Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI最新文献_第5页

The influence of processing conditions on data retention behavior in a deep submicron NVM process 处理条件对深亚微米NVM过程中数据保留行为的影响

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194479

M. Karnett, S. Qian, R. Solis, X. Tao, A. Black, S. Boonsanguan, A. Liu

引用次数: 1

Cycle time reduction at a major Texas Instruments wafer fab 缩短了德州仪器(ti)一家大型晶圆厂的生产周期

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194477

K. Potti, M. Whitaker

引用次数: 10

The effectiveness and practical application of human resource development (HRD) programs in the semiconductor industry - a case study of SilTerra Malaysia Sdn Bhd 半导体行业人力资源开发(HRD)项目的有效性和实际应用——以SilTerra Malaysia Sdn Bhd为例

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194490

A. Lin, R. A. Razak

{"title":"The effectiveness and practical application of human resource development (HRD) programs in the semiconductor industry - a case study of SilTerra Malaysia Sdn Bhd","authors":"A. Lin, R. A. Razak","doi":"10.1109/ASMC.2003.1194490","DOIUrl":"https://doi.org/10.1109/ASMC.2003.1194490","url":null,"abstract":"In a workplace where employees are constantly impacted by the environment of change, corporate leaders are faced with critical decisions among myriad choices about how to plan for and affect the evolving lifelong learning needs of their organizations. The challenge for Silterra Malaysia Sdn Bhd (Silterra) and it employees is to identify those needs, implement and execute them. As one of the pioneers in semiconductor fabrication industry in Malaysia, it is the intent of Silterra to create a legacy in the area of training and development. It is the goal of the company to become a learning organization. Continuous learning is a key success of a learning organization. To sustain as a learning organization, the HRD programs are used to develop competency sets for Silterra employees. The evaluation system developed by Donald Kirkpatrick (1979) has been used to measure the effectiveness of HRD programs. However, there is an on-going debate in the field of evaluation about which is the best approach to facilitate the processes involved. This paper reviews current approaches to evaluation of training both in theory and practice applicable to Silterra.","PeriodicalId":178755,"journal":{"name":"Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131359090","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Characterisation of silicon oxynitrides and high-k dielectric materials by angle-resolved X-ray photoelectron spectroscopy 角分辨x射线光电子能谱法表征氧化氮化硅和高k介电材料

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194486

P. Mack, R. White, J. Wolstenholme, A. Wright

引用次数: 1

Pupilgram imperfections and their effect on lithography 瞳孔成像缺陷及其对光刻的影响

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194468

S. Renwick, S. Slonaker

{"title":"Pupilgram imperfections and their effect on lithography","authors":"S. Renwick, S. Slonaker","doi":"10.1109/ASMC.2003.1194468","DOIUrl":"https://doi.org/10.1109/ASMC.2003.1194468","url":null,"abstract":"Over the past three years or so, as lens manufacturing has improved and lens aberrations have been continuously reduced, the effects of imperfections in the pupil fill, or the partial-coherence pattern produced by the illuminator of a lithographic tool, are rising up out of the noise level and becoming important. Tools for quantitatively measuring illuminator pupil fill are now becoming increasingly widespread, and the user community is collecting data and asking lithographic tool suppliers what the data mean. Previously, we measured imperfections in the pupil fill of Nikon S204-generation scanners by generating pupilgrams, analyzed them in a manner so as to extract their underlying structure, and compared the results to scaling laws derived from lithographic calculations run with Prolith. At that time, we found that the imperfections seen in that generation of lithographic tools were small enough to have only a minimal effect on litho performance. Now, pupil-fill effects in new-generation high-NA scanners have been measured and characterized. We present a systematic study of pupilgrams, measured with a pinhole reticle while exercising illuminator adjustments, and correlate them with simultaneous measurements of CD uniformity and V-H bias to evaluate the importance of the illuminator in overall CD performance. We have also developed a more sophisticated analysis method to predict the effects of the pupilgrams on litho performance, and we present the correlation between experiment and theory. This work should allow both lithographic tool suppliers and end users to inspect a pupilgram and determine whether it will adversely impact their lithography.","PeriodicalId":178755,"journal":{"name":"Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123896217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Evaluation of final test process in 64-Mbit DRAM manufacturing system through simulation analysis 通过仿真分析，对64mbit DRAM制造系统的最终测试过程进行了评价

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194493

K. Nakamae, H. Ikeda, H. Fujioka

引用次数: 5

NPN yield improvement with ozone surface treatment prior to emitter poly deposition 在发射体聚沉积前进行臭氧表面处理可提高NPN产率

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194509

T. Tran-Quinn, N. Bell, R. Cook, M. Fung, J. W. Andrews, D. Hilscher, D. Szmyd, V. Saikuma, R. Ketcheson, P. Kellawon, S. Calvelli

引用次数: 0

A dynamic system regulation measure for increasing effective capacity: the X-factor theory 提高有效容量的动态系统调控措施:x因素理论

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194473

D. Delp, J. Si, Y. Hwang, B. Pei

{"title":"A dynamic system regulation measure for increasing effective capacity: the X-factor theory","authors":"D. Delp, J. Si, Y. Hwang, B. Pei","doi":"10.1109/ASMC.2003.1194473","DOIUrl":"https://doi.org/10.1109/ASMC.2003.1194473","url":null,"abstract":"Due to the complex nature of semiconductor manufacturing it is evident that a single scheduling or regulation technique cannot best optimize the system dynamics for reducing cycle time and increasing throughput. The throughput of the system can increase to the effective capacity level of the system. When the throughput of the system approaches the effective capacity the product cycle time can dramatically increase. The \"knee\" of the performance curve indicates an operating point for fabs to maximize throughput while keeping the product cycle time relatively low. By increasing the effective capacity, i.e. adding a machine or improving a process, the product cycle time can be lowered or the system throughput increased by producing a shift in the \"knee\" of the performance curve. The bottleneck, typically defined as the most heavily utilized machine group, is often the target for increasing the system effective capacity. We will analyze the bottleneck along with other system capacity regulation measures to systematically study the relationship between bottleneck, X-factor, cycle time, and throughput measurements.","PeriodicalId":178755,"journal":{"name":"Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI","volume":"6 22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123741877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

Extending the HDP-CVD technology to the 90 nm node and beyond with an in-situ etch assisted (ISEA) HDP-CVD process 通过原位蚀刻辅助(ISEA) HDP-CVD工艺，将HDP-CVD技术扩展到90 nm节点及以上

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194480

J. Radecker, H. Weber

引用次数: 2

Integrated web-based architecture for correlative engineering data analysis and decision support 集成基于web的体系结构，用于相关工程数据分析和决策支持

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI Pub Date : 2003-04-22 DOI: 10.1109/ASMC.2003.1194506

N. Tandon, D. Cleverdon, B. Hinshaw

引用次数: 1