Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)最新文献_第3页

Processing-adhesion relations for die attach adhesives and underfill resins 模附胶粘剂和下填充树脂的加工-粘合关系

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742021

J. Taweeplengsangsuke, R. Pearson

{"title":"Processing-adhesion relations for die attach adhesives and underfill resins","authors":"J. Taweeplengsangsuke, R. Pearson","doi":"10.1109/ADHES.1998.742021","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742021","url":null,"abstract":"Adhesion is a major consideration in the quality and reliability of new packaging technologies. In PQFPs, adhesive failure is often seen between the die attach adhesive and copper bond pad. In the case of flip chip technology, delamination is often seen between the underfill resin and organic passivation layer. Some of these failures may be attributed to process, i.e. improper cure schedules. Previous work on adhesion-processing relationships for die attach adhesives in PQFPs led to the development of bondability diagrams for isothermal cure conditions, which identified various phenomena that influenced the adhesive bond strength. Similar adhesion-processing relationships can be developed for underfill resins used in flip-chip packaging. However, underfill resins are seldom processed under isothermal conditions and one must also consider the flow process, which was not a concern for die attach adhesives. Underfill material adhesion properties and flow characteristics are the dominant factors that determine the number of cycles to failure of flip-chip packages. Clearly, understanding the cure behavior of polymeric adhesives should provide a valuable insight on delamination and interfacial failure. The purpose of this work is to study the nonisothermal cure behaviour of die attach adhesives and underfill resins in attempt to understand the relationships between processing conditions and bond strength.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"199 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122602414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Continuous electrical resistance monitoring, pull strength, and fatigue life of isotropically conductive adhesive joints 各向同性导电胶接头的连续电阻监测、拉拔强度和疲劳寿命

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742006

J. Constable, T. Kache, H. Teichmann, S. Muhle, M. Gaynes

引用次数: 41

Flow characterization and thermo-mechanical response for anisotropic conductive films 各向异性导电薄膜的流动特性和热力学响应

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742005

R. Dudek, A. Schubert, S. Meinel, B. Michel, L. Dorfmuller, P. Knoll, J. Baumbach

{"title":"Flow characterization and thermo-mechanical response for anisotropic conductive films","authors":"R. Dudek, A. Schubert, S. Meinel, B. Michel, L. Dorfmuller, P. Knoll, J. Baumbach","doi":"10.1109/ADHES.1998.742005","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742005","url":null,"abstract":"The paper reports investigations of the chip on glass (COG) bonding process using anisotropic conductive films (ACF). Experimental methods and theoretical analyses, by both analytical and numerical means, are applied. Assumptions with regard to the thermo-mechanical and rheological properties of the polymer materials involved in the bonding process are briefly characterized in terms of temperature dependence. The transient development of the temperature field during the bonding process is studied by finite element analysis for dependence on the upper and lower chuck temperatures. Analytical techniques from fluid mechanics are used to predict the flow of the conductive particles during bonding, which are treated as dimensionless points embedded in a viscous matrix. This analytical description allows estimation of the number of conducting particles on a chip bump after bonding. Furthermore, numerical calculations are applied to characterize the influence of viscosity gradients on the particle flow. Finally, nonlinear finite element simulations are used to investigate the stress development and stress relaxation process within the ACF joints.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129465794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Deformation study of the PCB during the flip chip assembly process using anisotropically conductive adhesive (ACA) as a bonding agent 以各向异性导电胶(ACA)为黏合剂，研究反转晶片组装过程中PCB的变形

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.741999

K. Pinardi, J. Liu, R. Haug, C. Treutler, M. Willander

引用次数: 7

Effect of cleaning and non-cleaning situations on the reliability of flip-chip packages 清洗和非清洗情况对倒装封装可靠性的影响

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742029

J. Wang, D. Zou, Z. Qian, W. Ren, S. Liu, T. Dudderar, P. Sullivan

{"title":"Effect of cleaning and non-cleaning situations on the reliability of flip-chip packages","authors":"J. Wang, D. Zou, Z. Qian, W. Ren, S. Liu, T. Dudderar, P. Sullivan","doi":"10.1109/ADHES.1998.742029","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742029","url":null,"abstract":"Experimental and numerical studies are conducted to investigate whether flip chip solder joint reliability is affected by noncleaning situations, in which underfill cannot be completely filled in solder ball corners due to contamination (e.g. flux residue) after reflow. Real-time moire interferometry is used to measure warpage for cleaning and noncleaning flip-chip package specimens during test, while a nonlinear FEA technique, where solder ball/underfill viscoplastic properties are considered, is adapted to simulate cleaning and noncleaning situations to assess impact on solder joint reliability. Results show that there is no obvious difference in warpage obtained from either test data or numerical work between cleaning samples and noncleaning samples. However, stress simulations reveal that the noncleaning situation decreases mechanical stability and shortens flip-chip package lifetime to a level well below that of cleaning simulation results. Fatigue life at some points of the outmost solder joint from cleaning FEA models is much higher that from noncleaning FEA models. As it is hard to find perfectly filled layers for any real world samples, the cleaning model yields overly conservative results. The predicted flip-chip package deformation values from the FEA are also compared with test data obtained from the laser moire interferometry technique. Good agreement is obtained. In particular, the flip-chip package displacement contours in both the x and y directions obtained from the test show similar distribution patterns to those modeled by the FEM.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114160413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Anisotropic conductive paste available for flip chip 可用于倒装芯片的各向异性导电浆料

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742016

Y. Kishimoto, K. Hanamura

{"title":"Anisotropic conductive paste available for flip chip","authors":"Y. Kishimoto, K. Hanamura","doi":"10.1109/ADHES.1998.742016","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742016","url":null,"abstract":"This report aims to explain the applications, concepts, and properties of ACP (anisotropic conductive paste), which was developed for flip chip joining. ACP is a nonsolvent, one-pack-type of liquid connection material. It is composed structurally of fine conductive particles diffused in liquid thermosetting resin. With this paste thermally crimped between two electrodes to provide physical bonding, electrodes that are located opposing or adjacent to each other are provided with conductivity or insulation, respectively. ACP is outstanding in terms of hardening time, requiring only a few seconds at 200/spl deg/C or above, thus assuring high industrial productivity. Also, it is highly stable in long-term storage extending over a few months. Furthermore, the paste's conductivity and insulation properties mean that it can successfully provide flip chip connection with assured reliability. Mounting does not involve the use of lead or flux, and thus the paste is environmentally friendly. ACP is easy to handle and outstanding in terms of productivity, and can thus be recommended as a mounting method with a wide scope for application.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116386069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Conductive adhesives with improved thermomechanical properties 具有改进的热机械性能的导电粘合剂

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742040

H. Schaefer, B. Guenther, A. Battermann, R. Haug, V. Brielmann

引用次数: 2

Models of electrical conduction in nanoparticle filled polymers 纳米粒子填充聚合物中的导电模型

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742007

P. McCluskey, J. Morris, V. Verneker, P. Kondracki, D. Finello

引用次数: 6

Reliability assessment of connection using HSC on LCD LCD上HSC连接可靠性评估

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742030

C.M.L. Wu, N. H. Yeung, C. Tsang, Y. Chan

{"title":"Reliability assessment of connection using HSC on LCD","authors":"C.M.L. Wu, N. H. Yeung, C. Tsang, Y. Chan","doi":"10.1109/ADHES.1998.742030","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742030","url":null,"abstract":"Heat seal connectors (HSC) have been evaluated as a regular connection method for electronic components. In order to test the bonding reliability between HSC and the liquid crystal display (LCD) panel, several tests were carried out: thermal aging, thermal shock and vibration tests. The thermal aging test provided a constant condition of 120/spl deg/C for the HSC. The thermal shock test gave the HSC an alteration between extreme environments (-25/spl deg/C to 125/spl deg/C). The HSC peel strength after thermal aging decreased rapidly within the first 50 hours of aging, increased again and reached a peak at 150 aging hours. Afterwards, the peel strength decreased gradually. For the thermal shock test, the peel strength trend was that it decreased rapidly initially and became constant after 200 cycles of thermal shock. Peel strength after the vibration test fluctuated with the increase in the number of vibration cycles. Moreover, microstructural examination was also conducted on the treated HSC samples. A small reduction in the thickness of the copper tracks inside the HSC was found after thermal aging and thermal shock treatments. Also, some defects were detected which may be related to the decrease in peel strength.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"227 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123870919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The recent advances in surface mount conductive adhesives 表面贴装导电胶粘剂的最新进展

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742039

Q. Tong, S. Vona, R. Kuder, D. Shenfield

{"title":"The recent advances in surface mount conductive adhesives","authors":"Q. Tong, S. Vona, R. Kuder, D. Shenfield","doi":"10.1109/ADHES.1998.742039","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742039","url":null,"abstract":"Surface mount conductive adhesives (SMCAs) provide an environmentally friendly solution for interconnections in electronic applications. In addition, SMCAs offer other attractive technical advantages over conventional SnPb metal solders, including low temperature processing and fine pitch capability. However, there have been major obstacles preventing SMCAs from becoming a general replacement for metal solders in electronic applications. Unstable electrical conductivity or contact resistance under elevated temperature and humidity, and the impact resistance of the adhesive interconnections are two areas that need immediate improvement. A structure-property-performance study was undertaken to identify the fundamental mechanisms contributing to unstable contact resistance and poor impact resistance of current SMCAs. This study demonstrated that contact resistance stability depends strongly on the metals involved and suggested that oxidation of the metal surface may be the principal cause of unstable conductivity. This study also identified energy dissipation as the key factor governing SMCA impact resistance, which is characterized by the drop test performance. Accordingly, reduced modulus and increased loss factor were found to be the material properties of importance. This study not only led to a thorough understanding of the property-performance relationships of the SMCA material, but also yielded a series of novel adhesive materials with superior performance.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123969799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6