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SCADA development for an islanded microgrid 孤岛微电网的SCADA开发
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342314
E. Lazar, R. Etz, D. Petreus, T. Patarau, I. Ciocan
{"title":"SCADA development for an islanded microgrid","authors":"E. Lazar, R. Etz, D. Petreus, T. Patarau, I. Ciocan","doi":"10.1109/SIITME.2015.7342314","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342314","url":null,"abstract":"The aim of this paper is to describe a SCADA tool for an intelligent microgrid. This application provides control over a smart microgrid that contains inverters, batteries and generators with power meters. In this system, the energy is generated by solar panels, a geothermal generator, a biomass generator and stored in batteries. The data is collected and represented on a PC Interface. The communication between the components and the application is accomplished through different protocols and standards. The connected devices can be detected, the inverters and power meter values, such as power and voltage, are read through the software application. These values, such as power, voltage, the speed of generators, can also be modified through this interface.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130358006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
A low-cost car vibration acquisition system 一种低成本的汽车振动采集系统
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342341
C. Chiculiţă, L. Frangu
{"title":"A low-cost car vibration acquisition system","authors":"C. Chiculiţă, L. Frangu","doi":"10.1109/SIITME.2015.7342341","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342341","url":null,"abstract":"The paper presents an acquisition system, intended to be used for recording the vibrations of the vehicles. The system can be used in easy-to-mount experiments, for assessment of the status of the pavement, status of the vehicle and comfort of the passengers. It is intended to allow an alternative to the large and expensive systems performing off-line vehicle vibrations measurements. It also can add valuable information to on-road evaluation of the pavement status. The main advantages of this system are: portable, easy to deploy in a regular car, small size components, easy to use acquisition and recording software. The small size and cheap MEMS accelerometers were chosen, instead of the expensive position and acceleration transducers, used in industrial diagnosis equipment. This is possible because the useful vibration spectrum of the cars does not exceed 100-200Hz. The modules are small-size, SMD technology, for reducing the influence on the vibration mass. The communication between the sensors and the central node uses the RS485 bus, which allows a simple protocol, on a reduced number of wires. The system was tested on real vehicles and the measured parameters were experimentally validated.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122388124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Comparison between the current feedback amplifier and the modern voltage feedback amplifier 电流反馈放大器与现代电压反馈放大器的比较
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342334
I. Suciu, P. Ogrutan, G. Pana
{"title":"Comparison between the current feedback amplifier and the modern voltage feedback amplifier","authors":"I. Suciu, P. Ogrutan, G. Pana","doi":"10.1109/SIITME.2015.7342334","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342334","url":null,"abstract":"Current feedback amplifiers and Voltage feedback amplifiers are the major components of the operational amplifiers. They are compared using Spice modeling tool due to simplicity and intuitive user interface. The Spice modeling of the two types of operational amplifiers can be produced by using only two base blocks: the voltage follower (buffer) and the current mirror. The novelty lies in the simplicity of the circuits chosen, the ability to use different Spice parameters for transistors, and circuit description in both graphic mode and text mode. In this way it provides a useful tool for students or anyone who wants to learn more about these two types of operational amplifiers.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128603971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Accurate modeling of supercapacitors for DC operation regime 超级电容器直流工作状态的精确建模
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342344
C. Ionescu, A. Vasile, R. Negroiu
{"title":"Accurate modeling of supercapacitors for DC operation regime","authors":"C. Ionescu, A. Vasile, R. Negroiu","doi":"10.1109/SIITME.2015.7342344","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342344","url":null,"abstract":"Supercapacitors or Electrochemical Double Layer Capacitors (EDLC) have been intensively studied in the last years for promising applications in vehicle traction used in parallel with batteries or fuel cells, but also for energy storage purposes. The investigations presented in this paper offer an electric model that can be used to model the charge/discharge behavior in DC regime or low frequency pulses. In this sense, the methods for characterization are according to standard IEC 62391. It should be mentioned here that the models include a nonlinear capacitance and all elements are temperature dependent. The values of the circuit elements are valid for the specific capacitor, but the procedure for testing can be used in general situations.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128706508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Modelling and implementation of intelligent sensor networks with applications in emergency situations management 在紧急情况管理中应用智能传感器网络的建模和实施
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342345
C. Lung, S. Sabou, A. Buchman
{"title":"Modelling and implementation of intelligent sensor networks with applications in emergency situations management","authors":"C. Lung, S. Sabou, A. Buchman","doi":"10.1109/SIITME.2015.7342345","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342345","url":null,"abstract":"Goal of this paper is to present some experimental results obtained in the process of modeling and implementation of a smart sensors network, system that can be integrated in an emergency communication network. The presented configuration of this system, allows a multiple possibilities for data transmission and analogue (voice) communication. Intelligent embedded systems are considered as one of the most important technologies of the 21st century. Over the past decades there have been several programs aimed to develop and implement micro wireless networks: Distributed Sensor Networks (DSN), Sensor Information Technology (Sense) [1,2]. Developing technologies for sensor networks has led to the emergence of various fields of application such as environmental monitoring, traffic control or safety of persons and property. During their development occurred in numbers and complexity inherent technical problems related to the security of these networks, their identification, control and data flow in the network.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"103 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127457964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mathematical analysis to control power transfer in resonant power converters 控制谐振功率变换器功率传输的数学分析
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342335
A. Taut, M. Daraban, O. Pop, G. Chindris, R. Fizesan
{"title":"Mathematical analysis to control power transfer in resonant power converters","authors":"A. Taut, M. Daraban, O. Pop, G. Chindris, R. Fizesan","doi":"10.1109/SIITME.2015.7342335","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342335","url":null,"abstract":"This paper aims to present a mathematical analysis method for resonant power converter, in order to control the transfer of power which is transmitted to the load. Starting from the idea that most switching power converters are using the pulse width modulation (PWM) technique to control the switching elements, the paper presents an analysis of the control method that can be applied on such converters and a mathematical analysis of the resonant load that can be found at the output of the circuit. On the other hand, the paper proposes an interactive interface to design and simulate a resonant power converter. The tool can be used by experienced engineers in power converters domain, to properly configure such a circuit, but also by those who are starting to learn and understand how these circuits are working. The tool allows seeing, not just the final values for the components that make the circuit, but also the waveforms form the main components. By doing so, the converter's area of operation can be observed, allowing to adjust the design in order to improve the design.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114299448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electrochemical migration of Ag in Na2SO4 environment 银在Na2SO4环境中的电化学迁移
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342357
B. Medgyes, Sándor Ádám, B. Szikora, L. Gál, Patrik Tamási
{"title":"Electrochemical migration of Ag in Na2SO4 environment","authors":"B. Medgyes, Sándor Ádám, B. Szikora, L. Gál, Patrik Tamási","doi":"10.1109/SIITME.2015.7342357","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342357","url":null,"abstract":"The effect of sulphate ion concentration on electrochemical migration (ECM) of silver was investigated by applying an in-situ optical and electrical inspection system. It was found that dendrites grow not only in an electrolyte solution with low sulphate ion concentration but also in electrolytes with medium and high or even saturated sulphate ion concentrations. According to the Mean-Time-To-Failure (MTTF) values, the migration susceptibility was decreased with the increase of sulphate ion concentration in case of low and medium concentration levels. However, the ECM susceptibility was increased at saturated concentration level.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134355700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A portable device for intercepting and retransmission of infrared modulated signals 一种用于拦截和重传红外调制信号的便携式装置
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342340
Costel Cherciu, Claudiu Ionut Cherciu, D. Năstac
{"title":"A portable device for intercepting and retransmission of infrared modulated signals","authors":"Costel Cherciu, Claudiu Ionut Cherciu, D. Năstac","doi":"10.1109/SIITME.2015.7342340","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342340","url":null,"abstract":"Infrared modulated signals are widely used in remote controls of common household appliances, as well as in business and public places. However, the transmission is not encrypted in any form, and can easily be intercepted and stored for future control of the appliance. This paper explains the functioning of a portable device which can intercept infrared (IR) signals and retransmit them when needed. The device was designed to include multiple functions, have a small number of buttons, and also to be portable, making it a functional keyring. As an added feature, the device can emit an infrared jamming signal, disabling any other user's commands. Finally, we created a small, low power, reliable device that can easily duplicate infrared codes. This makes the device a portable IR security penetration tool that can take over an appliance or disable its remote control.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115607475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Typical defects caused by untypical situations from assembling lines analysis 对装配线进行非典型情况下的典型缺陷分析
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342297
M. Branzei, I. Plotog, B. Marginean
{"title":"Typical defects caused by untypical situations from assembling lines analysis","authors":"M. Branzei, I. Plotog, B. Marginean","doi":"10.1109/SIITME.2015.7342297","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342297","url":null,"abstract":"In the context of globalization, taking into account the assembling line in electronic industry movements to the central and east European countries, the continuous production costs reduction tendency and the difficulties to accomplish both financials respectively technical aspects of the business, untypical situations could be encountered with consequence over production quality and reliability. In the paper typical assembling defects are presented and the causes analyzed relating to the real situations encountered on assembling lines. The matters determined by the distances between local branches or /and between them and mother company, the electronic components and materials transfercircuit and quality, the delay between the local assembling processes problems and technical decisions at the mother company level were considered. The wave contaminations aspects will be also analyzed. Some solutions will be proposed based on the analyses.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124618404","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mathematical model for a quasi-resonant converter 准谐振变换器的数学模型
2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI: 10.1109/SIITME.2015.7342326
I. Baciu, A. Taut, G. Chindris, A. Fodor
{"title":"Mathematical model for a quasi-resonant converter","authors":"I. Baciu, A. Taut, G. Chindris, A. Fodor","doi":"10.1109/SIITME.2015.7342326","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342326","url":null,"abstract":"The paper presents a mathematical model for a quasi-resonant converter. This type of converter was analyzed for an induction heating system. The system can have a series or a parallel resonant circuit as a load. In this paper we discussed only series resonant circuit load case.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133160409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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