2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

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Electronics for electro-hydraulic actuation system 电液驱动系统电子学
M. Blejan, I. Ilie, C. Cristescu
{"title":"Electronics for electro-hydraulic actuation system","authors":"M. Blejan, I. Ilie, C. Cristescu","doi":"10.1109/SIITME.2015.7342338","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342338","url":null,"abstract":"The electro-hydraulic actuation system was designed and realized by INOE 2000 - IHP for Regional Air Services - Tuzla Airport. It is used on the Cabin Emergency and Escape Trainer CEET B732 for the Sea Survival School. The closed loop control system controller, that implements the actuation system functionality, was designed as a software application using dedicated PLC software tools. Common PLCs are not usually used in this kind of applications; the authors work consisted on finding ways to use them on electro-hydraulic closed loop actuation system. Addressing emerging applications with general purpose PLC is the novelty of authors work and the experimental results confirm the rightness of this approach.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114706006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Effect of solder joint volume on its shear fracture mode 焊点体积对其剪切断裂方式的影响
T. Garami, O. Krammer
{"title":"Effect of solder joint volume on its shear fracture mode","authors":"T. Garami, O. Krammer","doi":"10.1109/SIITME.2015.7342301","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342301","url":null,"abstract":"The crack behavior of the chip-scale 0603 (1.5 × 0.75 mm) size resistor was investigated during shear test, while the amount of the solder alloy was decreased. The resistors were soldered with the same thermal profile using vapor phase reflow soldering technique. During the sample preparation the aperture size of the stencils were decreased while the thickness of the stencil foils was the same in all cases. The minimum applied surface ratio was 0.66. After shear tests, the surface of the cracked area was investigated with optical and scanning electron microscopy (SEM). With energy dispersive spectroscopy (EDS), the composition of the investigated layers was detected and it helped to recognize the layer-structure.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121715996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of current carrying capacity of silver-based conductive pastes for PCB repair PCB修复用银基导电浆料载流性能分析
A. Drumea, C. Marghescu
{"title":"Analysis of current carrying capacity of silver-based conductive pastes for PCB repair","authors":"A. Drumea, C. Marghescu","doi":"10.1109/SIITME.2015.7342343","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342343","url":null,"abstract":"This paper presents some investigations on the current carrying capabilities of PCB traces repaired with silver-based conductive paste. Such PCB traces with different parameters (width, gap and substrate) are tested at different currents and electrical and thermal measurements are performed. An automated measurement system is used for observing any change in trace resistance for the time span of each test.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131828549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
Low computational method for siren detection 汽笛检测的低计算方法
R. Dobre, V. A. Nita, A. Ciobanu, C. Negrescu, D. Stanomir
{"title":"Low computational method for siren detection","authors":"R. Dobre, V. A. Nita, A. Ciobanu, C. Negrescu, D. Stanomir","doi":"10.1109/SIITME.2015.7342342","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342342","url":null,"abstract":"A driving assistance system which can detect the sound produced by sirens and warn the driver has indisputable advantages: diminishes the numbers of accidents involving emergency vehicles, saves lives by influencing the drivers to take early actions in order to clear the way for these vehicles. The United States National Highway Traffic Safety Administration reported in 2012 a number of 60 accidents involving emergency vehicles travelling with the specific signals (sounding siren, blinking lights) in use in which at least one person died preceded by 51 in 2011 and 67 in 2010. There are situations when hearing the siren plays a critical role in avoiding an accident, for example at crossroads. In such cases the visual detection of the emergency vehicle can happen too late to avoid an accident. Also there are hearing-impaired persons who drive and have difficulties in hearing the siren. Siren detection systems exist but they use complex signal processing algorithms, demanding very high processing power and, in consequence, they are expensive. The paper presents a cost effective microcontroller based siren detection system which uses analog electronics blocks to decrease the needed processing power. The detailed system along with the MATLAB and SPICE simulation results are illustrated and discussed in the paper.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134215261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Activity recognition using an e-textile data acquisition system 使用电子纺织品数据采集系统的活动识别
I. Orha, S. Oniga
{"title":"Activity recognition using an e-textile data acquisition system","authors":"I. Orha, S. Oniga","doi":"10.1109/SIITME.2015.7342349","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342349","url":null,"abstract":"In our research we have proposed implementation of an activity recognition system based on a data acquisition system with e-textile components. One of the most important requirement of data acquisition systems used in human activity recognition is their level of acceptability or their level of obstruction [2, 4]. Starting from this important requirement, we designed a wearable data acquisition system using e-textile components, in the form of buttons with an attractive aesthetic, easy to integrate in clothing objects of a person. In our experiments the system was built on a cuff which can be easily attached to the hand or foot. Our system contains, on the wearable part, three Lilypad type, e-textile sensors (acceleration on three-axis, light, and temperature), a Lilypad Arduino microcontroller module, and a communication module which consist in a LilyPad XBee module with an XBee 1mW Trace Antenna module integrated. For receiving data, on the fixed part of the system, we have an Arduino communication module with an XBee module attached, and an Arduino Uno platform connected to a PC through a serial port. For activity recognition, data files are transferred to a PC, and data is processed in the Matlab using artificial neural networks as classifier.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129451171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Guidelines on thermal management solutions for modern packaging technologies - a review 现代包装技术热管理解决方案指南。综述
A. Fodor, G. Chindris, D. Pitica, R. Jano
{"title":"Guidelines on thermal management solutions for modern packaging technologies - a review","authors":"A. Fodor, G. Chindris, D. Pitica, R. Jano","doi":"10.1109/SIITME.2015.7342292","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342292","url":null,"abstract":"Thermal management for modern electronic systems can follow two fundamental paths: one concentrates design efforts towards low power/high efficiency electronic circuits/components, the other implies, where the previous one reaches its limits, optimizing thermal transfer in the entire system at chip level, package level, and PCB/assembly level. Thus, exploring all methods of improving heat transfer at chip/package/assembly levels can generate a guideline for common/specific approach that can be used at the earliest stage of a design. The current research gives an overview of latest packaging technology along with required thermal management measures and proposes a consistent methodology of Design for Thermal Management.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129741379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Challenges and solutions for advanced sensing of water infrastructures in urban environments 城市环境中水基础设施先进传感的挑战和解决方案
G. Suciu, A. Vintea, Stefan Arseni, Cristina Butca, Victor Suciu
{"title":"Challenges and solutions for advanced sensing of water infrastructures in urban environments","authors":"G. Suciu, A. Vintea, Stefan Arseni, Cristina Butca, Victor Suciu","doi":"10.1109/SIITME.2015.7342351","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342351","url":null,"abstract":"Our hypothesis is that in order to extract relevant information from a sensor network placed to monitor or control urban behavior, the data received has to be first manipulated to determine the most impactful components and then analyzed. At urban construction sites, huge numbers of automatic monitoring sensors are installed in the influence zone of the construction along the city, above ground and underground. We calculated that quite often sensors are damaged or cannot transfer their data temporarily. In these cases, safety-relevant data is lost quite often making data interpretation impossible. This paper presents a method to solve more efficiently the often occurring `missing data' problem when monitoring under difficult urban environmental conditions, compared to existing solutions. The main contribution of the paper consists in evaluating the challenges of monitoring urban environments and designing an advanced sensing system for water infrastructures.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129801631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
A research of the characteristics of materials used in the construction of EDLCs edlc建筑材料特性研究
R. Negroiu, N. Badalan, A. Vasile, C. Marghescu
{"title":"A research of the characteristics of materials used in the construction of EDLCs","authors":"R. Negroiu, N. Badalan, A. Vasile, C. Marghescu","doi":"10.1109/SIITME.2015.7342302","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342302","url":null,"abstract":"Supercapacitors, also known as EDLC (Electric Double Layer Capacitor), are passive components with exponential accumulation of electrical charge. This paper presents the characteristics of EDLC depending on the materials used in their construction. Thus, using different materials for the electrodes and/or for the electrolyte can influence EDLC performance. The most common electrode is carbon based and is used with an organic or aqueous electrolyte. EDLC has three main forms: active carbon, carbon-based aerogels and carbon nanotubes with organic or aqueous electrolyte.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"244 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115283562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Designing of microcontroller based Syringe Pump with variable and low delivery rates for the administration of small volumes 基于单片机的小剂量可变低输送率注射泵的设计
Muhammad Ahmed Khan, Osama Mazhar, Sameed Tehami
{"title":"Designing of microcontroller based Syringe Pump with variable and low delivery rates for the administration of small volumes","authors":"Muhammad Ahmed Khan, Osama Mazhar, Sameed Tehami","doi":"10.1109/SIITME.2015.7342311","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342311","url":null,"abstract":"Delivering medications and fluids intravenously is a common practice in modern medical procedures. Administering medications or fluids directly into a patient's blood circulation results in a predictable and immediate absorption of the drug or fluid administered, this may play a vital role in the treatment of certain acute conditions which require immediate action by drugs or fluids. Syringe Pumps are highly useful in delivering a precise quantity of the substance at specific periods of time as required. This research presents a proposal to create a cost effective working prototype of syringe pump for variable and low delivery rates for the administration of small volumes. The presented Syringe Pump utilizes a lead-screw mechanism that is driven by a stepper motor which itself is controlled by an electronic circuit based on an 89S52 microcontroller that works as the brain of the system and controls all other peripherals like LCD, Keypad and other components. Due to the possibility of the complete prototyping of the syringe pump locally from the electronic hardware designing to the code writing and to the mechanical assembly designing and fabrication it allows us in future to modify this design in accordance to the need of any related industry at home letting off the dependency on manufacturers from other parts of the world and may even allow us to export this cheaper product abroad.","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124939747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Metal particle filled, thermally conductive polymer composites for electronic packaging applications 电子封装用金属颗粒填充的导热聚合物复合材料
I. Tavman, T. Evgin
{"title":"Metal particle filled, thermally conductive polymer composites for electronic packaging applications","authors":"I. Tavman, T. Evgin","doi":"10.1109/SIITME.2015.7342290","DOIUrl":"https://doi.org/10.1109/SIITME.2015.7342290","url":null,"abstract":"Conductive polymer composites were prepared by mixing high density polyethylene (HDPE) with aluminum powder at various volumetric concentrations, then the mixed sample is placed in a die and melted at 185°C under 4 MPa pressure. The filler content varies from the pure HDPE to 50% by volume of aluminum particles. After cooling and solidification under pressure the samples are taken out of the die, for thermal diffusivity measurements, samples are rectangular in form with 20mm length, 10mm width, and 1mm thickness. The matrix material is commercial high density polyethylene in powder form, density 0.968 g/cm3 melt index 5.8 g/10min. The metallic filler is aluminum in the form of fine powder with particle size in the range of 10-20 microns, the solid density of Al is 2.7 g/cm3 and its solid thermal conductivity 204 W/mK. A microscopic study shows that aluminum particles are uniformly distributed in HDPE matrix, with no voids in the composite structure. Thermal diffusivity measurements were performed using photothermal method with step heating. Thermal diffusivity varied from 2.45×10-7 m2/s for pure HDPE to 11.30×10-7 m2/s for 50% by volume of aluminum particles. Heat capacities were also measured using a differential scanning calorimeter (DSC).","PeriodicalId":174623,"journal":{"name":"2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123769740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
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