Proceedings of Japan International Electronic Manufacturing Technology Symposium最新文献

{"title":"Surface Mount Type Sam Filter For Hand-held Telephones","authors":"","doi":"10.1109/IEMT.1993.639365","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639365","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126285493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Manufacturing A Fine Pattern Fpc Of Aluminum-polyester Composite","authors":"I. Kohara, M. Takaishi, Y. Yarnarnoto, Hiroya Ito, K. Kondo","doi":"10.1109/IEMT.1993.639356","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639356","url":null,"abstract":"In contrast to Cu, for metals with larger ionization potential than that of hydrogen, the potential difference between etchant and the metal surface generate hydrogen and the metal dissolves. The etching by such a corrosion cell formation is also true for the acidic condition such as in HC1 or in concentrated H3P04 also under basic conditions in aqueous NaOH. The mechanism explains the difficulty to achieve the fine pattern etching of Al. Compositions of the Al/PET used are summarized in Figurel. Chemically stable thin aluminum oxide layer covers the Al surface. The dissolution rate of the oxidized layer is much slower than the metallic Al dissolution rate by the corrosive cell formation. Therefore the two sides of the A 1 2 0 3 layer resists the etching while the metallic Al layer reacts to dissolve quickly. This results in the great undercut (Figure2). CO-existing other metals, the direction of Al metal crystal lattice, its perturbation or residual strain cause the potential differences. The potential in-homogeneity occurs in the etching reaction. The effects of different metal ions not only in the case of FeC13 etching system but also with contaminated trace amounts of impure metals such as Fe, Cu and Si cause the difference in etching rate. This impure metal suffers dissolution and deposition alternatively. When attachment to .the Al surface, the Al-dissolution rate becomes greater because of the larger potential difference. The attachment of the generated H2 bubble on the Al layer stops the etching on the attached area.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121286295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Comparative Study Of Cohhercially Availarle No-Clean Solder Pastes : The Influence Of A Protective Atmosphere","authors":"N. Potier, S. Mellul, Marc Leturmy","doi":"10.1109/IEMT.1993.639794","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639794","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128140875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Automotive Printed Wiring Board Manufacturers Succeed With 100% Solids Con Formal Coatings And No-clean Flux","authors":"S. Wilson, M. Fogelsinger-Huss, M. Strong","doi":"10.1109/IEMT.1993.639347","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639347","url":null,"abstract":"Solvent-based conformal coatings have been used in the U.S. for many years to protect printed wiring boards (PWB) in automotive, military, and other applications, With changing laws and environmental concerns, strong emphasis is being placed on conversion to solventless coatings of all types. This paper describes the development, testing, and prove-out of a solventless conformal coating that works with no-clean fluxes and pastes and still maintains high reliability in the harsh automotive underhood environment. Introduction In printed wiring board (PWB) manufacturing, the desire to eliminate solvents is coupled with the need to continuously reduce process costs, To achieve both of these goals, a solventless conformal coating is required that will pass product lifecycle testing without board cleaning after soldering. The elimination of solvent cleaning would dramatically reduce the production costs in terms of capital, cycle time, toxicity, disposal problems, and labor. Eliminating solvent cleaning requires the use of no-clean fluxes and pastes. No-clean fluxes and pastes usually contain resins, acids, solvents, and surfactants that can introduce ionic surface contaminants as well as interfere with the cure chemistry of the conformal coating. Any conformal coating developed for today's ideal processing would need to be compatible with a no-clean flux in addition to being free of solvents. This paper describes the development of a solventless coating for use with no-clean flux or paste and the production trial that demonstrated the potential of the new coating/flux system. The paper also discusses the close partnership between supplier and customer necessary during screening and testing of coatinglflux systems. Coating Development Many inherent advantages can be associated with selecting silicone polymer systems as the material of choice. Silicones work particularly well in electronic applications under harsh environmental conditions because they are highly resistant to moisture and they have excellent electrical properties under a wide range of temperatures, typically -40 to +150\"C. Silicone elastomers are flexible materials, providing good stress relief for delicate components that undergo thermal cycling and mechanical stresses. \"hey are also repairable in that they can be cut away or soldered through for component removal and then reapplied. The first question to be addressed during development was the cure chemistry of the coating, which depends partly on the coating process that would be used. In this case, the customer wanted to dip-coat the boards, which would require a one-part coating with good pot life, low moisture sensitivity during processing, no skin-over, and rapid cure upon heating without a by-product. Typical cure chemistries for silicone Table 1 Silicone cure chemistries Chemistry Character is t ics One-part condensation Moisture sensitive, tends to skin over, short bath life, slowt 7 moisture-dependent cure, by-product during c","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130775816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Trace Element Effect On Tin-lead (60%-40%) Solder Wetting","authors":"N. Wu","doi":"10.1109/IEMT.1993.639348","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639348","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125017430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An Ultra Miniature Surface Mount Radio Frequency Coaxial Connector","authors":"H. Ogura, K. Sayanagi, Tadahiro Yorita","doi":"10.1109/IEMT.1993.639361","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639361","url":null,"abstract":"A& AII ultra miniature surface mount radio frequency(RF) coaxial connector has been developed. This connector consists of a receptacle and a right angle plug. The receptacle is surface mountable. The mated height of the receptacle and the plug is 3 mm from the printed circuit board(PCB) surfilce. Voltage standing wave ratio(VSWR) is less than 1.2 up to 3 GHz. The slitless construction is adopted for mating mechanism and conductor pattem on PCB is optimized to reduce the reflection of RF signals.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114376281","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}