Proceedings of Japan International Electronic Manufacturing Technology Symposium最新文献_第2页

Pin Brazing Technology For A High Performance Aluminum Nitride Package 高性能氮化铝封装的引脚钎焊技术

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639750

K. Iyogi, K. Yamakawa, K. Koiwa, T. Yasumoto, T. Matsuura, M. Endo, N. Iwase

引用次数: 0

Small-sized 10-gbit/s Optical Transmitter And Receiver Modules Including 8-bit Mux/demux Ics 小型10gbit /s光收发模块，包括8位Mux/demux ic

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639816

T. Umeda, K. Kaminishi, E. Takagi, J. Hanari, A. Tohdake, Y. Shizuki, K. Yoshihara, N. Shigeno, K. Chinen

引用次数: 0

Adaptlive Solder Paste Composites Smart Solder Pastes Adaptlive锡膏复合材料智能锡膏

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639344

C. Val, M. Leroy, H. Boulharts

{"title":"Adaptlive Solder Paste Composites Smart Solder Pastes","authors":"C. Val, M. Leroy, H. Boulharts","doi":"10.1109/IEMT.1993.639344","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639344","url":null,"abstract":"111 the ficld of surfacc mounting. thc nicchanical propcrtics of thc soldcr paste alloy pla! n fundan1cnlal rolc. In addition 10 cicctric conncction. the allo? also mcchanicalll sccurcs the component 10 thc interconnection mcdiuni It should also bc noted that Illcoretical approachcs for determining thermomcchanical constraints arc rcali~ed b? assuming that . (1) elastic constants do not v a n uith temperature due to the lack of data on how thesc constants vary with tempcraturc: and (2) thc materials arc assumed to behavc clastically. This I S substantiated bj the fact that solder joints start cracking when subjected to more than 1.000 rapid temperature qclings. This is tmc even when the packages and the substrate have the same mechanical properties (e.g.. ceramic chip carrier on alumina substrate). Moreover. Boeing demonstrated that thc cracking mechanism arose from the cxpansion of the solder in the Z-axis. As a result. France's Ministp of Research and Indusq funded a key study in 1989 covering this topic. In this paper. we present heretofore unpubltshed results on this study. In pan I. thc results obtained from thermomechanical measurements raken in the elastic and plastic domains on two alloys. Sn Pb and Sn Pb Ag. are discussed. In pan 11. the innovative part. focus is on the realization of a solder paste composite composed of a solder paste standard and inclusions such as nickel and nickel-coated graphite Properlies of the new solder composite alloy were measured on standard samples and are reponed here. The process is still not industrialized. Perspectives look good for realizing families of smart solder pastes tailored to specific applications primarily with the use of shape memory alloys (SMA) as inclusions.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127222555","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Optical Waveguide-to-photodiode Coupling Technique Using Total Internal Reflection Mirrors Fabricated In Polyimide Optical Waveguides 利用聚酰亚胺光波导制造全内反射镜的光波导-光电二极管耦合技术

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639764

S. Koike, N. Matsuura, H. Takahara

引用次数: 5

Single Point Outer Mad Bonding Technology For High Pin Count Ceramic PGA 高引脚数陶瓷PGA单点外疯狂键合技术

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639747

T. Ando, T. Tomioka, M. Nakazono, K. Atsumi, Y. Tane, J. Nakano, S. Hirata

{"title":"Single Point Outer Mad Bonding Technology For High Pin Count Ceramic PGA","authors":"T. Ando, T. Tomioka, M. Nakazono, K. Atsumi, Y. Tane, J. Nakano, S. Hirata","doi":"10.1109/IEMT.1993.639747","DOIUrl":"https://doi.org/10.1109/IEMT.1993.639747","url":null,"abstract":"A new ceramic pin grid array (PGA) package for industrial computers has been developed by applying tape automated bonding (TAB) technology to one of the largest (20 plpl square) and highest pin count (820pins) application specific integrated circuits (ASIC) available in the semiconductor industry. To fabricate this package, a series of TAB processes containing inner lead bonding (ILB), cutting and forming of TAB outer leads, solder sheet mounting, outer lead bonding (OLB). die attachment and lid sealing have been developed. The key to this assembly is that a single point bonding method at room temperature has been developed for fine pitch (90 pn pitch) interconnections between TAB outer leads and electrode pads on a wavy ceramic substrate. To realize single point TAB technology, the optimum design for a tape carrier and for electrode pad patterns on a ceramic substrate has been explored, a new bonding tool has been developed, and the optimum thickness of gold, plated on the electrode pads on the ceramic substrate, has been investigated. As a result of these investigations, outer lead bond strengths exceeding 30 gf, and bonding accuracy within kt10 p have been achieved. Degradation of bond strength by thermal cycle tests was not observed.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130273593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thin Film Tri-electrode Electroluminescent Display Device And The Effect Of Aging Process On Its Parameters 薄膜三电极电致发光显示器件及其老化过程对其参数的影响

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639368

Z. Porada

引用次数: 0

Package Deformation And Cracking Mechanism Due To Reflow Soldering 回流焊引起的封装变形和开裂机理

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639774

K. Sawada

引用次数: 28

Study On High Frequency Permeability Of Magnetic Multilayer Films 磁性多层膜高频磁导率的研究

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639751

M. Senda, O. Ishii

引用次数: 1

Zone-melting Recrystallization Of Si Films By Flat Gas Flame Heating 平板气体火焰加热下Si薄膜的区域熔化再结晶

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639325

Syungo Kanai, S. Futagi, M. Kugenuma, M. Takeuchi, A. Kitagawa, M. Suzuki, S. Takenaka

引用次数: 0

Photointerrupter Using Three-dimensional Molded Plastic Plated With Conductive Wiring 采用三维模压塑料镀导电线的光灭弧

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI: 10.1109/IEMT.1993.639813

N. Matsuoka, M. Kimoto, Yoshifumi Wada, T. Hanamoto, M. Nakamichi, S. Katoh

引用次数: 0