Nondestructive optical inspection system for the dicing street quality of copper/low-k wafer

Sheng-Feng Lin, Cheng-Huan Chen, C. Lo
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Abstract

To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.
铜/低钾硅片切街质量无损光学检测系统
为解决铜/低k硅片激光预槽/清洗后模具模拟中边壁裂纹缺陷模式检测的问题,我们将生产线上的专用光学系统与自动光学检测系统相结合,采用逐片无损光学检测系统对铜/低k硅片的切街质量进行检测。实验结果表明,所提出的检测系统能够清晰地识别出侧壁裂纹缺陷,在生产线上具有一定的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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