P. McCluskey, M. Nagvanshi, V. Verneker, P. Kondracki, D. Finello
{"title":"Nanocomposite materials offer higher conductivity and flexibility [conducting polymers]","authors":"P. McCluskey, M. Nagvanshi, V. Verneker, P. Kondracki, D. Finello","doi":"10.1109/ADHES.1998.742041","DOIUrl":null,"url":null,"abstract":"Until recently, all conductive polymers have fallen into one of the following two categories: intrinsically conductive polymers that exhibit poor processibility, low electrical conductivity, and thermal and chemical instability; and extrinsically (or particle filled) conductive polymers that exhibit high densities and poor flexibility. This paper describes the mechanical and electrical characteristics of a new type of conductive polymer made with conductive silver nanoparticle fillers. The use of nanoparticle fillers allows the material to attain the same level of conductivity exhibited by traditional filled polymers at significantly lower particle loading. This results in a conductive polymer that combines the high conductivity and stability of a filled polymer with the flexibility and low density of an intrinsically conductive polymer.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.1998.742041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Until recently, all conductive polymers have fallen into one of the following two categories: intrinsically conductive polymers that exhibit poor processibility, low electrical conductivity, and thermal and chemical instability; and extrinsically (or particle filled) conductive polymers that exhibit high densities and poor flexibility. This paper describes the mechanical and electrical characteristics of a new type of conductive polymer made with conductive silver nanoparticle fillers. The use of nanoparticle fillers allows the material to attain the same level of conductivity exhibited by traditional filled polymers at significantly lower particle loading. This results in a conductive polymer that combines the high conductivity and stability of a filled polymer with the flexibility and low density of an intrinsically conductive polymer.