Aspects on thermophisycal properties of interconnection structures for power LEDs applications

The printed circuit boards (PCB) and the dedicated interconnection structures have an important role for the thermal regime of power LEDs modules (PLEDM). There are two situations from the point of view of the heat transfer sense: toward PLEDM during assembly process, and from PLEDM to environment during operation. Their thermophisycal properties influence both heat transfer processes and it's mandatory to know the values of thermal conductivity and thermal diffusivity of the interconnection structures, in order to select the appropriate solution in different power LEDs applications. This paper presents the measurement results of three types of PCBs interconnection structures and makes a comparative analysis between them, in order to categorize them in terms of performance and create a data base for PLEDM design.