Tape Automated Bonding Packages: Electrical Considerations For High Frequency Applications

Abstract

The increase of the speed of communication integrated circuits requires high performance single chip packages. High frequency communications IC's use ECL like differential output gate structures and require specific packages with controlled impedance and very low attenuation. The TAB packages offer an attractive solution to the standard ceramic QFP in terms of electrical performances and cost. In this paper, we discuss the electrical considerations for high speed TAB single chip package design. The electrical performances of TAB and QFP packages are compared here.