Thickness dependent conduction behavior of various particles for conductive adhesive applications

Abstract

In order to gain insight into the film thickness dependent conduction behavior of adhesives containing conductive particles of different size, shape and type, the effect of adhesive film thickness was studied. Epon 830 resin was used as the base resin, and 4-7 /spl mu/m silver powder was used as the base particle for comparative purposes. Adhesive films of length 2.0 cm, and width 0.7 cm were cast subsequent to mixing with conductive particles in the amount of 25% by volume. The conductive particles were 100% Ag or 50% by weight mixture of Ag with Ni powder, flakes, or filaments. Silver coated Ni flakes of size 20 /spl mu/m were also mixed in 50% proportion with Ag powder to assess the effect of silver coating. Subsequent to cure, the resistance of the filled films was measured by the four-point method, and resistivities were calculated based on these measurements.