A Study Of Polyimide Adhesion To Epoxy Resjn In PFP Using Multivariate Analysis Of XPS Spectra

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639283

K. Takeuchi, K. Tsutsui, N. Miura

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Abstract

The adhesion between polyimide and mold resin is one of the key characteristics of packaging reliability in semiconductor device manufacturing. Poor adhesion causes sometimes reliability problems on plastic flat packaging (PFP) products. The requirements of adhesion enhancement and its evaluation will increase, accompanied with thinner and higher density packaging products. Polyimide adhesion to mold resin has been studied from a view point of surface treatment of passivation material. Polyimide surface, modified through various conditions was characterized by X-ray photoelectron spectroscopy (XPS), contact angle and adhesion strength. XPS spectra was curve fitted and classified by multivariate analysis. The result shows that XPS cubon peak pattems are classified between good and poor samples by two factors, which are the moisture absorption and the oxygen content (C=O bonding) in polyimide. The moisture is proportional to the contact angle of glycerin droplet on the surface. Oxygen content increases with the surface roughness by 4 plasma treatment. It indicates that the adhesion between polyimide and epoxy resin is related to both chemical and mechanical interactions of two materials. These factors are shown on the score plot by multivariate analysis.

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PFP中聚酰亚胺与环氧树脂黏附的多变量XPS光谱分析

在半导体器件制造中，聚酰亚胺与模具树脂之间的粘附性是影响封装可靠性的关键因素之一。粘合不良有时会导致塑料扁平包装(PFP)产品的可靠性问题。随着包装产品越来越薄、密度越来越高，对附着力增强及其评价的要求也越来越高。从钝化材料表面处理的角度研究了聚酰亚胺与模具树脂的粘附性。采用x射线光电子能谱(XPS)、接触角和粘附强度对改性后的聚酰亚胺表面进行了表征。对XPS光谱进行了曲线拟合和多变量分析。结果表明，用聚酰亚胺吸湿率和氧含量(C=O键合)两个因素对样品的XPS立方峰模式进行了区分。湿度与甘油液滴在表面的接触角成正比。氧含量随等离子体处理后表面粗糙度的增加而增加。结果表明，聚酰亚胺与环氧树脂之间的粘附与两种材料的化学和力学相互作用有关。这些因素通过多变量分析显示在计分图上。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of Japan International Electronic Manufacturing Technology Symposium

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