Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards

Abstract

for 1993 Japan Internatlonal E l e c t r o n i c Manufacturing Technology Symposium Repair of Flip Chips (DCA) on Glass Epoxy P r i n t e d C i r c u i t Boards Denny Miller, Tom Gregorich, Hoang Hoang, Swee Mok Motorola Corpora te Manufacturing Xesearch C e n t e r Room 1014 1301 E a s t Algonquin Road Schaumburg, IL USA 60196 708-576-3234, 7 08-576-2111 (FAX) Direct Chip Attach (DCA) is becoming an attractive packaging alternative where one or more of the following factors are technology drivers: density, cost , functionality, quality, and assembly yield. While the technology has proven to be robust and reliable, the need f o r a repair process does e x i s t , particularly when multiple chips are attached on a single board. This paper describes a repair process for removing and replacing DCA devices on glass e p o x y substrates. Process parameters and reliability data of replaced devices will also be shown and discussed. 191 lgS3JapanhMEledronicsManutaduringTechndoeySymposium