Proceedings of Japan International Electronic Manufacturing Technology Symposium最新文献

{"title":"Error-free Subsystem Optical Interconnections","authors":"A. Takai, M. Haneda, T. Kate, S. Hanatani, Y. Mocegi","doi":"10.1109/IEMT.1993.639812","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639812","url":null,"abstract":"Subsystem optical interconnections based on synchronoils parallel optical transmissions have been developed. To achieve error-free unformatted data transmission, use of laser diode arrays and a fixed decision level receiver arrays are adopted. We fabricated and demonstrated compact (0.2 cckh), low power (140 mW), fully integrated 8-channel interconnection module with an ECL interface. Laser-diode/photodiode arrays were mounted on submounts with low parasitic grounding inductance.Laser driverheceiver array ICs are fully DC coupled and designed to be low cross talk. The noise margin of 15 pW for a BER at 200 Mbit/s was obtained using a newly developed BER measurement method, while measured cross talk was 10 pW. Table 1 Target performance I =. 100 m I Length I I I Integration 1 8 ch < 2.0 ns I ~ ~ ~ I Skew I Highly complex interconnections become a bottleneck in the design of advanced information systems, such as high throughput computer systems and large capacity switching systems. Optical fiber has many advantages for use in making interconnections, such as wide bandwidth, low loss, low cross talk, light weight, small cross-section and immunity from EM1 and ground voltage interference. Subsystem optical interconnections pig. 1) based on synchronous parallel optical transmission enable high throughput and density, and allow the interconnection length to be increased. We previously reported an 8-channel subsystem optical interconnection using long-wavelength laser diode (LD) and single-mode fiber (SMF) arrays [l]. The target performance of the subsystem optical interconnection is shown in Table 1. Skew suppression (reduction of the transmission delay time difference), error-free unformatted data transmission, small dimensions and low power consumption are all important criteria. In this paper, we report on the details of our newlydeveloped compact, low power, error-free unformatted data interconnection modules.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125195341","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability","authors":"Y. Kojima, J. Sakiura, K. Matsunaga","doi":"10.1109/IEMT.1993.639745","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639745","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134009363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Near Surface Region Of Modified Saw Substrates As A Component Of Layered Structure","authors":"J. Kapelewski, A. Dukata","doi":"10.1109/IEMT.1993.639762","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639762","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131282025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Stud-bump-bonding Technique For High Density Multi-chip-module","authors":"Y. Bessho, Y. Tomura, Y. Hakotani, M. Tsukamoto, T. Ishlda, K. Omoya","doi":"10.1109/IEMT.1993.639807","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639807","url":null,"abstract":"technique for high density Multi-Chip-Module (MCM), using called Stud-Bump-Bonding (SBB) technique, which can bond bare LSI chips directly to ceramic substrate. Au bump is formed on electrode pad of LSI chip by a wirebonding apparatus. Each Au bump has two-stepped construction and bonded with a conductive adhesive to an electrode terminal formed on the ceramic substrate. The conductive adhesive is very flexible and strong in bond, thus resisting thermal and mechanical stresses. Moreover, repair technique has been developed. 100 ,u m pitch electrode pads of LSI chip can be bonded to electrode terminals. The bonding resistance is less than 50 m i l . memory module. High density and reliability in bonding for MCM have been attained by the SBB technique. We have developed advanced flip-chip bonding We have applied the SBB technique to high density MCM for","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132868589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Study Of Polyimide Adhesion To Epoxy Resjn In PFP Using Multivariate Analysis Of XPS Spectra","authors":"K. Takeuchi, K. Tsutsui, N. Miura","doi":"10.1109/IEMT.1993.639283","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639283","url":null,"abstract":"The adhesion between polyimide and mold resin is one of the key characteristics of packaging reliability in semiconductor device manufacturing. Poor adhesion causes sometimes reliability problems on plastic flat packaging (PFP) products. The requirements of adhesion enhancement and its evaluation will increase, accompanied with thinner and higher density packaging products. Polyimide adhesion to mold resin has been studied from a view point of surface treatment of passivation material. Polyimide surface, modified through various conditions was characterized by X-ray photoelectron spectroscopy (XPS), contact angle and adhesion strength. XPS spectra was curve fitted and classified by multivariate analysis. The result shows that XPS cubon peak pattems are classified between good and poor samples by two factors, which are the moisture absorption and the oxygen content (C=O bonding) in polyimide. The moisture is proportional to the contact angle of glycerin droplet on the surface. Oxygen content increases with the surface roughness by 4 plasma treatment. It indicates that the adhesion between polyimide and epoxy resin is related to both chemical and mechanical interactions of two materials. These factors are shown on the score plot by multivariate analysis.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132079087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optical Delay Tester","authors":"K. Ozaki, T. Nagai, S. Wakana, Y. Sato, Y. Goto","doi":"10.1109/IEMT.1993.639767","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639767","url":null,"abstract":"The authors have developed an optical delay tester based on electro-optic sampling, and designed a prototype to test the timing of high-speed IC chips. The device puts an electro-optic crystal in contact with the terminals to be tested and measures the voltage waveform applied to the crystal. Measurement precision is 100 mV or better and timing precision measurement is 50 ps.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129595749","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Proceedings Of 1993 Japan International Electronic Manufacturing Technology Symposium","authors":"","doi":"10.1109/IEMT.1993.639277","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639277","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125533774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development Of A Laser Function Trimming For Car Radio Tuners","authors":"Y. Kagiya, T. Sato, T. Wada","doi":"10.1109/IEMT.1993.639378","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639378","url":null,"abstract":"We develoDed a suner trimmable chip resistor in order to achieve adjustment characteristics which rival the resistance change characteristics of trimmer potentiometers. The major advantages of this super trimmable chip resistor are listed below. (1) By making a single cut, a resistance change ratio which is 10 times higher has :been obtained, and the chip has nearly linear resistance change characteristics. (2) The current noise is not increased by trimming cut. ( 3 ) No current concentration. The hot spots do not occur and the resistor can be used until the point of complete cutoff. ( 4 ) The resistor has no directivity and automatic mounting is easy. Also, self alignment is good. (5) A high stability of setting resistance can be maintained. The above super trimmable chip resistor has been installed in the car radio tuners and laser function trimming has been realized. Results have been confirmed that it is possible to absorb the assorted variations and ad just the tuner to the appropriate characteristics and that this resistor has sufficient trimming accuracy, reproducibility and stability. 1. 1ntroduc:tion :En addition to high electrical characteristics of the car radio tuners, there are also strong demands for smaller and thinner size, automated manufacturing, adjustment and testjng, and lower costs. To meet ,these many customer demands, we developed (a new radio tuner pack series. In this paper, we will report concerning the new trimmable chip resistor and the laser function trimming applied in this new radio tuner pack. 2. Object 'We focused our attention on the trimmer potentiometers, conventionally installed on the outside of the tuner pack and adjusted during the radio equipment assembly process. We realized that by making this trimmer potentiometer into a trimmable chip resistor, we could gain many advantages. Among these are the following. 0-7803-14328193 $3.00 olS3 IEEE (1) The trimmer potentiometer mounted on the mother-board of the car radio equipment could be incorporated in the tuner pack as a trimmable chip resistor, thus, reducing the size of the tuner unit. (2) The adjustment could be done by laser cutting instead of manually or by robot. This would greatly speed up the adjustment process. (3). Laser function trimming could be done in the tuner pack assembly process all at once instead of a distributed in the radio equipment adjustment process. This would make the adjustment process unnecessary in the radio equipment assembly process, and this process could be eliminated. 3. Method Concerning the six items required to ad just using trimmer potentiometers in previous tuners, we checked the respective setting ranges. Then, the conditions of the trimmable chip resistors required to take their place were studied. The results of our study clarified the following points. (1) Resistance change ratio (2) Resolution : 0.2% or lower : 10 times or greater Next, to achieve trimming characteristics which rival the resistance change characte","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129236607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Tape Automated Bonding Packages: Electrical Considerations For High Frequency Applications","authors":"","doi":"10.1109/IEMT.1993.639798","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639798","url":null,"abstract":"The increase of the speed of communication integrated circuits requires high performance single chip packages. High frequency communications IC's use ECL like differential output gate structures and require specific packages with controlled impedance and very low attenuation. The TAB packages offer an attractive solution to the standard ceramic QFP in terms of electrical performances and cost. In this paper, we discuss the electrical considerations for high speed TAB single chip package design. The electrical performances of TAB and QFP packages are compared here.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121055697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Develop Of Thick Copper Film Metallized Alumina Substrate for Small Size, High Power, On-Board Power Supply","authors":"K. Tedoriya, A. Kanamaru, M. Mohri","doi":"10.1109/IEMT.1993.639354","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639354","url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121524577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}