Guidelines on thermal management solutions for modern packaging technologies - a review

Abstract

Thermal management for modern electronic systems can follow two fundamental paths: one concentrates design efforts towards low power/high efficiency electronic circuits/components, the other implies, where the previous one reaches its limits, optimizing thermal transfer in the entire system at chip level, package level, and PCB/assembly level. Thus, exploring all methods of improving heat transfer at chip/package/assembly levels can generate a guideline for common/specific approach that can be used at the earliest stage of a design. The current research gives an overview of latest packaging technology along with required thermal management measures and proposes a consistent methodology of Design for Thermal Management.