Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)最新文献_第2页

Incremental algorithms of finding offset distance and minimum passage width using Voronoi diagram technique [CAM machining] 基于Voronoi图技术的偏移距离和最小通道宽度的增量算法[CAM加工]

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742053

W. Lai, T. Faddis, R. Sorem

{"title":"Incremental algorithms of finding offset distance and minimum passage width using Voronoi diagram technique [CAM machining]","authors":"W. Lai, T. Faddis, R. Sorem","doi":"10.1109/ADHES.1998.742053","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742053","url":null,"abstract":"Since some practical areas, such as computer graphics, computer-aided design, robotics, pattern recognition, and finite element methods, give rise to geometrical problems, Voronoi diagrams have broad areas of application, such as mesh generation in FEA (finite element analysis) and machining toolpath planning in CAM (computer-aided manufacturing) for NC pocket machining. When the mesh generation is applied in FEA, the information for extraction of geometric proximity is important. When the contour-parallel strategy is applied to machining toolpath planning, geometric degeneracies can occur and significantly require the performance of complicated and time-consuming computations of offset curves. The best way to deal with geometric proximity and geometric degeneracies is with Voronoi diagrams. If islands are considered in machining toolpath planning, it is necessary to calculate the minimum passage width between islands, or between islands and contour segments. This paper presents the incremental algorithms of the Voronoi diagram technique to calculate the offset distance for offset curves and the minimum passage width for pocket machining toolpath planning.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132260031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Flip-chip assembly using anisotropic conducting adhesives: experimental and modelling results 使用各向异性导电胶粘剂的倒装芯片组装:实验和建模结果

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.741998

C.N. Oguibe, S. Mannan, D. Whalley, D.J. Williams

{"title":"Flip-chip assembly using anisotropic conducting adhesives: experimental and modelling results","authors":"C.N. Oguibe, S. Mannan, D. Whalley, D.J. Williams","doi":"10.1109/ADHES.1998.741998","DOIUrl":"https://doi.org/10.1109/ADHES.1998.741998","url":null,"abstract":"This paper presents the results of a programme of experimental and computational work aimed at understanding key issues involved in using anisotropic conducting adhesive (ACA) materials in fine pitch flip-chip assemblies. The experimental programme involved the construction of a number of assemblies with flip-chip devices (unbumped and bumped) at a pitch of 200 /spl mu/m on ceramic and organic substrates. Measurements made on these assemblies show wide variations of conductivity at the electrical joints of the flip-chip assemblies, constructed under apparently the same experimental conditions. Attempts were made to identify reasons for the poor conductivity uniformity and to explain the origin of the unsatisfactory connections through experimental analysis of the linearity of the contact resistances and the effects of gap height on conduction within anisotropic conducting adhesive assemblies. In addition, computational models of metallic conduction in solid and polymer-cored particles were constructed to help further understand the conduction mechanism at electrical joints. Results indicate that flip-chip assemblies with larger conducting particles within the ACAs are able to produce higher yield than those with smaller conducting particles, while the experimental and computational analyses strongly suggest the presence of thin insulating films between particles and that give rise to nonuniform conductivity.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129609439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Effect of the T-stress in the adhesively bonded joints on the locus of failure in rubber toughened epoxy system 胶合接头t应力对橡胶增韧环氧树脂体系破坏轨迹的影响

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742056

B. Chen, D. Dillard, J. Dillard

{"title":"Effect of the T-stress in the adhesively bonded joints on the locus of failure in rubber toughened epoxy system","authors":"B. Chen, D. Dillard, J. Dillard","doi":"10.1109/ADHES.1998.742056","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742056","url":null,"abstract":"Summary form only given. This study addresses T-stress effects on the locus of failure in adhesively bonded joints. Double cantilever beam (DCB) specimens were made using Al 6061-T6 adherends and DER 331 epoxy resin with rubber concentrations from 0% to 8%. In order to obtain different stress levels, specimens were loaded uniaxially to plastically deform the adherends. T-stress increased with the plastic deformation left in the specimen upon unloading. Under mode I loading, unstable or alternating crack propagation was seen when the T-stress in the specimen increased. After this stability transition occurred, failure occurred at or very close to the interfaces. However, the T-stress level where the stability transition occurred increased with adhesive rubber concentration. Post-failure XPS and SEM analysis showed that as rubber concentrations in the adhesive increased, failure tended to be more cohesive. FEA modeling using Franc2DI was conducted to predict crack propagation behavior. Results showed that when the crack is perturbed by an air bubble or flaw ahead of the crack tip, the crack continued to deviate from its original path if the T-stress was tensile. However, if the T-stress was compressive, a deviated crack would converge back to its original path. The convergence rate depended on the T-stress value. The FEA also predicted that under mode I loading, T-stress in specimens with thinner adherends was higher than that in specimens with thicker adherends, and failure tended to occur closer to the interfaces. This prediction was verified using DER 331 epoxy resin with 8.1% rubber and Al 6061-T6 adherends of varying thickness.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126971328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Reliability testing and stress strain estimations of flip-chip joints made by stud-bump-bonding technique 采用螺柱-碰撞键合技术的倒装芯片连接可靠性试验及应力应变估算

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742046

J. Lenkkeri, J. Vahakangas

{"title":"Reliability testing and stress strain estimations of flip-chip joints made by stud-bump-bonding technique","authors":"J. Lenkkeri, J. Vahakangas","doi":"10.1109/ADHES.1998.742046","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742046","url":null,"abstract":"Stud bumping with a ball bonder is a flexible method for fabrication of bumps suitable for adhesive joining of flip-chips. We made test structures with stud bumped chips on alumina and FR4 substrates using isotropically conductive adhesives and underfill materials selected to be compatible both mutually and with the type of substrate used. The chips protected by underfill dispensing were tested to remain stable up to 500 cycles in thermal cycling between -40 and 120/spl deg/C. Due to the limited mechanical strength of adhesive joints, especially when the joint area is very small compared to the chip area, good temperature cycling reliability requires an underfill material to increase the joint mechanical strength and to reduce thermally induced deformation caused by the differential thermal expansion of the chip and the substrate. Calculations were undertaken to estimate the stress-strain behavior of adhesive joints in temperature cycling using a developed 1D model together with assumptions about the material behavior. The effects of various geometrical factors on reliability were studied. The application of underfill material, temperature dependence of its elastic modulus, the difference in the chip and substrate thermal expansion coefficients, and the stiffness of the structure adjacent to the joints seem to have major effects on joint deformation during temperature cycling.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114040413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Studies of underfill formulation effects using molecular dynamics and discrete element modeling 利用分子动力学和离散元模型研究下填体配方效应

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742048

N. Iwamoto, M. Li, S. J. McCaffery, Masami Nakagawa, G. Mustoe

引用次数: 3

Flexible polyimide interposer for CSP preparation CSP制备用柔性聚酰亚胺中间体

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742012

V. Beyer, F. Kuchenmeister, M. Bottcher, E. Meusel

引用次数: 3

Residual strength of OLB in a TAB assembly with ACF after thermal and mechanical loading 热和机械载荷后，带ACF的TAB组件中OLB的残余强度

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742044

C.M.L. Wu, N. H. Yeung, M. Chau, J. Lai

引用次数: 1

Effect of bump height on flip-chip joint reliability using ACA 基于ACA的碰撞高度对倒装接头可靠性的影响

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742015

K. Persson, Z. Lai, A. Zribi, Johan Liu, Magnus Willander

引用次数: 5

Overview of conductive adhesive joining technology in electronics packaging applications 导电胶连接技术在电子封装中的应用综述

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.741996

Johan Liu, Z. Lai, Helge Kristiansen, C. Khoo

引用次数: 60

Novel fast cure and reworkable underfill materials 新型快速固化和可修复的底填材料

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742035

B. Ma, Q. Tong, A. Savoca, T. Debarros

引用次数: 0