{"title":"热和机械载荷后，带ACF的TAB组件中OLB的残余强度","authors":"C.M.L. Wu, N. H. Yeung, M. Chau, J. Lai","doi":"10.1109/ADHES.1998.742044","DOIUrl":null,"url":null,"abstract":"The key parameters of temperature, pressure, and time during bonding of the outer lead bonds (OLB) in a tape automated bonding (TAB) assembly with anisotropic conductive film (ACF) were investigated. In our study, thermal aging and thermal shock treatments were used to evaluate their reliability. Also, peel tests and microstructural examinations were conducted. It was found that the peel strength decreased slightly with the bonding temperature and bonding pressure. However, peel strength seemed to be stable with bonding time. In the aging test, the results showed that the peel strength decreased as the aging time increased. Moreover, results from scanning electron microscopy (SEM) showed that some voids were revealed near the TAB polyimide in the thermal shock treatment.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Residual strength of OLB in a TAB assembly with ACF after thermal and mechanical loading\",\"authors\":\"C.M.L. Wu, N. H. Yeung, M. Chau, J. Lai\",\"doi\":\"10.1109/ADHES.1998.742044\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The key parameters of temperature, pressure, and time during bonding of the outer lead bonds (OLB) in a tape automated bonding (TAB) assembly with anisotropic conductive film (ACF) were investigated. In our study, thermal aging and thermal shock treatments were used to evaluate their reliability. Also, peel tests and microstructural examinations were conducted. It was found that the peel strength decreased slightly with the bonding temperature and bonding pressure. However, peel strength seemed to be stable with bonding time. In the aging test, the results showed that the peel strength decreased as the aging time increased. Moreover, results from scanning electron microscopy (SEM) showed that some voids were revealed near the TAB polyimide in the thermal shock treatment.\",\"PeriodicalId\":183195,\"journal\":{\"name\":\"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-09-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.1998.742044\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.1998.742044","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Residual strength of OLB in a TAB assembly with ACF after thermal and mechanical loading
The key parameters of temperature, pressure, and time during bonding of the outer lead bonds (OLB) in a tape automated bonding (TAB) assembly with anisotropic conductive film (ACF) were investigated. In our study, thermal aging and thermal shock treatments were used to evaluate their reliability. Also, peel tests and microstructural examinations were conducted. It was found that the peel strength decreased slightly with the bonding temperature and bonding pressure. However, peel strength seemed to be stable with bonding time. In the aging test, the results showed that the peel strength decreased as the aging time increased. Moreover, results from scanning electron microscopy (SEM) showed that some voids were revealed near the TAB polyimide in the thermal shock treatment.
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