Journal of Micromechanics and Microengineering最新文献

{"title":"Sub-miniature rolling thrust micro-bearing","authors":"Marcin Michałowski, Zbigniew Kusznierewicz, Sergiusz Łuczak, Artur Chańko, Mateusz Samsel, Paweł Pieńczuk","doi":"10.1088/1361-6439/ad31b9","DOIUrl":"https://doi.org/10.1088/1361-6439/ad31b9","url":null,"abstract":"The original design of the smallest two-way rolling thrust micro-bearing with sub-millimeter dimensions is presented. The bearing is self-contained and is capable of transmitting thrust load up to about 8 N in two directions, as well as radial loads up to about 0.4 N. Thanks to special design of the raceways, operation without lubrication is possible. The scope of experimental study is discussed, and preliminary experimental results are reported. Ways of further miniaturization are suggested.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"192 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140314026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Wafer-scale silicon microfabrication technology toward realization of low-cost sub-THz waveguide devices","authors":"Xinghai Zhao, Peng Wu, Fei Liu","doi":"10.1088/1361-6439/ad2aee","DOIUrl":"https://doi.org/10.1088/1361-6439/ad2aee","url":null,"abstract":"This paper presents a wafer-scale silicon microfabrication technology for the sub-terahertz (sub-THz) waveguide device mass production. Based on the effective scheme, a WR-5 (140–220 GHz) straight rectangular waveguide and a WR-2.8 (260–400 GHz) rectangular waveguide bandpass filter are implemented as demonstrated examples. The silicon deep reactive ion etching (DRIE) process is employed to etch through the total thickness of the silicon wafer and form the main waveguide channels. Then, a low-temperature thermal compression process is used to bond the trough-etched wafer with the top and bottom metallised silicon wafers to form the closed waveguide structures without any precise alignment process. The fabricated waveguide has the benefit of low transmission loss (0.03–0.05 dB mm⁻¹) at the whole G band. Besides, to measure the fabricated WR-2.8 waveguide filter and solve the measuring equipment standard waveguide difference, silicon micromachined waveguide transitions are explored and fabricated to match two different frequency-band modules for measuring the waveguide filters in the desired full frequency band, which also has a potential application for the different size waveguide conversion. The measured results agree well with the simulated ones. The measured 3 dB bandwidth is 9.3%, with a central frequency of 343 GHz; the average insertion loss (IL) is about 1.6 dB in the pass band, including two extra straight waveguides of 8 mm length on input/output ends and two external waveguide-to-waveguide transitions. The proposed method provides a feasible and cost-effective solution for the mass production of high-performance waveguide devices and integrated systems in sub-THz frequency bands and beyond.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"158 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140314013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Innovating in-situ characterization: a comprehensive measurement system for measuring the ZT and the contact resistance of vertical thermolegs exploiting the vertical transfer length method","authors":"Negin Sherkat, Athira Kattiparambil Sivaprasad, Uwe Pelz, Peter Woias","doi":"10.1088/1361-6439/ad2d65","DOIUrl":"https://doi.org/10.1088/1361-6439/ad2d65","url":null,"abstract":"In order to optimize their system design and manufacturing processes, it is crucial to undertake a thorough electrical and thermal characterization of micro thermoelectric generators (<italic toggle=\"yes\">µ</italic>TEGs). To address this need, a highly advanced and fully integrated <italic toggle=\"yes\">in-situ</italic> measurement system has been developed. The main objectives of this system are to (1) enable the measurement of ZT and thereby of all thermoelectric (TE) properties of thermolegs made from powder-based TE materials and (2) at the same time accurately measure the contact resistance between the TE material and the electrical contacts. The <italic toggle=\"yes\">µ</italic>TEG fabrication concept used in this study is based on copper-cladded printed circuit board (PCB) material as a substrate, using the Cu layers for easy contact formation. In a first step, an innovative measurement concept, based on a distinctive vertical rendition of the well-established transfer length method, has been realized, allowing for the <italic toggle=\"yes\">in-situ</italic> measurement of contact resistance between the TE material and the copper conductors on the PCB substrate. This enables a comprehensive assessment of the impact exerted by the applied force and temperature during e.g. a hot-pressing step for compacting the powder-based thermolegs during the manufacturing process. In a second step, a comprehensive measurement platform, referred to as the ZT-Card, has been devised to facilitate the evaluation of all relevant TE material properties—Seebeck voltage, electrical conductivity and thermal conductivity (all measured in vertical cross-plane orientation)—inherent to a highly miniaturized thermoleg. Additionally, the ZT-Card also allows for the assessment of contact resistance between the copper contacts and the TE material. Successful testing of this measurement system inspires confidence in the capabilities of the platform and will aid in future <italic toggle=\"yes\">µ</italic>TEG development.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"8 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-03-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140313926","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design and fabrication of a sensors-integrated silicon electrode for gap status monitoring in micro electrochemical machining","authors":"Yulan Zhu, Guodong Liu, Yong Li, Hao Tong","doi":"10.1088/1361-6439/ad2c1f","DOIUrl":"https://doi.org/10.1088/1361-6439/ad2c1f","url":null,"abstract":"The monitoring of micro machining gap and the control of machining status within the gap have become bottlenecks in the research and development of micro electrochemical machining (ECM). General electrical signals are difficult to reflect the status of micro machining gap. Electrolytic products in micro machining gap are prone to precipitation and retention, leading to unstable material removal process. Micro ECM urgently requires gap status monitoring and feedback control. To realize gap status monitoring, a sensors-integrated silicon electrode, with a micro temperature sensor and a micro conductivity sensor on the silicon electrode near-front sidewall, is proposed innovatively in this study. Based on bulk silicon process and electroplating process, sensors-integrated silicon electrodes are designed and fabricated. Based on the signal processing system built for the temperature and conductivity sensor, the temperature and conductivity detection functions are verified and the sensors are calibrated. Micro ECM experiments with sensors-integrated silicon electrodes are carried out and micro holes with 200 <italic toggle=\"yes\">μ</italic>m depth are machined. For the conductivity sensor on the sensors-integrated silicon electrode, due to the affection of electrolytic environment, the function surface is contaminated and damaged, and the structural design needs to be further improved. For the temperature sensor, it is not affected by the electrolytic environment due to insulation-film’s protection, and reliable temperature monitoring is achieved in micro ECM. The detection results indicate that the temperature inside the machining gap has increased by 20 °C due to the electrochemical thermal effect and resistance thermal effect in micro ECM, and the temperature shows an increasing trend while machining depth increasing. The feasibility of process monitoring with sensors-integrated silicon electrode in micro ECM is preliminarily verified.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"87 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-03-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140314015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Computational modelling and experimental investigation of micro-electrochemical discharge machining by controlling the electrolyte temperature","authors":"Dil Bahar, Akshay Dvivedi, Pradeep Kumar","doi":"10.1088/1361-6439/ad2089","DOIUrl":"https://doi.org/10.1088/1361-6439/ad2089","url":null,"abstract":"Glass vias are emerging as a favourable option for radiofrequency-based micro-electromechanical system packaging. For the micromachining of glass, electrochemical discharge machining (ECDM) could be the most suitable technique if issues pertaining to the process stability are addressed thoroughly. The electrolyte temperature has immense influence on the viscosity and conductivity of the electrolyte, which percolate the stability of the ECDM process. Therefore, this article investigates the effects of the electrolyte temperature and applied voltage on the performance characteristics of ECDM for the micromachining of borosilicate glass. The machining rate (MR) and hole overcut (HOC) of the machined microholes are considered as performance characteristics. A 3D thermal-based finite element model (FEM) was developed for the thermal analysis in the machining zone. In the thermal analysis, the heat flux by thermal discharge was assumed to have Gaussian distribution, and accordingly, temperature profiles in the thermal zone were analyzed by controlling the electrolyte temperature and voltage at various levels. Further processing of temperature profiles in the thermal zone was utilized in the estimation of MR and HOC. Electrostatic-based FEM was utilized to assess the intensity of the electric field in the proximity of the tool electrode to analyze the probable locations of thermal discharge and its impact on the geometrical characteristics of the machined microholes. The simulation outcomes were validated experimentally, and show good agreement. A field emission electron microscope with energy dispersive spectroscopy was used for the characterization of the machined surface to observe the effect of the electrolyte temperature.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"1 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139765751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Highly sensitive flexible capacitive pressure sensor with structured elastomeric dielectric layers","authors":"Gaurav Rawal, Animangsu Ghatak","doi":"10.1088/1361-6439/ad1e35","DOIUrl":"https://doi.org/10.1088/1361-6439/ad1e35","url":null,"abstract":"Sensitive yet stable, robust yet flexible and accurate yet energy efficient pressure sensors are required for variety of purposes. While a large variety of designs and dielectric materials have been explored for this purpose, there is still need of a flexible pressure sensor that will allow easy scale up and inexpensive fabrication. To this end, we have presented here the design of a flexible capacitive pressure sensor using copper coated paper as flexible electrodes and soft Ecoflex layers decorated with cylindrical micro-pillars as the dielectric. While microscopic construct of the sensor allows its easy manufacturability, softness of the layer imparts sensitivity to it. In contrast to many conventional sensors, this design yields sensitivity as high as ∼5 kPa⁻¹ at pressure &lt;1 kPa and somewhat smaller sensitivity as pressure exceeds 1 kPa. We have varied systematically pillar diameter, skin thickness of dielectric layer and pitch of the pillar array to optimise the design and demonstrate its easy tunability. We have presented a model based on buckling of the pillars to predict the response of the sensor. We have explored also a specific design that minimises the hysteresis.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"64 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-01-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139765763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Fabrication of high-aspect-ratio metallic microstructures by microelectroforming using silver-coated polydimethylsiloxane molds with controllable wettability","authors":"Bo Zhou, Longfei Xie, Tingli Wang, Bo Su, Junhu Meng","doi":"10.1088/1361-6439/ad1c72","DOIUrl":"https://doi.org/10.1088/1361-6439/ad1c72","url":null,"abstract":"\u0000 Microelectroforming is a specialized electroplating process to prepare functional metallic microstructures. However, the formability of microelectroforming is usually restricted by the limited mass transfer in high-aspect-ratio microcavities of molds. This paper presents a simple and reliable method utilizing silver (Ag)-coated polydimethylsiloxane (PDMS) molds with controllable wettability to enhance the formability of microelectroforming. The surfaces of these molds exhibited reversible water contact angles ranging from 4° to 151° realized through ultraviolet irradiation and heat treatment. The hydrophilicity of the PDMS molds facilitated liquid-phase mass transfer, contributing to the fabrication of complete and defect-free nickel microstructures with high aspect ratios. Subsequently, the hydrophobic PDMS molds reduced the interfacial adhesion between these molds and nickel microstructures, which was beneficial for perfect demolding. Nickel microstructures with an aspect ratio of 10 can be achieved by using the PDMS molds, which significantly enhance the formability of microelectroforming. This method provides a potential method to prepare high-aspect-ratio metallic microstructures.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"32 22","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139442775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Artificial swim by undulating rigid flagellum with joint controllers","authors":"Ryosuke Yano, H. Kuroda","doi":"10.1088/1361-6439/ad1c73","DOIUrl":"https://doi.org/10.1088/1361-6439/ad1c73","url":null,"abstract":"\u0000 In this paper, we investigate locomotion of the artificial (robotic) swimmer by the undulating rigid flagellum, whose joins are controlled by actuators. The locomotion of the swimmer with the undulating rigid flagellum inside the two dimensional channel sandwiched by two non-slip walls is numerically analyzed using the immersed boundary Lattice Boltzmann method (IB-LBM). In order to calculate the flow field under the high Reynolds number, multi-relaxation-time (MRT) scheme is applied. Our numerical results show that the optimal Reynolds number exits to maximize locomotion distance, whereas the direction of locomotion can be reversed in the low and high Reynolds number limits.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"110 10","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139444512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental study on femtosecond laser ablation of 4H-SiC substrate","authors":"Ziqiang Zhao, Lin Zhao, Yun Peng","doi":"10.1088/1361-6439/ad1c74","DOIUrl":"https://doi.org/10.1088/1361-6439/ad1c74","url":null,"abstract":"\u0000 Data Access Statement: Research data supporting this publication are available from the NN repository at located at www.NNN.org/download/. Silicon carbide (SiC) is an ideal substrate for manufacturing high-power electronic devices and microwave devices, and has broad application prospects. The surface treatment of SiC wafers plays a critical role and faces challenges in the semiconductor industry. Among the multiple treatment methods, the laser-based method has gradually attracted the attention of scholars. Therefore, this research uses a femtosecond laser to ablate 4H-SiC sliced wafers and analyzes the influence of key parameters, such as laser pulse energy, defocus amount, repetition frequency, and scanning intervals, on the laser ablation depth, width, and surface morphology. Scanning electron microscopy (SEM) and laser coherence-focused microscopy were used to characterize the laser ablation surface. The results show that under a defocus amount of +6 mm, a laser pulse energy of 87.5 μJ, scanning speed of 500 mm/s, and pulse frequency of 300 kHz. The results show that the optimized surface roughness (Sa) was 0.267μm, and brittle fracture areas such as microcracks and pits on the original surface were removed. Effective removal facilitates further material surface processing, which provides valuable insights for similar researchers and benefits for the semiconductor industry. Ethical Compliance: All procedures performed in studies involving human participants were in accordance with the ethical standards of the institutional and/or national research committee and with the 1964 Helsinki Declaration and its later amendments or comparable ethical standards.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"52 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139444891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A liquid-metal-based microscale calorimetric in-chip flow sensor for flow rate measuring","authors":"Yuqin Deng, Zi Ye, Zhongshan Deng, Jie Hong, Huimin Zhang, Lin Gui","doi":"10.1088/1361-6439/ad1c75","DOIUrl":"https://doi.org/10.1088/1361-6439/ad1c75","url":null,"abstract":"\u0000 This work proposes a liquid-metal-based calorimetric micro-flow sensor within a polydimethylsiloxane (PDMS) chip. It can measure the flow rate of fluid in microscale channels, with a range as low as several microliters per minute. This in-chip sensor is proposed to solve the issue of detecting the flow rate in microfluidic systems. To make the sensor compatible with PDMS microfluidic chips, low-melting-point gallium-based alloy and bismuth-based (bi-based) alloy are used to make the micro heater and bi-metal thermocouples, for these alloys can be easily injected into a PDMS chip to form electrodes. To minimize heat resistance (or temperature difference) between fluid and the detecting ends of thermocouples, these ends are directly exposed to liquid in the flow channel with the help of a special reversible bonding technology. Thermocouples are connected in parallel to improve the sensor’s response. A novel method to bond and electrically connect the sensor to a PCB (print circuit board) is also elaborated. Since the calorimetric flow sensor is sensitive to heating power, fluid temperature and environment cooling, a dimensionless parameter less independent of these factors is deduced from heat transfer theory, and this idea is used in result processing to offset the bad effect. Experiments with pure water show that this sensor can be used to detect flow rates, with a resolution up to 4 µl/min/mV and a range of 12 µl/min in this case, and that at different heating powers, the thermal potential results vary significantly whereas the dimensionless results nearly keep the same. Present work indicates that this sensor has the potential to be integrated into a PDMS microfluidic system and to provide accurate and stable results if a dimensionless method is used in data processing.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"20 25","pages":""},"PeriodicalIF":2.3,"publicationDate":"2024-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139443298","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}