Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)最新文献_第5页

Parametric dependence of fatigue of electronic adhesives 电子胶粘剂疲劳的参数依赖性

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742013

A. Gladkov, A. Bar-Cohen

引用次数: 31

Numerical analysis of adhesive shrinkage due to thermal cycling 热循环作用下胶粘剂收缩的数值分析

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742057

S. Guo, B. Chen, T. Park, D. Dillard

{"title":"Numerical analysis of adhesive shrinkage due to thermal cycling","authors":"S. Guo, B. Chen, T. Park, D. Dillard","doi":"10.1109/ADHES.1998.742057","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742057","url":null,"abstract":"Summary form only given. For bonded joints containing certain types of adhesives, residual stresses may become more tensile following exposure to cyclic temperature conditions. The more tensile state increases the likelihood of debonding. Significant shrinkage 15% or more of some adhesives has been observed following such debonding if the joint continues to be exposed to thermal cycles. The effect of thermal cycling on the stress state and deformation following debonding in such adhesive materials was investigated using finite element analysis. Viscoelastic materials were found to continue shrinking under cyclic thermal conditions when friction exists between adhesive and substrate. The work explored the effects of coefficient of friction, thermal cycling profile, and viscoelastic properties of the adhesive. Due to problems encountered in our attempts at 3D analyses, 2D geometries of two different types were investigated in this study. Fixed substrates were used in the first geometry type, but loss of contact between adhesive and substrate was seen. For the second case, the adherends were moved at the end of each thermal cycle to maintain contact between adhesive and substrate. The results of the numerical work indicate that viscoelasticity, constraints, and friction are the three requirements for the anomalous shrinkage of the adhesive under thermal cycling.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"67 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121984437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

New generation pre-deposited (no-flow) underfill for low-cost flip chip assembly 用于低成本倒装芯片组装的新一代预沉积(无流)底填料

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742036

M. Firmstone, P. M. Bartholomew, D. Lowrie

{"title":"New generation pre-deposited (no-flow) underfill for low-cost flip chip assembly","authors":"M. Firmstone, P. M. Bartholomew, D. Lowrie","doi":"10.1109/ADHES.1998.742036","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742036","url":null,"abstract":"The achievement of an acceptable balance between flip chip reliability, process throughput/complexity, final yield and cost is an increasingly difficult task, especially in the competitive hand-held electronics market. A simple process, compatible and integrated with normal SMT processing, is a desirable goal which will be enabled by the substitution of a self-fluxing, pre-deposited underfill for the post-deposited materials currently in use. The pre-deposition process also has the potential to move flip chip assembly into mainstream SMT, especially if reworkability can be built in. The benefits of a 'no flow' process have been well documented. The limitations of the materials in current use have been overcome via a unique chemistry which can be tailored to the application. Room temperature storage, effective fluxing coupled with no outgassing, and a choice of reworkability after reflow or nonrework/full cure, can now be achieved within a single materials technology. This paper describes the properties of the new family of materials compared to conventional post-deposited underfills. The development sequence and procedure for material properties characterisation, including evaluation of the effectiveness of the fluxing action on a range of solder alloys, is documented. A typical application is described, outlining how a minimum of two process steps can be eliminated, and how improvements in materials handling, process robustness, and ultimate yield were realised. A simple rework regime is proposed, and the near drop-in replacement aspect of the new material is discussed.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130716866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Underfill of flip chip on laminates: simulation and validation 层合板上倒装芯片的下填充:仿真与验证

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742047

L. Nguyen, C. Quentin, P. Fine, B. Cobb, S. Bayyuk, H. Yang, S. Bidstrup-Allen

引用次数: 76

Advanced packaging and substrate technology using conductive adhesives 采用导电粘合剂的先进封装和基板技术

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742017

K. Eda

引用次数: 2

Thermal cycling analysis of TAB OLB connection with ACF TAB OLB与ACF连接的热循环分析

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742028

N. H. Yeung, C.M.L. Wu, J. Lai

{"title":"Thermal cycling analysis of TAB OLB connection with ACF","authors":"N. H. Yeung, C.M.L. Wu, J. Lai","doi":"10.1109/ADHES.1998.742028","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742028","url":null,"abstract":"This paper reports on the numerical prediction of the deformations and stresses in an anisotropic conductive film (ACF) for connection between the outer lead bonds (OLB) of a tape automated bonded (TAB) assembly and a glass panel. First, the ACF was bonded to the glass panel under heat and pressure and the whole assembly was cooled to room temperature. At this point, a very small residual stress existed. After that, the OLB of the TAB assembly, consisting of copper leads and a polyimide film, were bonded to the ACF. During the bonding process, large stress concentrations were found and the ACF experienced large deformations. The ACF and OLB finally merged together due to the heat and the pressure. This phenomenon is in good agreement with examinations of OLB using a scanning electron microscope. Similar to the pre-bonding process procedure, the assembly was allowed to cool to room temperature. The residual stress obtained was small. After the simulation of the manufacturing process above, thermal cycling from -25/spl deg/C to 125/spl deg/C was applied to the assembly. Von Mises stress distributions were obtained. The results provided useful information on the effects of thermal cycling on the TAB OLB with ACF.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123134537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

On the life prediction and accelerated testing of solder joints 焊点寿命预测及加速试验研究

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742055

Z. Qian, S. Liu

{"title":"On the life prediction and accelerated testing of solder joints","authors":"Z. Qian, S. Liu","doi":"10.1109/ADHES.1998.742055","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742055","url":null,"abstract":"Summary form only given. A critical review of the life prediction and accelerated testing of solder joints, including the role of constitutive modeling and the factors of accelerated testing, is presented in this paper. As a perfect example, a Ford solder joint specimen was used to investigate accelerated testing factors under various accelerated testing conditions in terms of thermal fatigue life. Moreover, a typical PQFP (plastic quad flat pack) package was chosen to clarify the significance of fatigue life prediction in terms of different finite element models and unified and separated constitutive models. Thermal fatigue life prediction of flip chip packages with ball pitch sizes from 250 /spl mu/m to 50 /spl mu/m has been performed to illustrate underfill strengthening mechanisms and obtain an upper bound of accelerated testing factors, which can reduce testing time from three years to one week. Rate/temperature-dependent nonlinear properties of both eutectic solder and FP4526 underfill have been embedded in the ABAQUS finite element analysis for flip chip packages. All of these examples enlighten key points addressed in this report.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115124830","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 45

Thermomechanical behaviour of adhesive jointed SMT components 粘接SMT元件的热力学性能

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742003

M. Perichaud, J. Delétage, D. Carboni, H. Frémont, Y. Danto, C. Faure

引用次数: 8

Fracture behaviour of isotropically conductive adhesives 各向同性导电胶粘剂的断裂行为

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742000

S. Gupta, R. M. Hydro, R. Pearson

引用次数: 1

Characterization of oxidized copper leadframes and copper/epoxy molding compound interface adhesion in plastic package 氧化铜引线架及塑料封装中铜/环氧成型复合材料界面附着力的表征

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) Pub Date : 1998-09-28 DOI: 10.1109/ADHES.1998.742011

Taeho Kang, I. Park, J. Kim, K.-S. Choi

{"title":"Characterization of oxidized copper leadframes and copper/epoxy molding compound interface adhesion in plastic package","authors":"Taeho Kang, I. Park, J. Kim, K.-S. Choi","doi":"10.1109/ADHES.1998.742011","DOIUrl":"https://doi.org/10.1109/ADHES.1998.742011","url":null,"abstract":"For plastic packages, copper leadframes can provide many advantages such as good thermal and electrical performance, and cost effectiveness. Copper is, however, susceptible to popcorn cracking during the surface mounting process on the PCB due to poor adhesion between the leadframe and EMC (epoxy molding compound). Experimental results showed that the adhesion strength between copper leadframes and the EMC was affected by alloy composition, CuO/Cu/sub 2/O ratios, oxide layer thickness, and oxidation conditions. The growth of the oxide layer for the Cr-Zr copper alloy was faster than for Ni-Si copper alloys, while the latter had lower adhesion strength than the former. The adhesion strength of the copper alloys depended on the CuO/Cu/sub 2/O ratio rather than oxide thickness. The adhesion strength was highest at a CuO/Cu/sub 2/O ratio of 0.2/spl sim/0.3, regardless of alloy composition and oxide thickness. We found that this was caused by the segregation effect of soluble elements at the oxide/leadframe interface.","PeriodicalId":183195,"journal":{"name":"Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133353146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14