{"title":"回流焊引起的封装变形和开裂机理","authors":"K. Sawada","doi":"10.1109/IEMT.1993.639774","DOIUrl":null,"url":null,"abstract":"Plastic package cracking during reflow sol- dering is an important problem for the reliability of plas- tic encapsulated semiconductor devices. This paper describes a simplified method of package cracking esti- mation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture content. The consequent process of package expansion during reflow soldering was measured. The individual pro- cesses were fitted by calculation and provided a pre- cise mechanism of package cracking.","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"77 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":"{\"title\":\"Package Deformation And Cracking Mechanism Due To Reflow Soldering\",\"authors\":\"K. Sawada\",\"doi\":\"10.1109/IEMT.1993.639774\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Plastic package cracking during reflow sol- dering is an important problem for the reliability of plas- tic encapsulated semiconductor devices. This paper describes a simplified method of package cracking esti- mation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture content. The consequent process of package expansion during reflow soldering was measured. The individual pro- cesses were fitted by calculation and provided a pre- cise mechanism of package cracking.\",\"PeriodicalId\":170695,\"journal\":{\"name\":\"Proceedings of Japan International Electronic Manufacturing Technology Symposium\",\"volume\":\"77 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"28\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Japan International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.639774\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.639774","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Package Deformation And Cracking Mechanism Due To Reflow Soldering
Plastic package cracking during reflow sol- dering is an important problem for the reliability of plas- tic encapsulated semiconductor devices. This paper describes a simplified method of package cracking esti- mation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture content. The consequent process of package expansion during reflow soldering was measured. The individual pro- cesses were fitted by calculation and provided a pre- cise mechanism of package cracking.