New Wave Soldering Machine For Zero Defect Soldering

Abstract

The newly developed soldering machine shown in Fig. 1 is characterized by new soldering process (3-wave 2-flux system) introduced to achieve no cleaning feature and improved soldering quality. Main new features of this soldering machine are 1st double swing wave, 2nd fluxer, PCB warp prevention robot and, Computer process control system. We conducted experiments and analysis of the process conditions in the new process using the Taguchi method and found the opti um soldering conditions for good products. We introduced a new process, new soldering system, and optimum soldering conditions into our newly developed soldering machine. At present, new soldering machines are operating satisfactorily in mass-product production PCBs. Thus, we were able to obtain the expectedresults, single ppm soldering for high dencity PCBs. 'f