Proceedings of Japan International Electronic Manufacturing Technology Symposium最新文献

An Ultra Miniaturized Dielectric Band Pass Filter For 800 Mhz Band Cordless Telephone System 一种用于800mhz频段无绳电话系统的超小型化介电带通滤波器

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639371

T. Tsujiguchi, H. Katoh, H. Matsumoto

{"title":"An Ultra Miniaturized Dielectric Band Pass Filter For 800 Mhz Band Cordless Telephone System","authors":"T. Tsujiguchi, H. Katoh, H. Matsumoto","doi":"10.1109/IEMT.1993.639371","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639371","url":null,"abstract":"&SQUSX A new miniaturized dielectric band pass filter for 800MHz band cordless telephone terminal is developcd. This filter is surface mount device (SMD). Its construction is dielectric monoblock having plural coaxial extending holes, it resonates with a quarter wavelength TEM mode. This monoblock resonator has high dielectric constant (K=90) and its surfaces are covared with copper plating electrode except one surface. The volume has reduced to 60 percents of conventional type. One end of each resonator has stray capacitance (Cs)i, which create comb-line coupling between each resonator. As its open end of resonator is provided in the holes, RF leakage is suppressed. The input and output terminals of this filter are formed as the electrodes on both side surfaces of the monoblock that are isolated from outer conductor. Thus, it is able to apply for surface mount technology without metallic pin terminals. As compared with conventional filter, the number of parts of the filter is reduced from seven to one. Consequently the productivity of this filter is improved. Asthe new dielectric filteroccupiesso small area to mount, it is suitable to high density mount for a cordless telephone terminal.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123793210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development Of Zero X-y Shrinkage Sintered Ceramic Substrate 零X-y收缩烧结陶瓷基板的研制

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639759

H. Nishikawa, M. Tasaki, S. Nakatani, Y. Hakotani, M. Itagaki

{"title":"Development Of Zero X-y Shrinkage Sintered Ceramic Substrate","authors":"H. Nishikawa, M. Tasaki, S. Nakatani, Y. Hakotani, M. Itagaki","doi":"10.1109/IEMT.1993.639759","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639759","url":null,"abstract":"Studies of multilayered ceramic substrate are made briskly ,which makes it possible to design wiring patterns high densely and to mount bare IC chips. The multilayered cbramic substrate is expected for effectiveness for high functional, downsizing and confidential devices. In order to realize high density ceramic Multi-Chip-Module (MCM), multilayered ceramic substrate is required to satisfy demands for fine patterning, small packaging and low cost, Especially, sintering shrinkage of a substrate should be. controlled for fine patteming. Generally, the ceramic substrate undergoes its shrinkage of 10 to 15% and the shrinkage error is *OS%, so the substrate is not suitable for mounting bare IC chips. On considering of such problem, zero X-Y shrinkage sintered ceramic substrate (ZSS) has been developed by the conventional green sheet method, which arranges substrate green sheets between two no-shrinkage sheets, horizontal shrinkage during sintering is prevented to 0.18, and the shrinkage error i s f 0.05%. In this paper, we will report a material, process for prohibiting the horizontal shrinkage and properties of ZSS. .","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115587526","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

An In-line Vacuum Deposition System Wi[h A Capability Of Compo!ite Fabrication Process On Large Deposition Area 在线真空沉积系统的研究大沉积面积的ite制备工艺

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639287

H. Kauoka, Y. Kokaku, N. Ohroku, K. Furusawa, K. Abe

引用次数: 0

Diagnosis Of Dynamic Processes Described By Nonlinear Uncertain Models 非线性不确定模型描述的动态过程诊断

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639740

A. Shumsky

引用次数: 1

Hardware Technologies For Pen-based Computers 笔式计算机的硬件技术

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639282

H. Yamamoto

引用次数: 1

A Synthesis Of Adaptive Control Systems For Industrial Robots 工业机器人自适应控制系统的综合

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639742

V. Filaretov

引用次数: 2

Influence Of Newly Molding Compound Properties On Package Failure During Reflow Soldering Process 新成型化合物性能对回流焊过程中封装失效的影响

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639785

M. Murayama, Hiromi Ito, K. Tada, H. Fujioka, H. Kanegae

引用次数: 1

New Wave Soldering Machine For Zero Defect Soldering 新型波峰焊锡机，用于零缺陷焊锡

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639788

N. Hanamitsu, E. Ohtsubo, T. Takei, H. Takakusagi

引用次数: 0

Packaging Of Pointing Device For Notebook PC With 84/89 Keys 84/89键笔记本电脑指针装置的包装

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639796

S. Yamada, K. Twchiya

引用次数: 0

Comparison Of Reliability And Chacteristics Between Two Types Of Adhesiveless 2-metal Tab Tape 两种无粘接2-金属标签胶带的可靠性及特性比较

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639756

Y. Mashiko, S. Nishiyarna

引用次数: 0