焊点体积对其剪切断裂方式的影响

2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI:10.1109/SIITME.2015.7342301

T. Garami, O. Krammer

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引用次数: 0

摘要

在剪切试验中，研究了片状0603 (1.5 × 0.75 mm)电阻在钎料合金用量减少的情况下的裂纹行为。采用气相回流焊技术将电阻焊接成相同的热轮廓。在样品制备过程中，模板孔径减小，而模板箔厚度不变。最小施表面比为0.66。剪切试验结束后，利用光学显微镜和扫描电镜(SEM)对裂纹区域表面进行了研究。利用能量色散光谱(EDS)检测了所研究层的组成，有助于识别层的结构。

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Effect of solder joint volume on its shear fracture mode

The crack behavior of the chip-scale 0603 (1.5 × 0.75 mm) size resistor was investigated during shear test, while the amount of the solder alloy was decreased. The resistors were soldered with the same thermal profile using vapor phase reflow soldering technique. During the sample preparation the aperture size of the stencils were decreased while the thickness of the stencil foils was the same in all cases. The minimum applied surface ratio was 0.66. After shear tests, the surface of the cracked area was investigated with optical and scanning electron microscopy (SEM). With energy dispersive spectroscopy (EDS), the composition of the investigated layers was detected and it helped to recognize the layer-structure.

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2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)

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