Innovating in-situ characterization: a comprehensive measurement system for measuring the ZT and the contact resistance of vertical thermolegs exploiting the vertical transfer length method

IF 2.4 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Micromechanics and Microengineering Pub Date : 2024-03-08 DOI:10.1088/1361-6439/ad2d65

Negin Sherkat, Athira Kattiparambil Sivaprasad, Uwe Pelz, Peter Woias

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引用次数: 0

Abstract

In order to optimize their system design and manufacturing processes, it is crucial to undertake a thorough electrical and thermal characterization of micro thermoelectric generators (µTEGs). To address this need, a highly advanced and fully integrated in-situ measurement system has been developed. The main objectives of this system are to (1) enable the measurement of ZT and thereby of all thermoelectric (TE) properties of thermolegs made from powder-based TE materials and (2) at the same time accurately measure the contact resistance between the TE material and the electrical contacts. The µTEG fabrication concept used in this study is based on copper-cladded printed circuit board (PCB) material as a substrate, using the Cu layers for easy contact formation. In a first step, an innovative measurement concept, based on a distinctive vertical rendition of the well-established transfer length method, has been realized, allowing for the in-situ measurement of contact resistance between the TE material and the copper conductors on the PCB substrate. This enables a comprehensive assessment of the impact exerted by the applied force and temperature during e.g. a hot-pressing step for compacting the powder-based thermolegs during the manufacturing process. In a second step, a comprehensive measurement platform, referred to as the ZT-Card, has been devised to facilitate the evaluation of all relevant TE material properties—Seebeck voltage, electrical conductivity and thermal conductivity (all measured in vertical cross-plane orientation)—inherent to a highly miniaturized thermoleg. Additionally, the ZT-Card also allows for the assessment of contact resistance between the copper contacts and the TE material. Successful testing of this measurement system inspires confidence in the capabilities of the platform and will aid in future µTEG development.

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创新原位表征：利用垂直传递长度法测量垂直热电偶 ZT 和接触电阻的综合测量系统

为了优化系统设计和制造工艺，对微型热电发电机（µTEG）进行全面的电学和热学表征至关重要。为了满足这一需求，我们开发了一套高度先进的全集成原位测量系统。该系统的主要目标是：(1) 能够测量 ZT，从而测量由粉末状 TE 材料制成的热电极的所有热电 (TE) 特性；(2) 同时精确测量 TE 材料与电触点之间的接触电阻。本研究中使用的 µTEG 制作概念是以覆铜印刷电路板 (PCB) 材料为基底，利用铜层便于形成接触。第一步，基于成熟的转移长度法的独特垂直演绎，实现了一种创新的测量概念，允许原位测量 TE 材料与 PCB 基底上铜导体之间的接触电阻。这样就可以全面评估在制造过程中，例如在压实粉末热靴的热压步骤中，外力和温度所产生的影响。在第二步中，我们设计了一个称为 ZT-Card 的综合测量平台，以方便评估高度微型化热电偶固有的所有相关 TE 材料特性--塞贝克电压、电导率和热导率（均以垂直交叉面方向测量）。此外，ZT-Card 还可以评估铜触点与 TE 材料之间的接触电阻。该测量系统的成功测试增强了人们对该平台能力的信心，并将有助于未来 µTEG 的开发。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Micromechanics and Microengineering 工程技术-材料科学：综合

CiteScore

4.50

自引率

4.30%

发文量

136

审稿时长

2.8 months

期刊介绍： Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.