Nature Reviews Materials最新文献_第3页

Decoding tissue biomechanics using conformable electronic devices 利用可适配电子设备解码组织生物力学

IF 83.5 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-21 DOI: 10.1038/s41578-024-00729-3

Hyeokjun Yoon, Jin-Hoon Kim, David Sadat, Arjun Barrett, Seung Hwan Ko, Canan Dagdeviren

{"title":"Decoding tissue biomechanics using conformable electronic devices","authors":"Hyeokjun Yoon, Jin-Hoon Kim, David Sadat, Arjun Barrett, Seung Hwan Ko, Canan Dagdeviren","doi":"10.1038/s41578-024-00729-3","DOIUrl":"https://doi.org/10.1038/s41578-024-00729-3","url":null,"abstract":"<p>Understanding the human body’s tissue biomechanics — the physical deformation and variations in intrinsic mechanical properties — has considerable potential in health monitoring, disease diagnosis and bioengineering. However, current tools for decoding tissue biomechanics rely on rigid and bulky devices that are not compatible with biological tissues. Such a discrepancy results in inaccurate measurement and even pain and discomfort for the subjects undergoing the measurement. To overcome the limitations of current tools, conformable electronic devices have been developed for monitoring internal and external tissue biomechanics. Moreover, by adopting advanced machine-learning approaches, more insights can be gained from the collected data. In this Review, we provide a comprehensive overview of conformable electronic devices for tissue biomechanics decoding. We discuss basic principles for external and internal tissue decoding, focusing on electromechanical transduction for external tissue decoding and on ultrasonography for internal tissue decoding. Then, we highlight various data analysis methods, including machine-learning algorithms. Finally, we outline challenges and future directions.</p>","PeriodicalId":19081,"journal":{"name":"Nature Reviews Materials","volume":"75 1","pages":""},"PeriodicalIF":83.5,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142451831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Materials for high-temperature digital electronics 高温数字电子器件材料

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-18 DOI: 10.1038/s41578-024-00731-9

Dhiren K. Pradhan, David C. Moore, A. Matt Francis, Jacob Kupernik, W. Joshua Kennedy, Nicholas R. Glavin, Roy H. Olsson III, Deep Jariwala

{"title":"Materials for high-temperature digital electronics","authors":"Dhiren K. Pradhan, David C. Moore, A. Matt Francis, Jacob Kupernik, W. Joshua Kennedy, Nicholas R. Glavin, Roy H. Olsson III, Deep Jariwala","doi":"10.1038/s41578-024-00731-9","DOIUrl":"10.1038/s41578-024-00731-9","url":null,"abstract":"Silicon microelectronics, consisting of complementary metal–oxide–semiconductor technology, have changed nearly all aspects of human life from communication to transportation, entertainment and health care. Despite their widespread and mainstream use, current silicon-based devices are unreliable at temperatures exceeding 125 °C. The emergent technological frontiers of space exploration, geothermal energy harvesting, nuclear energy, unmanned avionic systems and autonomous driving will rely on control systems, sensors and communication devices that operate at temperatures as high as 500 °C and beyond. At these extreme temperatures, active (heat exchanger and phase-change cooling) or passive (fins and thermal interface materials) cooling strategies add considerable mass and complicate the systems, which is often infeasible. Thus, new material solutions beyond conventional silicon complementary metal–oxide–semiconductor devices are necessary for high-temperature, resilient electronic systems. The ultimate realization of high-temperature electronic systems requires united efforts to develop, integrate and ultimately manufacture non-silicon-based logic and memory technologies, non-traditional metals for interconnects and ceramic packaging technology. Digital electronics capable of operating at elevated temperatures are gaining importance in aerospace, space and geothermal energy as well as oil and gas exploration. This Review presents recent advances and future outlook on critical materials and devices for the same.","PeriodicalId":19081,"journal":{"name":"Nature Reviews Materials","volume":"9 11","pages":"790-807"},"PeriodicalIF":79.8,"publicationDate":"2024-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142449405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

CRISPR–Cas9 delivery strategies for the modulation of immune and non-immune cells 调控免疫细胞和非免疫细胞的 CRISPR-Cas9 传递策略

IF 83.5 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-16 DOI: 10.1038/s41578-024-00725-7

Shahad K. Alsaiari, Behnaz Eshaghi, Bujie Du, Maria Kanelli, Gary Li, Xunhui Wu, Linzixuan Zhang, Mehr Chaddah, Alicia Lau, Xin Yang, Robert Langer, Ana Jaklenec

引用次数: 0

China unveils first lunar spacesuit for 2030 moon mission 中国为 2030 年登月任务推出首套登月宇航服

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-16 DOI: 10.1038/s41578-024-00744-4

Charlotte Allard

引用次数: 0

First metal part 3D printed in space 首个在太空中 3D 打印的金属部件

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-16 DOI: 10.1038/s41578-024-00745-3

Charlotte Allard

引用次数: 0

Printed electronics for cultivating plants in space 用于在太空栽培植物的印刷电子技术

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-11 DOI: 10.1038/s41578-024-00742-6

Siqing Wang, Ying Diao

引用次数: 0

Using the moisture in our midst 利用我们中间的水分

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-10-07 DOI: 10.1038/s41578-024-00735-5

引用次数: 0

High-mobility emissive organic semiconductors: an emerging class of multifunctional materials 高流动性发射型有机半导体：一类新兴的多功能材料

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-09-30 DOI: 10.1038/s41578-024-00732-8

Ziyi Xie, Dan Liu, Can Gao, Huanli Dong, Wenping Hu

引用次数: 0

Multifunctional high-entropy materials 多功能高熵材料

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-09-30 DOI: 10.1038/s41578-024-00720-y

Liuliu Han, Shuya Zhu, Ziyuan Rao, Christina Scheu, Dirk Ponge, Alfred Ludwig, Hongbin Zhang, Oliver Gutfleisch, Horst Hahn, Zhiming Li, Dierk Raabe

{"title":"Multifunctional high-entropy materials","authors":"Liuliu Han, Shuya Zhu, Ziyuan Rao, Christina Scheu, Dirk Ponge, Alfred Ludwig, Hongbin Zhang, Oliver Gutfleisch, Horst Hahn, Zhiming Li, Dierk Raabe","doi":"10.1038/s41578-024-00720-y","DOIUrl":"10.1038/s41578-024-00720-y","url":null,"abstract":"Entropy-related phase stabilization can allow compositionally complex solid solutions of multiple principal elements. The massive mixing approach was originally introduced for metals and has recently been extended to ionic, semiconductor, polymer and low-dimensional materials. Multielement mixing can leverage new types of random, weakly ordered clustering and precipitation states in bulk materials as well as at interfaces and dislocations. The many possible atomic configurations offer opportunities to discover and exploit new functionalities, as well as to create new local symmetry features, ordering phenomena and interstitial configurations. This opens up a huge chemical and structural space in which uncharted phase states, defect chemistries, mechanisms and properties, some previously thought to be mutually exclusive, can be reconciled in one material. Earlier research concentrated on mechanical properties such as strength, toughness, fatigue and ductility. This Review shifts the focus towards multifunctional property profiles, including electronic, electrochemical, mechanical, magnetic, catalytic, hydrogen-related, Invar and caloric characteristics. Disruptive design opportunities lie in combining several of these features, rendering high-entropy materials multifunctional without sacrificing their unique mechanical properties. High-entropy materials leverage phase stabilization through mixing several elements and are primarily known for their mechanical strength and high toughness. This Review explores their use as a platform for multifunctional material design, in which several, even conflicting, properties can be reconciled because of the compositional tolerance inherent in the high-entropy concept, including electronic, magnetic, mechanical, catalytic, thermal expansion and hydrogen storage properties.","PeriodicalId":19081,"journal":{"name":"Nature Reviews Materials","volume":"9 12","pages":"846-865"},"PeriodicalIF":79.8,"publicationDate":"2024-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142330204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Designing desorption 设计解吸

IF 79.8 1区材料科学

Nature Reviews Materials Pub Date : 2024-09-25 DOI: 10.1038/s41578-024-00739-1

Ariane Vartanian

引用次数: 0