粘接界面降解的化学动力学模型

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI:10.1109/ADHES.1998.742001

D. Lam, F. Yang, P. Tong

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引用次数: 47

摘要

粘接接头的力学性能在水的存在下会下降。强度的逐渐降低归因于界面裂纹的扩展。本文采用有限元方法模拟了水扩散和节理内应力分布随时间的变化规律。界面应力历史表现出与界面水浓度历史相似的空间不变特征，作为扩散的函数。沿界面的水应力历史可以建模为一个主要依赖于水浓度的函数，而与位置无关。在此基础上，提出了一个化学动力学模型来解释文献中报道的节理强度退化数据。

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Chemical kinetic model of interfacial degradation of adhesive joints

The mechanical properties of adhesive joints are degraded in the presence of water. The progressive decrease in strength has been attributed to propagation of interfacial cracks. Water diffusion and the stress distribution within the joint as a function of time are modeled using the finite element method in this study. The stress history at the interface showed spatially invariant characteristics similar to that of interfacial water concentration history as a function of diffusion. The water-stress history along the interface can be modeled as a function dependent principally on water concentration, and is independent of position. On this basis, a chemical kinetic model is proposed to explain the joint strength degradation data reported in literature.

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Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)

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