Proceedings of Japan International Electronic Manufacturing Technology Symposium最新文献

{"title":"Future Prospects For The Multimedia Society And Hard-ware Technologies","authors":"H. Yasuda","doi":"10.1109/IEMT.1993.639279","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639279","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122475389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards","authors":"D. Miller, T. Gregorich, Iioang Hoang, S. Mok","doi":"10.1109/IEMT.1993.639749","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639749","url":null,"abstract":"for 1993 Japan Internatlonal E l e c t r o n i c Manufacturing Technology Symposium Repair of Flip Chips (DCA) on Glass Epoxy P r i n t e d C i r c u i t Boards Denny Miller, Tom Gregorich, Hoang Hoang, Swee Mok Motorola Corpora te Manufacturing Xesearch C e n t e r Room 1014 1301 E a s t Algonquin Road Schaumburg, IL USA 60196 708-576-3234, 7 08-576-2111 (FAX) Direct Chip Attach (DCA) is becoming an attractive packaging alternative where one or more of the following factors are technology drivers: density, cost , functionality, quality, and assembly yield. While the technology has proven to be robust and reliable, the need f o r a repair process does e x i s t , particularly when multiple chips are attached on a single board. This paper describes a repair process for removing and replacing DCA devices on glass e p o x y substrates. Process parameters and reliability data of replaced devices will also be shown and discussed. 191 lgS3JapanhMEledronicsManutaduringTechndoeySymposium","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"54 11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129568384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High Speed Electrical Characterization And Simulation Of A Pin Grid Array Package","authors":"T. Goodman, H. Fujita, Y.M. Rakami, A. T. Murphy","doi":"10.1109/IEMT.1993.639776","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639776","url":null,"abstract":"A 181 pin Pin Grid Array (PGA) was characterized using time and frequency domain techniques to identify major sources of signal degradation. The pins, as well as a layer of plating lines that was included for electroplating the exterior metal surfaces, were found to have a deleterious effect on the signal transmission within the package. In addition, a ground delay resulting from the separation of the signal pin and its nearest ground pin was seen to cause significant degradation in signal lines whose pin was far from a ground I/O. For signal lines that are geometrically equivalent due to package symmetry, this effect was seen to increase with increasing signal/nearest ground pin distance, resulting in as much as a 79% increase in the package risetime in some lines. These effects were simulated using a model whose elements were based on actual physical structures, within the package and whose parameters were derived from experimental measurements. >","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130215187","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Recent Progress On Opto-electronics Technology For Future Muti-media World","authors":"K. Kobayashi","doi":"10.1109/IEMT.1993.639819","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639819","url":null,"abstract":"Opto-e I ect r on i cs techno I og i es are successively penetratina into our life through optical fiber transmission. optical disk applications and so on. In this paper. recent progress on optical fiber transmission is first reviewed and manufacturing technologies for optical modules a nd subsystems are then discussed. Issues related to future trends on optical modules and subsystems will also be discussed. Opto-electronics h as b een expanding its applications area since. for example. the birth of lasers in the e arly 1960's. Among the most brilliant ones are o ptical fiber transmissions, and optical disks. These o p to-e I ectr onics techno 1 og i es can be featured by their high c apacity for data transmission or data storage. These abilities will be i ndispensable for realizing future multi-media world, where audio. video a nd data are t reated freely in an integrated scheme. This paper reviews recent progress on opto- electronics technologies with emphasis on optical fiber transmission. Manufacturing technological issues characteristics to optical components, modules or subsystems will also be discussed.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115018637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A New Ionic Type Photosensitive Polyimide For Microelectronics","authors":"Masaya Asano, M. Eguchi, K. Kusano, Katsuhiro Niwa","doi":"10.1109/IEMT.1993.639754","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639754","url":null,"abstract":"Toray's Ionic type photosensitive polyimide, \"Photoneece\" is widly used as interdielectrics and protection layers for microelectronics because of its features such as removal of photoreactive groups at low temperature, excellent thermal, mechanical and electrical film properties and excellent adhesion to various substrates. Toray has developed new type \"Photoneece\" UR-5100, which is the low stress photosensitive polyimide. In addition to low thermal expansion coefficient (25ppm/\"C), \"Photoneece\" UR-5100 features also high resolution with more than 2.0 aspect ratios in 40 pm imaged film and excellent mechanical properties of the cured film such as high elongation (>2OX) and tensile strength (>200MPa) even after 60 hours heat treatment at 350°C. \"Photoneece\" UR-5100 can be applied in multi-chip modules (MCMS), hybrid circuits, ICs and LSIs. In this report the characterization and processing of this \"Photoneece\" UR-5100 are described.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128289549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Towards Low Cost High Density Bumping","authors":"A. Aintila, E. Jarvinen, S. Lalu","doi":"10.1109/IEMT.1993.639289","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639289","url":null,"abstract":"A chemical batch bumping method is suggested both for Flip-Chip and TAB (tape automated bonding) appli- cations Several suggestions from earlier studies by other authors are referred and commented. Experiments with a selective Ni/Au bump structure have been carried out in a prototype processing line. The initial results confirm that this method has low capital, material and labor cost As no die specific tooling is required the process will have fast tum-around time and potential even for low vol- ume low cost wafer bumping, as well as for mass production.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132691638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Nonvolatile Memory Based On Reversible Phase Transition In Chalcogenide Semiconductor Thin Film","authors":"K. Nakayama, T. Kitagawa, K. Hashimoto, K. Ohtuka, A. Kitagawa, M. Suzuki","doi":"10.1109/IEMT.1993.639363","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639363","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126475172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Liquid Crystal Displays: Tue Prominent Canoidate For Multimedia Displays","authors":"F. Funada","doi":"10.1109/IEMT.1993.639281","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639281","url":null,"abstract":"Since the later half of 1 9 8 0 s . a word of MULTIMEDIA has been frequently utilized in our electronics industry. llowever as i t has been under development stage even now. concept of the word has not also been clear enoughlr. Then. in this lecture I would like to use the word which is defined as follows: MULTIMEDIA is the property of handling several types of representation-media which are text(numerics and characters). graphics. images a n d s o u n d s p r e s e n t e d at t h e s a m e t i m e (synchronously). S o . in the MULTIMEDIA it is meaningful that each medium can be pick-uped independently and also be processed with effective interrelationships among them. Of cource. f o r realizing such works it is a major premise to exist a fundamental technology of an unified digital processing technology. what we call a computor system. Anyway, what is a merit f o r us utilizing a MULTIMEDIA system? The answer is substantiality o f functions of an interfacc between man and the machine as the information processor: computor. In another word, it would like to be called as a realizing a true user-friendly t o o l which aimes to play a role of a communication from man to man using with several familiar representations including conversations, gestures. written characters and others with a reality and without a scnce of incongruity as an out-put of the computor. Display devices are the m o s t important hardwares f o r the out-put in the MULTIMEDIA system because they use a visual sensation o f the highest information transfer-ability,more than 85%. in human sensations which are visual. auditory, olfactory. gustatory. and cutaneous sensations. In addition. the display devices should have a good compatibility with a digital processing and enough safety for an operation. In this lecture, the prospects of the operational principle, the current statous, and the future trends o f the liquid crystal display(LCD) technologies which have both a excellent compatibility with L S I s and high performances competing with CRTs as the prominent candidate for the MULTIMEDIA displays are presented.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133494485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A New Circuit Patterning Method For PCBs","authors":"A. Yoshizumi, S. Shimizu","doi":"10.1109/IEMT.1993.639757","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639757","url":null,"abstract":"The authors have developed a new manufacturing technology for PCBs (printed circuit boards). This developed method is a dry process, without using etching and metal plating processes like the conventional one. So, no waste water is generated. Prototype PCBs were able to be obtained using a circuit pattemed relief metal plate. The PCB manufacturing industry has now changed into a plant intensive industry from a worldwide view. It is presently necessary to invest a large amount of money to produce PCBs to examine the circuit boards and for waste water disposal facilities. The technology of PCB was first invented 50 years ago, and 30 years have passed since its first manufacturing. The PCB manufacturing industry may now join the membership of grown-up industries. So, if we can develop a new method for making PCBs in a small plant with no waste water at low cost, we can contribute to the progress of the PCB manufacturing industry and to prevent environmental pollution. The electrmnductive paint printing method and the organic photoconductive printing method are now being examined by many researchers for the same purpose. But t hae methods have some disadvantages such as low electric conductivity and a poor peeling strength of the circuit board. The object of this work was to develop a method for manufacturing new PCBs that have good properties and can be fabricated at low cost without waste water. This paper is divided into three parts. The first part describes the circuit board fabricating procedure. The second part of this paper deals with the test mu i t of prototype laminated circuit boards. The thud part contains a summary and a conclusion. The new fabrication method for laminating circuit boards involves a circuit patteming procedure on individual plastic films, film laminations, and the through-hole making procedure. 2-1. New patteming Procedure The procedure of this patteming method is as follows (see 1). Make a circuit patteming relief metal plate (D). Heat the metal plate on a press machine. Place the copper foil (C) on the metal plate. ([i]) Depress the copper foil by vacuum. ([2D Place a plastic film substrate (B) and a silicone rubber sheet (A) on the copper foil. Press the film substrate on the copper foil by using the top platen of the press machine. ([3]) 0-7803-14326193 $3.00 01993 IEEE 230 A : Pad film B: Plastic substrate C: Copper foil D: Relief metal . plate ‘ E E: fracuum h o l e","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130966650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Cream Solder Inspection Technology By Projecting Phase-shifted Fringes","authors":"Y. Shlgeyama, N. Kakimori, Y. Yamamoto, Y. Iwata, K. Nlshigakl, H. Nakamura","doi":"10.1109/IEMT.1993.639773","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639773","url":null,"abstract":"The solder bonding is one of the most important elements of the high-density PUB mounting (packaging) process. As a result of the recent shift to surface mounting and further increase of mounting (packaging) density, being stimulated by the trend toward reduction of dimensions and weight of electronic devices, it is becoming more and more difficult to modify the solder joint after reflow process. Therefore strict quality control must be performed upstream in the production process. In order to ensure strict quality control in the cream solder print process the authors have developed a system which executes high-speed 3-dimensional contactless measurement of cream solder paste print profile and the in-line inspection of volume, profile, etc.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128326379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}