基于ACA的碰撞高度对倒装接头可靠性的影响

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI:10.1109/ADHES.1998.742015

K. Persson, Z. Lai, A. Zribi, Johan Liu, Magnus Willander

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引用次数: 5

摘要

影响各向异性导电胶粘剂组装倒装芯片接头质量和可靠性的参数有很多。在本研究中，研究了碰撞高度的影响。采用了高度为4、20、40和70 /spl mu/m的镍/金化学凸点。使用各向异性导电粘合剂将芯片组装在FR-4衬底上，并将样品置于-40至+125/spl℃的温度循环中。研究结果表明，凸点高度对倒装接头的质量和可靠性有重要影响。通过理论计算，找到了在离切屑中心不同距离处，关节机械强度与凹凸高度之间的关系。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effect of bump height on flip-chip joint reliability using ACA

There are many parameters that influence the quality and reliability of flip-chip joints assembled using anisotropically conductive adhesives. In this study, the influence of bump height has been investigated. Electroless nickel/gold bumps of 4, 20, 40 and 70 /spl mu/m in height have been used. The chips have been assembled on FR-4 substrates using an anisotropically conductive adhesive and the samples have been subjected to temperature cycling from -40 to +125/spl deg/C. It has been concluded that the bump height is of importance for flip-chip joint quality and reliability. Theoretical calculations have been conducted to find the relationship between joint mechanical strength and bump height at various distances from the centre of the chip.

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来源期刊

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)

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