两种无粘接2-金属标签胶带的可靠性及特性比较

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639756

Y. Mashiko, S. Nishiyarna

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引用次数: 0

摘要

有人说，无粘接的2-金属标签胶带是先进的LSI产品的包装材料的最佳候选人之一。然而，在起始材料和制造工艺方面仍存在一些问题。到目前为止，大多数传统的无粘性2-金属标签带都是使用铜溅射聚酰胺薄膜作为起始材料。以及形成铜痕迹的半添加过程。为了解决2金属TAB胶带的问题，我们开发了1)一种新的制造工艺，以无粘覆铜层压板为起始材料，采用减法工艺形成铜迹(图1)。制作了两种类型的原型样品和试验片，比较了两种制造工艺的可靠性和特性。

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Comparison Of Reliability And Chacteristics Between Two Types Of Adhesiveless 2-metal Tab Tape

It has been said that adhesiveless 2-metal TAB tape is one of the best candidates for the packaging material of advanced LSI products. However, there are still some problems with the starting material, and the fabrication process. Until now most conventional adhesiveless 2-metal TAB tape has used copper sputtered polymide film as the starting material. and a semi-additive process to form the copper trace. In order to solve the problems with 2-metal TAB tape, we developed 1) a new fabrication process, in which adhesiveless copper clad laminate is used as the starting material, and a subtractive process is used to form the copper trace ( Figure 1 ). WO types of prototype samples and test coupons were made to compare the reliability and characteristics of these two fabrication processes.

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Proceedings of Japan International Electronic Manufacturing Technology Symposium

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