Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)最新文献_第6页

Dispensing flip chip underfill process problems and solutions 点胶倒装芯片底填工艺问题及解决方案

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742024

M. Norris, R. Overko

引用次数: 1

Process and reliability characteristics of polymer flip chip assemblies utilizing stencil printed thermosets and thermoplastics 利用模板印刷热固性和热塑性塑料的聚合物倒装芯片组件的工艺和可靠性特性

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742032

R. H. Estes

{"title":"Process and reliability characteristics of polymer flip chip assemblies utilizing stencil printed thermosets and thermoplastics","authors":"R. H. Estes","doi":"10.1109/ADHES.1998.742032","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742032","url":null,"abstract":"The implementation of low cost, highly reliable solutions for advanced packaging requirements is the culmination of successfully integrating different technology disciplines into the final product. These include advanced IC design, substrate design, and fabrication, as well as specially formulated materials and processes for production of the flip chip bump interconnect and underfill methodology. Advanced stencil printing of thermoset and thermoplastic pastes for bump formation is perhaps the most critical parameter in the fabrication of solderless flip chip assemblies with high reliability. This discussion in this paper focuses on the stencil print process when conductive thermoset and thermoplastic pastes are processed to produce the bump pattern on wafers and/or substrates. Investigation of the relationships between the stencil type, paste characteristics, and print parameters are made and correlated with resulting bump yield, uniformity and electrical resistance measurements. Long term reliability is discussed with respect to thermoset vs. thermoplastic pastes, uniformity and quality of stencil apertures, and the ability to produce repeatable, uniform bumps on wafers for flip chip assembly. Finally, suggestions are made as to the best methods for achieving high performance flip chip solutions without solder.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"636 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116212170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Cyanate ester die attach material for radiation hardened electronic packages 辐射硬化电子封装用氰酸酯模贴附材料

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742002

T. Shah, S. Danziger, K. Moores, Y. Joshi

{"title":"Cyanate ester die attach material for radiation hardened electronic packages","authors":"T. Shah, S. Danziger, K. Moores, Y. Joshi","doi":"10.1109/ADHES.1998.742002","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742002","url":null,"abstract":"Until recently, the choice of die attach materials in hermetic packaging for space applications has been limited to three types: silver-glass, gold-silicon eutectic, and polyimide film or paste. The performance of each die bond material varies with die size and actual package design, and no single material has given optimum performance for every type of packaging configuration. As a result, selection of the appropriate material has become a complicated procedure where production processes must be continuously modified to meet quality, reliability and performance goals. However, the use of solvent free, polymeric materials such as cyanate ester have great potential as universal die bond adhesives for single chip modules. Details of the qualification process for use of cyanate ester die attach material within radiation hardened memory modules is presented in this paper. A package was subjected to testing as per MIL STD 883E to assess the quality of the die bond, and the effect of cyanate ester on any other subsequent process steps. Based on the results obtained, cyanate ester has become the clear choice for the die attach material for all single chip modules at LMFS. Not only did it prove to be the superior die attach material in this case, it also provided additional benefits such as significantly reduced cycle times and overall manufacturing costs.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127133059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Flip chip attach with thermoplastic electrically conductive adhesive 倒装芯片与热塑性导电胶连接

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742034

M. Gaynes, R. Kodnani, M. Pierson, P. Hoontrakul, M. Paquette

{"title":"Flip chip attach with thermoplastic electrically conductive adhesive","authors":"M. Gaynes, R. Kodnani, M. Pierson, P. Hoontrakul, M. Paquette","doi":"10.1109/ADHES.1998.742034","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742034","url":null,"abstract":"A set of processes has been developed and demonstrated to interconnect flip chips with an electrically conductive adhesive material to laminates. Paste deposition uses a photolithography process to define room temperature stable thermoplastic conductive adhesive bumps that are 0.2 mm in diameter and 0.1 mm high. Photobumping is done at wafer level, and dicing yields chips that are ready for attachment to a carrier. Chip bonding process development defined a process window and identified an optimal process point. Repeatable tensile bond strengths between 10 and 14 MPa can be achieved. Fracture mode typically occurs near an interface but in the joint material. Bonding temperature, pressure, and pressure on cool-down (to 120/spl deg/C) were identified as key process variables. The optimum bonding process point is applying one MPa to the chip, while heating to 235/spl deg/C. Pressure is maintained for 30 seconds at temperature and until cooled to 70/spl deg/C. These optimum bond parameters resulted in bond lines of 0.05/spl plusmn/0.005 mm. The harshest stress test is deep thermal cycling for both blanket and stitched chip designs. The interconnect performance on the blanket chip is comparable to soldered flip chip on laminate. The interconnect performance on the stitch chip is less robust. It is believed that reaction between the photobumping stripper and the polyimide passivation results in a weak interface between the adhesive bump and card metallurgy. Results from stress testing demonstrate the design feasibility of electrically conductive adhesive interconnects for flip chip attach to laminates.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129085018","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Polymer flip chip technology on flexible substrates-development and applications 基于柔性基板的聚合物倒装芯片技术——发展与应用

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742033

T. Seidowski, F. Kriebel, N. Neumann

{"title":"Polymer flip chip technology on flexible substrates-development and applications","authors":"T. Seidowski, F. Kriebel, N. Neumann","doi":"10.1109/ADHES.1998.742033","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742033","url":null,"abstract":"Compared with classic solder flip chip technologies, the use of isotropic conductive adhesive for bumping and assembling results in a number of advantages such as a simple yet versatile process, lower temperatures and environmental friendliness. The polymer flip chip (PFC/sup TM/) technology requires suitable bond pads. The commonly used aluminum alloys result in unstable contacts for the conductive adhesives and hence there is an urgent need for an additional under-bump metallization for the PFC/sup TM/ technology. KSW Microtec has developed a technology which is based on electroless deposition of palladium. The metallization is executed as a back end process. The bond pads are deposited with a homogeneous and pin-hole free Pd thin film with a thickness of about 1 /spl mu/m without significant reduction of the Al bond pad metallization. The deposited film surface does not require flash gold metallization because of the noble characteristics of palladium. This simplifies the process in comparison to the well known Ni/Au process. The contact resistance between conductive adhesives and palladium metallization are equal to or better than gold/adhesive interconnections. As an example of the versatility of the PFC/sub TM/ technology, products manufactured by KSW Microtec include chip on dycostrate, chip on flex with screen printed polymer tracks, and smart cards. Experiences with the set-up and qualification of PFC/sup TM/ technology at KSW Microtec are also discussed.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133166606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Thickness dependent conduction behavior of various particles for conductive adhesive applications 导电胶粘剂应用中不同颗粒的厚度相关导电行为

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742008

Erol Sancaktar, N. Dilsiz

引用次数: 6

Flip-chip packaging with micromachined conductive polymer bumps 用微机械加工的导电聚合物凸起的倒装芯片封装

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742031

K. Oh, C. Ahn

引用次数: 6

Characterisation of electrical contacts made by non-conductive adhesive 非导电胶粘剂电触点的特性

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742051

H. Kristiansen, Morten Gulliksm, HBrek Haugerud, Reidar Friberg

引用次数: 12

Alternate safe solvents in hybrid circuit processing 混合电路加工中的替代安全溶剂

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1900-01-01 DOI: 10.1109/ADHES.1998.742023

A. Riso

{"title":"Alternate safe solvents in hybrid circuit processing","authors":"A. Riso","doi":"10.1109/ADHES.1998.742023","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742023","url":null,"abstract":"Hybrid circuit processing utilizes a number of types of materials in process and in end product manufacture. Our focus of concern is with the in-process materials. Here, we consider the fluxes used in soldering, solder paste, and adhesives and conductive epoxies. Defluxing remains an important aspect even when considering the usage of no-clean and water soluble flux. In most cases, flux removal is required to produce a trouble-free circuit and may also be required for aesthetics. Complete removal of flux remains the goal. Paste clean-up includes thick film and solder pastes. As fine lines and accurate paste deposition are mandated, complete paste removal from screens and stencils becomes critical where paste residues reduce print definition. Practice has produced a wide range of solvent chemicals for this cleaning process. This has been done without suppliers' specific recommendation or support, since the bulk of these chemicals are commodity materials. In this paper, it is shown that many of these chemicals are toxic and/or health hazards. The objective here is to offer specific types of chemical solvents for the application that also provide an improvement upon and an alternative to the hazardous materials.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"16 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129002834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Pressure dependent conduction behaviour of various particles for conductive adhesive applications 导电胶粘剂应用中各种颗粒的压力相关传导行为

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1900-01-01 DOI: 10.1109/ADHES.1998.742050

Erol Sancaktar, N. Dilsiz

引用次数: 1