{"title":"玻璃环氧印刷电路板上倒装芯片(dca)的修复","authors":"D. Miller, T. Gregorich, Iioang Hoang, S. Mok","doi":"10.1109/IEMT.1993.639749","DOIUrl":null,"url":null,"abstract":"for 1993 Japan Internatlonal E l e c t r o n i c Manufacturing Technology Symposium Repair of Flip Chips (DCA) on Glass Epoxy P r i n t e d C i r c u i t Boards Denny Miller, Tom Gregorich, Hoang Hoang, Swee Mok Motorola Corpora te Manufacturing Xesearch C e n t e r Room 1014 1301 E a s t Algonquin Road Schaumburg, IL USA 60196 708-576-3234, 7 08-576-2111 (FAX) Direct Chip Attach (DCA) is becoming an attractive packaging alternative where one or more of the following factors are technology drivers: density, cost , functionality, quality, and assembly yield. While the technology has proven to be robust and reliable, the need f o r a repair process does e x i s t , particularly when multiple chips are attached on a single board. This paper describes a repair process for removing and replacing DCA devices on glass e p o x y substrates. Process parameters and reliability data of replaced devices will also be shown and discussed. 191 lgS3JapanhMEledronicsManutaduringTechndoeySymposium","PeriodicalId":170695,"journal":{"name":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","volume":"54 11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards\",\"authors\":\"D. Miller, T. Gregorich, Iioang Hoang, S. Mok\",\"doi\":\"10.1109/IEMT.1993.639749\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"for 1993 Japan Internatlonal E l e c t r o n i c Manufacturing Technology Symposium Repair of Flip Chips (DCA) on Glass Epoxy P r i n t e d C i r c u i t Boards Denny Miller, Tom Gregorich, Hoang Hoang, Swee Mok Motorola Corpora te Manufacturing Xesearch C e n t e r Room 1014 1301 E a s t Algonquin Road Schaumburg, IL USA 60196 708-576-3234, 7 08-576-2111 (FAX) Direct Chip Attach (DCA) is becoming an attractive packaging alternative where one or more of the following factors are technology drivers: density, cost , functionality, quality, and assembly yield. While the technology has proven to be robust and reliable, the need f o r a repair process does e x i s t , particularly when multiple chips are attached on a single board. This paper describes a repair process for removing and replacing DCA devices on glass e p o x y substrates. Process parameters and reliability data of replaced devices will also be shown and discussed. 191 lgS3JapanhMEledronicsManutaduringTechndoeySymposium\",\"PeriodicalId\":170695,\"journal\":{\"name\":\"Proceedings of Japan International Electronic Manufacturing Technology Symposium\",\"volume\":\"54 11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Japan International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.639749\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Japan International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.639749","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
1993年日本国际电子工程技术研讨会上，在玻璃环氧树脂P上翻转芯片(DCA)的修复，在玻璃环氧树脂P上的制造技术研讨会上，Denny Miller, Tom Gregorich, Hoang Hoang, Swee Mok，在摩托罗拉公司制造研究中心，在1014 1301 E室，在Algonquin路，Schaumburg, IL 60196 708-576-3234。直接芯片连接(DCA)正在成为一种有吸引力的封装替代方案，其中以下一个或多个因素是技术驱动因素:密度、成本、功能、质量和组装良率。虽然该技术已被证明是强大而可靠的，但维修过程的需求确实很低，特别是当多个芯片连接在一块电路板上时。本文介绍了一种拆卸和更换玻璃基板上DCA器件的修复工艺。还将展示和讨论更换设备的工艺参数和可靠性数据。191年lgS3JapanhMEledronicsManutaduringTechndoeySymposium
Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards
for 1993 Japan Internatlonal E l e c t r o n i c Manufacturing Technology Symposium Repair of Flip Chips (DCA) on Glass Epoxy P r i n t e d C i r c u i t Boards Denny Miller, Tom Gregorich, Hoang Hoang, Swee Mok Motorola Corpora te Manufacturing Xesearch C e n t e r Room 1014 1301 E a s t Algonquin Road Schaumburg, IL USA 60196 708-576-3234, 7 08-576-2111 (FAX) Direct Chip Attach (DCA) is becoming an attractive packaging alternative where one or more of the following factors are technology drivers: density, cost , functionality, quality, and assembly yield. While the technology has proven to be robust and reliable, the need f o r a repair process does e x i s t , particularly when multiple chips are attached on a single board. This paper describes a repair process for removing and replacing DCA devices on glass e p o x y substrates. Process parameters and reliability data of replaced devices will also be shown and discussed. 191 lgS3JapanhMEledronicsManutaduringTechndoeySymposium
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
