回流焊引起的封装变形和开裂机理

K. Sawada
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引用次数: 28

摘要

回流焊过程中塑料封装的开裂是影响塑料封装半导体器件可靠性的一个重要问题。本文介绍了树脂a的材料特性,即贮存相对湿度与饱和含水率之间的系数,给出了一种包装开裂估计的简化方法。对回流焊过程中封装膨胀过程进行了测量。通过计算拟合了各个过程,给出了包装开裂的精确机理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Package Deformation And Cracking Mechanism Due To Reflow Soldering
Plastic package cracking during reflow sol- dering is an important problem for the reliability of plas- tic encapsulated semiconductor devices. This paper describes a simplified method of package cracking esti- mation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture content. The consequent process of package expansion during reflow soldering was measured. The individual pro- cesses were fitted by calculation and provided a pre- cise mechanism of package cracking.
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