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Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639745
Y. Kojima, J. Sakiura, K. Matsunaga
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小间距Qfp焊点可靠性试验分析研究
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Proceedings of Japan International Electronic Manufacturing Technology Symposium
Proceedings of Japan International Electronic Manufacturing Technology Symposium
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