Investigations of plasma compatibility of SMT assembly adhesives

Abstract

The paper shows test results of the plasma compatibility of thermally cured SMT assembly adhesives. Investigations of different SMT assembly adhesives after a plasma treatment process using volumetric, mechanical and chemical tests were performed and the results were used to characterize the adhesives. The change of strength, elasticity, surface reactions, component lead and PCB pad contaminations, vacuum constancy and plasma stability of different current adhesives are compared. The test results after plasma treatment of assembly adhesives in both RF plasma and DC plasma are discussed and evaluated.