form of design guidelines.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128612809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Sensor assembly for postural control balance prosthesis 姿势控制平衡假体传感器组件
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217030
M. Weinberg, C. Wall
{"title":"Sensor assembly for postural control balance prosthesis","authors":"M. Weinberg, C. Wall","doi":"10.1109/SENSOR.2003.1217030","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217030","url":null,"abstract":"Over 90 million Americans will seek medical attention for dizziness, a malfunction of the inner ear, at least once in their lifetime. Relying on the low weight and excellent performance available in 1997 Draper Microelectromechanical System (MEMS) inertial instruments, we developed and successfully tested a prototype vestibular prosthesis. Balance-impaired patients who were unable to stand unaided stood with the prosthesis. Multiple-axes tilt modules are now being tested at three sites. Where previous papers focused on patient test results and medical diagnoses where the prosthesis could be advantageous, this paper documents the engineering details required for detecting vertical with MEMS instruments.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130339119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Low frequency wireless powering of microsystems using piezoelectric-magnetostrictive laminate composites 压电-磁致伸缩层压复合材料微系统的低频无线供电
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217113
A. Bayrashev, A. Parker, W. Robbins, B. Ziaie
{"title":"Low frequency wireless powering of microsystems using piezoelectric-magnetostrictive laminate composites","authors":"A. Bayrashev, A. Parker, W. Robbins, B. Ziaie","doi":"10.1109/SENSOR.2003.1217113","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217113","url":null,"abstract":"We have developed a new wireless powering technique for microsystems based on low frequency excitation of a piezoelectric-magnetostrictive laminate (i.e., magnetoelectric effect). The laminate composites subjected to a magnetic field have been used to generate an electric voltage (up to 285 V). Adequate power levels (10-80 /spl mu/W) for many microsystem applications have been generated by inserting a piezoelectric PZT sheet between two highly magnetostrictive Terfenol-D layers (strains of the order of 10/sup -3/ at 2-3 kGauss). The possibility of driving a microactuator with the generator has been demonstrated. Comparing with other remote powering techniques, this method possesses much higher voltage generation efficiency per generator volume.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130392498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 53
SOI silicon on glass for optical MEMS 光学MEMS用玻璃上的SOI硅
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) Pub Date : 2003-06-08 DOI: 10.1109/SENSOR.2003.1217100
K. P. Larsen, J. T. Ravnkilde, Ole Hansen
{"title":"SOI silicon on glass for optical MEMS","authors":"K. P. Larsen, J. T. Ravnkilde, Ole Hansen","doi":"10.1109/SENSOR.2003.1217100","DOIUrl":"https://doi.org/10.1109/SENSOR.2003.1217100","url":null,"abstract":"A newly developed fabrication method for fabrication of single crystalline Si (SCS) components on glass, utilizing Deep Reactive Ion Etching (DRIE) of a Silicon On Insulator (SOI) wafer is presented. The devices are packaged at wafer level in a glass-silicon-glass (GSG) stack by anodic bonding and a final sealing at the interconnects can be performed using a suitable polymer. Packaged MEMS on glass are advantageous within Optical MEMS and for sensitive capacitive devices. We report on experiences with bonding SOI to Pyrex. Uniform DRIE shallow and deep etching was achieved by a combination of an optimized device layout and an optimized process recipe. The behavior of the buried oxide membrane when used as an etch stop for the through-hole etch is described. No harmful buckling or fracture of the membrane is observed for an oxide thickness below 1 /spl mu/m, but larger and more fragile released structures will need a thinner oxide in order to prevent damage.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123933308","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信