使用具有可控润湿性的银涂层聚二甲基硅氧烷模具,通过微电铸制造高宽比金属微结构

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Bo Zhou, Longfei Xie, Tingli Wang, Bo Su, Junhu Meng
{"title":"使用具有可控润湿性的银涂层聚二甲基硅氧烷模具,通过微电铸制造高宽比金属微结构","authors":"Bo Zhou, Longfei Xie, Tingli Wang, Bo Su, Junhu Meng","doi":"10.1088/1361-6439/ad1c72","DOIUrl":null,"url":null,"abstract":"\n Microelectroforming is a specialized electroplating process to prepare functional metallic microstructures. However, the formability of microelectroforming is usually restricted by the limited mass transfer in high-aspect-ratio microcavities of molds. This paper presents a simple and reliable method utilizing silver (Ag)-coated polydimethylsiloxane (PDMS) molds with controllable wettability to enhance the formability of microelectroforming. The surfaces of these molds exhibited reversible water contact angles ranging from 4° to 151° realized through ultraviolet irradiation and heat treatment. The hydrophilicity of the PDMS molds facilitated liquid-phase mass transfer, contributing to the fabrication of complete and defect-free nickel microstructures with high aspect ratios. Subsequently, the hydrophobic PDMS molds reduced the interfacial adhesion between these molds and nickel microstructures, which was beneficial for perfect demolding. Nickel microstructures with an aspect ratio of 10 can be achieved by using the PDMS molds, which significantly enhance the formability of microelectroforming. This method provides a potential method to prepare high-aspect-ratio metallic microstructures.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":null,"pages":null},"PeriodicalIF":2.4000,"publicationDate":"2024-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of high-aspect-ratio metallic microstructures by microelectroforming using silver-coated polydimethylsiloxane molds with controllable wettability\",\"authors\":\"Bo Zhou, Longfei Xie, Tingli Wang, Bo Su, Junhu Meng\",\"doi\":\"10.1088/1361-6439/ad1c72\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Microelectroforming is a specialized electroplating process to prepare functional metallic microstructures. However, the formability of microelectroforming is usually restricted by the limited mass transfer in high-aspect-ratio microcavities of molds. This paper presents a simple and reliable method utilizing silver (Ag)-coated polydimethylsiloxane (PDMS) molds with controllable wettability to enhance the formability of microelectroforming. The surfaces of these molds exhibited reversible water contact angles ranging from 4° to 151° realized through ultraviolet irradiation and heat treatment. The hydrophilicity of the PDMS molds facilitated liquid-phase mass transfer, contributing to the fabrication of complete and defect-free nickel microstructures with high aspect ratios. Subsequently, the hydrophobic PDMS molds reduced the interfacial adhesion between these molds and nickel microstructures, which was beneficial for perfect demolding. Nickel microstructures with an aspect ratio of 10 can be achieved by using the PDMS molds, which significantly enhance the formability of microelectroforming. This method provides a potential method to prepare high-aspect-ratio metallic microstructures.\",\"PeriodicalId\":16346,\"journal\":{\"name\":\"Journal of Micromechanics and Microengineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2024-01-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Micromechanics and Microengineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1088/1361-6439/ad1c72\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad1c72","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

微电铸是一种制备功能性金属微结构的专业电镀工艺。然而,微电铸的成型性通常受到模具高宽比微腔中有限传质的限制。本文提出了一种简单可靠的方法,利用具有可控润湿性的银涂层聚二甲基硅氧烷(PDMS)模具来提高微电铸的成型性。通过紫外线照射和热处理,这些模具的表面呈现出从 4° 到 151° 的可逆水接触角。PDMS 模具的亲水性促进了液相传质,有助于制造出完整无缺陷的高纵横比镍微结构。随后,疏水性 PDMS 模具降低了这些模具与镍微结构之间的界面粘附力,有利于完美脱模。使用 PDMS 模具可以获得纵横比为 10 的镍微结构,从而显著提高了微电铸的成型性。这种方法为制备高纵横比金属微结构提供了一种潜在的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of high-aspect-ratio metallic microstructures by microelectroforming using silver-coated polydimethylsiloxane molds with controllable wettability
Microelectroforming is a specialized electroplating process to prepare functional metallic microstructures. However, the formability of microelectroforming is usually restricted by the limited mass transfer in high-aspect-ratio microcavities of molds. This paper presents a simple and reliable method utilizing silver (Ag)-coated polydimethylsiloxane (PDMS) molds with controllable wettability to enhance the formability of microelectroforming. The surfaces of these molds exhibited reversible water contact angles ranging from 4° to 151° realized through ultraviolet irradiation and heat treatment. The hydrophilicity of the PDMS molds facilitated liquid-phase mass transfer, contributing to the fabrication of complete and defect-free nickel microstructures with high aspect ratios. Subsequently, the hydrophobic PDMS molds reduced the interfacial adhesion between these molds and nickel microstructures, which was beneficial for perfect demolding. Nickel microstructures with an aspect ratio of 10 can be achieved by using the PDMS molds, which significantly enhance the formability of microelectroforming. This method provides a potential method to prepare high-aspect-ratio metallic microstructures.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信