Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)最新文献

A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive 一种可靠且环保的封装技术——使用各向异性导电粘合剂的倒装芯片连接

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.741997

A. Tolvgård, J. Malmodin, Johan Liu, Z. Lai

{"title":"A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive","authors":"A. Tolvgård, J. Malmodin, Johan Liu, Z. Lai","doi":"10.1109/ADHES.1998.741997","DOIUrl":"https://doi.org/10.1109/ADHES.1998.741997","url":null,"abstract":"There is increasing demand to move radio base stations closer to the antenna for future mobile telecommunication systems, which requires significant reduction in weight, volume and environmental compatibility. In this work, an evaluation of environmental impact and reliability when using anisotropically conductive adhesives (ACA) for flip-chip joining in radio base station applications has been performed. Conventional FR-4 substrates were used to assemble a digital ASIC chip using an anisotropically conductive adhesive and flip-chip technology. The chip has a minimum pitch of 128 /spl mu/m with a chip size of 7.76 mm and has a total of 216 bumps with bump size of 108/spl times/120 /spl mu/m using electroless nickel/gold bumping technology. The bonding quality was characterized by optical and scanning electron microscopy and substrate planarity measurement. Main quality-affecting parameters are misalignment and softening of the FR-4 substrate during assembly, which lead to high joint resistance. Reliability testing was conducted in a temperature cycling test between -40 and +125/spl deg/C for 1000 cycles, a 125/spl deg/C aging test for 1000 hours and a humidity test 85/spl deg/C/85% RH, 500 hours. The results show that relatively small resistance change was observed after reliability testing. The environmental impact evaluation was conducted as a material content declaration and as a life cycle assessment (LCA). By using flip-chip ACA joining technology, the environmentally hazardous materials content was reduced more than ten times and the use of precious metals was reduced by more than 30 times compared to conventional SMT.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"612 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123065904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 48

Fundamental study on adhesive strength of electrical conductive adhesives (ECAs) 导电胶粘剂(ECAs)粘接强度的基础研究

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742019

T. Inada, C. Wong

引用次数: 0

Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications 微带到微带互连与导电胶粘接带用于微和毫米波应用

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742010

W. Pohlmann, A. Jacob, H. Schaefer, O. Hennemann

引用次数: 0

Nanocomposite materials offer higher conductivity and flexibility [conducting polymers] 纳米复合材料提供更高的导电性和柔韧性[导电聚合物]

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742041

P. McCluskey, M. Nagvanshi, V. Verneker, P. Kondracki, D. Finello

引用次数: 1

Metrology of adhesive layers using acoustic microscopy 用声学显微镜测量胶粘剂层

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742026

S. Canumalla

引用次数: 5

Chemical kinetic model of interfacial degradation of adhesive joints 粘接界面降解的化学动力学模型

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742001

D. Lam, F. Yang, P. Tong

引用次数: 47

Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections 胶粘剂热工性能与FC互连可靠性的相关性

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742045

R. Miessner, R. Aschenbrenner, H. Reichl

{"title":"Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections","authors":"R. Miessner, R. Aschenbrenner, H. Reichl","doi":"10.1109/ADHES.1998.742045","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742045","url":null,"abstract":"This paper presents an evaluation of isotropic and anisotropic conductive adhesives for flip chip applications. Samples consist of bumped test chips mounted on fine pitch rigid and flexible substrates. The finest pitches are 150 /spl mu/m for rigid FR4 substrates and 100 /spl mu/m for flex substrates. Isotropic conductive adhesives are promising candidates for adhesive joining. As they conduct electricity equally in all directions, the material must be applied precisely to the points to be connected, and not allowed to flow and short circuit between circuit lines. Anisotropic conductive adhesive materials are prepared by dispersing electrically conductive particles in an adhesive matrix. The concentration assures reliable conductivity between substrate and IC electrodes but insulation between adjacent bumps. Several adhesives, both commercial and experimental products, were investigated. A detailed thermo-mechanical analysis was used to characterize the materials according to their physical properties. This analysis method was also used to optimize the curing profile, i.e. to shorten curing time. The reliability evaluation was performed with special regard to the degradation and to interface reactions between polymers and metal surfaces in adhesive contacts. The electrical and mechanical performance of the adhesive bonds were studied by evaluating initial contact resistance and mechanical adhesion as a function of temperature and humidity. Reliability test data was correlated with the thermo-mechanical properties. We thus derived simple criteria for adhesive selection for flip chip applications.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128622695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

A study on the effect of surface roughness on the strength of single lap joints 表面粗糙度对单搭接接头强度影响的研究

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742054

R. Gomatam, Erol Sancaktar

{"title":"A study on the effect of surface roughness on the strength of single lap joints","authors":"R. Gomatam, Erol Sancaktar","doi":"10.1109/ADHES.1998.742054","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742054","url":null,"abstract":"Summary form only given. Many surface treatments to improve adhesion roughen the surface. Treatments such as abrasion and etching remove the weak boundary layer and improve wetting behavior. Liquid adhesives that are spread during application do not ensure removal of air from cavities on the surface. Adhesive penetration into substrate pores is influenced by capillary forces and retarded by viscosity. Surface roughness can affect adhesive spreading and contact angle. In order to investigate aspects of surface roughness, surface profile, resin viscosity, and surface morphology, experiments were conducted using two steels (1018 cold rolled and hot rolled weld steel). Four surface modifications were performed on these samples by grit blasting at 552 kPa and 276 kPa from a distance of 25.4 mm and chemical etching using chromic acid for 2 mins and 10 mins. Crossed patterns were also obtained by an etch technique which involved changing the metal sample dip angle into the etch solution. Two resins were used to assess viscosity effects in interaction with different surface topographies. Contact angles were measured on all surfaces using these resins. Metal specimens were bonded under pressure and oven cured at 121/spl deg/C for 2 hours. To gain insight into the effect of surface topography, SEM was used to observe the modified surfaces. Average roughness was measured using a profilometer and surface profiles were obtained for all samples. The strength and displacement values were measured at crosshead speeds of 1 and 100 mm/min, to assess the interrelation between failure mechanisms and joint displacements, surface topography and resin viscosity.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126231719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Investigations of plasma compatibility of SMT assembly adhesives SMT组装胶粘剂的等离子体相容性研究

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742018

K. Wolter, M. Detert, T. Herzog

引用次数: 2

Development of low cost, low temperature conductive adhesives 开发低成本、低温导电胶粘剂

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742042

S.K. Kang, S. Purushothaman

{"title":"Development of low cost, low temperature conductive adhesives","authors":"S.K. Kang, S. Purushothaman","doi":"10.1109/ADHES.1998.742042","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742042","url":null,"abstract":"Summary form only given. Electrically and/or thermally conductive materials comprising metallic filler particles and polymer matrix are actively investigated for replacement of the solder interconnects used for microelectronic applications. Ag-filled epoxy resin materials originally developed for thermal conduction in die attach applications have been candidates for this purpose. However, several limitations have been realized when they are considered for solder interconnect replacement, such as low electrical conductivity, low joint strength, increased contact resistance upon thermal cycling, lack of reworkability, Ag migration, etc. In order to overcome these limitations, a new formulation has been developed based on alternative high conductivity filler particles and tailored polymer resins. The high conductivity filler particles are coated with low melting point nontoxic metals or alloys which can be fused to achieve metallurgical bonding between adjacent particles as well as to a substrate. Specifically, a conductive adhesive made of Sn-coated Cu powder and polyimide-siloxane resin was developed, and its salient properties were reported previously. This material is a good candidate for replacing high temperature solder joints such as controlled collapse chip connection (C4) and solder ball connection (SBC) to a ceramic substrate, but not for assembly on polymeric PCBs. In this paper, we report a new formulation of electrically conductive adhesive materials with coated metal filler, which can be used for low temperature and low cost applications.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134138521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1