2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

{"title":"Aspects of PCB automated quality control using potential function based clustering algorithms","authors":"V. Nicolau","doi":"10.1109/SIITME.2015.7342354","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342354","url":null,"abstract":"Video monitoring and inspection of printed circuit boards (PCBs) in manufacturing process is a complex task, being affected by different types of disturbances. In quality control, an automated system based on video inspection should be able to identify different states of good or faulty PCBs. Copper tracks have complex shapes, making analyzing process more difficult. In addition, clustering techniques must deal with unwanted copper material between conductive tracks, which affects dynamic behavior of the circuit. In this paper, clustering algorithms based on potential functions are used in automated video inspection of PCBs copper tracks. Simulation results are presented for two oblong clusters of copper tracks, which are not well separated and difficult to classify. Two situations are discussed, regarding a good PCB and a faulty one, with some copper material between the tracks, which is close enough but contactless with the tracks. Potential function based algorithms (PFBA) are able to identify the complex shapes of copper tracks in good PCBs. Also, they work well in heavy classifying process of the unwanted copper clusters placed very close to conductive tracks.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131299025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Portable I2C monitor and debugger","authors":"C. Grecu, C. Iordache","doi":"10.1109/SIITME.2015.7342310","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342310","url":null,"abstract":"The paper presents the design of an innovative, very low cost, independent system for monitoring and debugging I2C (Inter Integrated Circuit) buses. The portable system connects to any I2C- or SMBus-based device, such as: consumer electronics (TVs, notebooks and netbooks), measurement equipment, switch mode power supplies, automotive equipment etc. It allows monitoring the bus by behaving like a slave, as well as controlling the bus as a Master. The compact design consists of a microcontroller with integrated I2C dedicated peripheral. The flexible user interface is implemented by an LCD (Liquid Crystal Display) and a 16 keys keyboard. The whole system is powered by a Li-Ion cell, which may be charged from any USB (Universal Serial Bus) port using the integrated charger. The battery voltage is regulated by a high efficiency DC-DC (Direct Current to Direct Current) converter and provides autonomy for up to five days of continuous operation.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"384 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115918293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The development process of an UART chip on FPGA for driving embedded devices","authors":"R. Szabó, A. Gontean","doi":"10.1109/SIITME.2015.7342320","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342320","url":null,"abstract":"The aim of this device is to create an UART (Universal Asynchronous Receiver/Transmitter) chip on FPGA (Field-Programmable Gate Array) to be able to control (embedded) devices which has a serial interface. In this situation the FPGA acts as master and controls other slave devices. The challenge for this device is present in the fact for sending whole strings that can be interpreted by the slave device and to be able to control it as desired. Until now most of the UART chips cold be able to send 8 bits (1 Byte), which was not enough to control devices which needs at least a few Bytes of commands. The other challenge is that until now the FPGA was the slave and the PC was the master, this way the communication could be done only between the PC and the FPGA. The presented device will act now as master and will control other slave devices.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122005580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hardware and software designing of USB based plug n play data acquisition device with C# and LabView compatibility","authors":"Sameed Tehami, Muhammad Ahmed Khan, Osama Mazhar","doi":"10.1109/SIITME.2015.7342313","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342313","url":null,"abstract":"As interdisciplinary sciences getting popular with every passing day, the need of electronic devices interfacing with a PC is also increasing. Very useful products (Arduino, RasberryPi, etc) made their way in commercial market to cater such needs however they require programming skills, specific IDE's (integrated development environments) and lack compatibility with useful tools such as NI (National Instrument) LabView[1] and C#. Since these two (C# and LabView) are supposed to be widely used for their user friendliness, but unfortunately are not prioritised as a development option due to lack of supporting hardware which is either too expensive, rare or too complex. Hence in this research the data acquisition device (DAQ) has been designed and developed to provide a hassle free solution for those who choose LabView to avoid programming or programmers who want to control and observe electronic devices such as sensors/actuators as a part of their research projects. This device is connected to PC over USB and interfaces with C# and LabView using a Direct Link Library (.dll file). It can control up to 8 Digital Inputs, 8 Digital outputs, 8 Analog Inputs and 2 Analog (PWM) outputs. Moreover some Virtual Instruments such as 4 Channel Oscilloscope, Function Generator, Logic Analyzer and PID controller has also been developed in C# to cater the needs of students and researchers.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128237589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The influence of charging/discharging current on supercapacitor's storage capacity","authors":"Vidrascu G. Mihai","doi":"10.1109/SIITME.2015.7342321","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342321","url":null,"abstract":"Today, supercapacitor usage as high durability battery is feasible. The storage capacity in milliamperes-hour is one of the main parameters of a battery, used to determine the running time of an energy independent system. While powering some simple circuits, a shorter up-time was obtained, when the capacitor was charged at high current. Further analysis with an advanced charger showed that the charging current impacts the storage capacity: a high current led to less stored milliamperes-hour. This paper describes the results obtained from charging and discharging supercapacitors with different currents using a common experimental setup.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128410015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Intelligent system with remote transmission for monitoring telecommunication equipment parameters","authors":"Edmund Julien Spatariu, M. Popescu, A. Náaji","doi":"10.1109/SIITME.2015.7342348","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342348","url":null,"abstract":"Intelligent systems for monitoring telecommunication equipment parameters are especially useful in the case of locations that are not under human surveillance. The monitoring system described in our paper is a general one, but it can be adapted and implemented to monitor the specific parameters of equipment utilized in various fields, such as: medicine, agriculture, energetics, chemical industry, etc. In this paper we present the development of both architecture of the device and the specific software applications for such system. Monitoring systems of analogue and digital signals with Ethernet transmission consist of Devices Analyzing Input Signals (DAIS) and sensors. The main parts of the DAIS system are: printed circuit board, equipped with an industrial microcontroller, an Ethernet transceiver, resistors, capacitors and connectors. The software running on the microcontroller is developed in ANSI C (American National Standards Institute). It includes the C and C ++ GCC compiler (GNU Compiler Collection), an assembler and a simulator that facilitates application development and testing. The alarm monitoring and control application can be run from any electronic computing device equipped with an operating system using TCP/IP and has a browser that supports Java-Script. The web application is designed for reading the values displayed by the DAIS system, interprets and show them in a format accessible to browsers. In case of detecting any errors, the application puts the device in the “Alarm List” and sends a warning sound to the dispatch staff, directly from the browser. The detailed records on DAIS system reported values are nonstop monitored and stored in a database, with the possibility of graphic display of all values up to a maximum of one year. Thus, parameters can be monitored, including main feed voltage, backup voltage, the external temperature of the equipment cabinet, internal temperature, relative humidity inside the cabinet, smoke sensor(s), the state of access door(s) to the cabinet, etc. Likewise, we sought to increase productivity and obtain an energy-efficient device that does not require maintenance, proposing a software solution for the management of processes being executed on the microcontroller, so that it is as customizable as possible using a web interface. The DAIS system is also an economical one, significantly less expensive than other systems existing on the market.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"162 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114679615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Pseudo-random generator using PUF circuits and Salsa stream cipher","authors":"A. Stanciu, A. Craciun, F. Moldoveanu","doi":"10.1109/SIITME.2015.7342350","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342350","url":null,"abstract":"The paper presents the concept and the implementation of a hardware pseudorandom generator based on Salsa stream cipher and a unique identifier composed of PUF circuits. The pseudorandom generator is implemented on a hardware reconfigurable FPGA platform and it is designed to be used in FPGA security applications. Many of the real time complex applications designed on FPGA platforms need speed computations of data and in the same time security protection of sensitive or private information. Combining the Salsa stream cipher with a device unique identifier we create a fast method for data encryption/decryption on FPGA applications like Systems on Chip.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130691352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Nondestructive optical inspection system for the dicing street quality of copper/low-k wafer","authors":"Sheng-Feng Lin, Cheng-Huan Chen, C. Lo","doi":"10.1109/SIITME.2015.7342299","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342299","url":null,"abstract":"To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131690506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigating mechanical performance of PLA and CA biodegradable printed circuit boards","authors":"A. Géczy, D. Nagy, I. Hajdu, Á. Kmetty, B. Szolnoki","doi":"10.1109/SIITME.2015.7342293","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342293","url":null,"abstract":"The paper presents a set of experiments investigating the mechanical performance of PCBs manufactured from biodegradable, sustainable polymers, compared to conventional materials. Cellulose Acetate (CA), Polylactic Acid (PLA) and Flame-Retardant Class 4 (FR-4) substrates were compared during the experiments. The methods involved dynamic mechanical analysis (DMA), three-point bending tests and UL 94 flammability tests. Preliminary results show that the overall performance of the basic biodegradable, sustainable PCBs are considerably weaker compared to FR4 boards, however further improvements with additives and use in special applications can point to practical purposes of the substrates.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130179637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Aspects on thermophisycal properties of interconnection structures for power LEDs applications","authors":"M. Branzei, M. Vlădescu","doi":"10.1109/SIITME.2015.7342300","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342300","url":null,"abstract":"The printed circuit boards (PCB) and the dedicated interconnection structures have an important role for the thermal regime of power LEDs modules (PLEDM). There are two situations from the point of view of the heat transfer sense: toward PLEDM during assembly process, and from PLEDM to environment during operation. Their thermophisycal properties influence both heat transfer processes and it's mandatory to know the values of thermal conductivity and thermal diffusivity of the interconnection structures, in order to select the appropriate solution in different power LEDs applications. This paper presents the measurement results of three types of PCBs interconnection structures and makes a comparative analysis between them, in order to categorize them in terms of performance and create a data base for PLEDM design.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115109545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}