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Pin Brazing Technology For A High Performance Aluminum Nitride Package

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639750
K. Iyogi, K. Yamakawa, K. Koiwa, T. Yasumoto, T. Matsuura, M. Endo, N. Iwase
{"title":"Pin Brazing Technology For A High Performance Aluminum Nitride Package","authors":"K. Iyogi, K. Yamakawa, K. Koiwa, T. Yasumoto, T. Matsuura, M. Endo, N. Iwase","doi":"10.1109/IEMT.1993.639750","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.639750","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Proceedings of Japan International Electronic Manufacturing Technology Symposium
Proceedings of Japan International Electronic Manufacturing Technology Symposium
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